Bits + chips
IC substrate makers to gain from AiP modules for Apple 5G devices
Jay Liu, Taipei; Willis Ke, DIGITIMES

Taiwan-based IC substrates suppliers are poised to benefit from Apple's move to adopt both TSMC's InFO_AiP (antenna in package) technology and ASE's FC_AiP process to package its mmWave antennas for 5G iPhones and 5G iPads set for launch in the second...

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