Bits + chips
SiP, AiP processes to gain momentum for 5G applications in 2020
Julian Ho, Taipei; Willis Ke, DIGITIMES

System-in-package (SiP) will gain significant growth momentum in 2020 as it will be badly needed to process wireless connectivity devices including RF front-end modules, antenna modules and power amplifiers for 5G applications. And ASE Technology Holding...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.