Chipbond to land COF packaging orders for 2019 LCD iPhone, say sources

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Chipbond to land COF packaging orders for 2019 LCD iPhone, say sources

Julian Ho, Taipei; Steve Shen, DIGITIMES

Thursday 11 April 2019

Driver-IC backend firm Chipbond Technology is set to land COF packaging orders from Apple for a LCD-based iPhone device to be launched in 2019, allowing it to continue enjoying brisk sales in the second quarter, according to industry sources.

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