中文網
Taipei
Sun, Jul 3, 2022
05:04
mostly cloudy
26°C
CONNECT WITH US

Globalfoundries demos 2.5D HBM solution

Jessie Shen, DIGITIMES, Taipei 0

Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits (ASICs).

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories