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Semiconductor packaging materials market to approach US$21 billion by 2017, says SEMI
Press release; Jessie Shen, DIGITIMES
The market for semiconductor packaging materials, including thermal interface materials, is expected to maintain its US$20 billion value through 2017 despite shifts away from the use of precious metals such as gold in wire bonding, according to a new...
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The coronavirus outbreak has disrupted production and weakened consumer confidence, with all ICT sectors bracing for major declines in shipments. Digitimes Research has conducted analyses on three mobile device sectors, namely notebooks, smartphones and tablets in the wake of the outbreak.