Zhen Ding to build capacity for SiP, AiP substrates

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Zhen Ding to build capacity for SiP, AiP substrates

Jay Liu, Taipei; Willis Ke, DIGITIMES

Wednesday 11 December 2019

Taiwan-based PCB specialist Zhen Ding Technology has decided to enforce a capital increment of US$50 million at its second IC substrate subsidiary to build new capacity for advanced substrates for application to 5G handsets and wearable devices.

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