Advanced semiconductor packaging drives materials consumption through 2019, says SEMI
Press release; Jessie Shen, DIGITIMES
The US$18 billion semiconductor packaging materials will undergo steady single-digit unit volume growth for many material segments through 2019, including laminate substrates, IC leadframes, underfill, and copper wire, according to SEMI. Segments such...
The article you are trying to open requires News database subscription. Please sign in if you wish to continue.