Bits + chips
COF packaging demand for OLED DDI chips to grow sharply in 2020
Julian Ho, Taipei; Willis Ke, DIGITIMES

COF substrate makers and related packaging houses are expected to operate at full capacity through the end of 2019 on robust demand from smartphone vendors, and their revenues may be further driven by explosive demand for OLED DDI (display driver IC)...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.