Bits + chips
Highlights of the day: DRAM advancement
Rodney Chan, DIGITIMES, Taipei

Despite the prospect of the US-China trade tensions further driving down DRAM pricing in the second half of the year, vendors continue to advance their technology for the memory. On another front in the semiconductor sector, the trade war is not deterring passive components makers from going ahead with their production capacity expansion plans, although they are now slowing down the pace a little. For Walsin Technology, the passive component market's long-term outlook remains promising.

DRAM vendors gearing up for transition to EUV process: Samsung Electronics plans to enter volume production of DRAM chips built using 1znm process incorporating extreme ultraviolet (EUV) lithography technology later in 2019, with SK Hynix and Micron Technology looking to follow suit introducing their EUV-based 1znm node process, according to industry sources.

Passive component firms slow down capacity expansion: Several passive component companies have pushed back the schedule to install new equipment and facilities for additional production capacities, judging from a number of macro factors creating uncertainty on the demand side, according to industry sources.

Passive component firm Walsin cautious about 3Q19: MLCC and chip resistor supplier Walsin Technology will carry on its capacity expansion project in Taiwan, but is cautious about its performance in the third quarter, according to company chairman Chiao Yu-heng.

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