Bits + chips
Samsung mass producing high-density ePoP memory for Smartphones
Press release; Jessie Shen, DIGITIMES

Samsung Electronics has announced that the company is mass producing ePoP (embedded package on package) memory, a single memory package consisting of 3GB LPDDR3 DRAM, 32GB eMMC and a controller. For use in high-end smartphones, the extremely-thin ePoP...

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