Bits + chips
2018 review and 2019 outlook: Heterogeneous chips integration spurs demand for system-3D backend solutions
Julian Ho, Taipei; Willis Ke, DIGITIMES

Heterogeneous integration of diverse semiconductor components to support 5G, AI, automotive electronics, and IoT applications is gaining significant momentum, driving demand for SiP and So3D (system on 3D package) processes and boosting the importance...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.