IT + CE
Intel to intro innovative thermal design for notebooks
Aaron Lee, Taipei; Joseph Tsai, DIGITIMES

At the upcoming CES 2020, Intel is planning to announce a new thermal module design that is able to enhance notebooks' heat dissipation by 25-30% with many brands also set to showcase products using the innovation during the show, according to sources...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.