Bits + chips
Demand for copper wirebonding packaging to peak in 2014
Ingrid Lee, Taipei; Jessie Shen, DIGITIMES

Demand for copper wirebonding packaging will remain strong over the next two years, with the packaging technology to account for 85% of the global wirebonding market in 2014, according to equipment supplier Kulicke & Soffa Industries (K&S).

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