VPEC enjoys robust demand for VCSEL components

Taipei, Saturday, September 26, 2020 10:40 (GMT+8),

24°C

中文繁體 | 簡體

We have recently changed our search engine. Check the Advanced options to learn the new search rules.

Disconnected ICT Supply Chains: New Power Plays Unfolding

Bits + chips

VPEC enjoys robust demand for VCSEL components

Julian Ho, Taipei; Jessie Shen, DIGITIMES

Thursday 8 August 2019

Epitaxial wafer supplier Visual Photonics Epitaxy Company (VPEC) has enjoyed a ramp-up in demand for vertical-cavity surface-emitting laser (VCSEL) components for use in smartphones and other mobile devices, and will see revenues generated from orders...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.

Related stories

Skyworks sees operations hit by outbreak (Apr 28)
Win Semi, VPEC poised to embrace robust 1Q20 (Jan 7)
Compound semi suppliers set for capacity ramps to meet risng RF, PA demand (Dec 20)
GaAs firms to thrive on robust VCSEL, PA, RF demand (Oct 4, 2019)
Win Semi August revenues hit record for 2nd straight month (Sep 6, 2019)
AMS positive about demand from 3 major upgrades in smartphones in 2019 (Aug 27, 2019)
Win Semi, Xintec and ShunSin ramping up shipments for 3D sensing components (Aug 16, 2019)
Apple may adopt ToF camera VCSEL for iPhones in 2020, say sources (Jul 17, 2019)
VPEC ramps up shipments of VCSEL devices for handset applications (Jul 11, 2019)
Taiwan chipmakers gearing up for 3D sensor market boom (Jul 9, 2019)
VPEC ramping up VCSEL wafer production (Jun 13, 2019)
Shipments of 3D sensing-enabled Android smartphones to boom, says Digitimes Research (Feb 13, 2019)
VPEC reportedly enters supply chain for Samsung mobile devices (Feb 13, 2019)

Latest Digitimes news

Asustek smartphone sales gaining momentum
IC substrate makers not to gain much from Intel, AMD resuming shipments to Huawei
AI and 5G to drive memory market growth over next decade, says Micron
ASE set to volume produce chip-last FOCoS process in 2021
TSMC to open new packaging fabs in 2021-22 using 3D Fabric platform
TSMC may expand factory site in central Taiwan for 2nm process, says chairman
Corning teams up with startups for AI-centric inspection solutions
Sercomm gains FCC validation for 5G mmWave small cells
Acer eyeing bigger presence in non-PC field
FET eyeing 5G vertical application services

Around the web

EU launches investigation into Chinese optical fibre cable imports (Sep 24) - Reuters
Samsung signs up Verizon as first customer for indoor 5G gear (Sep 24) - Reuters
Amazon announces new Fire TV devices and a brand-new home screen that makes it easier to find stuff to watch (Sep 24) - CNBC
Amazon's newest Ring device is a flying security camera drone (Sep 24) - CNBC
Electric vehicle charging network ChargePoint to go public at $2.4 billion valuation (Sep 24) - Reuters
The EU announces its first ever plan to regulate cryptocurrencies (Sep 24) - CNBC
Trump: Major carmakers sue US government over China tax (Sep 24) - BBC News
Samsung brings FDA-approved ECG monitoring to the Galaxy Watch 3 (Sep 23) - Digital Trends

Global mobile device shipment forecasts, 2020 and beyond

© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.

Members only