TSMC to move 7nm EUV process to volume production in March
Monica Chen, Hsinchu; Jessie Shen, DIGITIMES
Taiwan Semiconductor Manufacturing Company (TSMC) is expected to kick off volume production of chips built using an enhanced 7nm with EUV node at the end of March, according to industry sources.
The article you are trying to open requires News database subscription. Please sign in if you wish to continue.