Bits + chips
Two PCB makers expected to share bulk of SLP orders for next iPhone
Jay Liu, Taipei; Willis Ke, DIGITIMES

Taiwanese PCB maker Zhen Ding Technology (ZDT) and Austrian peer AT&S are expected to together land at least 50-60% of substrate-like PCB orders for Apple's next iPhones to be launched in 2020, according to industry sources.

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