Kinsus, Nan Ya reportedly among SiP substrate suppliers for new AirPods

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Kinsus, Nan Ya reportedly among SiP substrate suppliers for new AirPods

Jay Liu, Taipei; Willis Ke, DIGITIMES

Wednesday 30 October 2019

Taiwan's Kinsus Interconnect Technology and Nan Ya PCB are both reportedly among SiP (system in package) substrate suppliers for Apple's just-unveiled AirPods Pro series, which adopt SiP design to integrated related chip components to support new functions...

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