Bits + chips
Proportion of copper wire bonding to rise to over 20% in 2011, says SEMI
Ingrid Lee, Taipei; Jessie Shen, DIGITIMES

Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for copper wire is expected to increase form 11% in 2010 to more than 20%...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.