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ASE and SPIL look to continued growth in copper wire bonding business in 3Q11
Ingrid Lee, Taipei; Steve Shen, DIGITIMES
IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL), both expect their sales generated from copper wire bonding to increase substantially in the third quarter of 2011 as more clients have...
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The coronavirus outbreak has disrupted production and weakened consumer confidence, with all ICT sectors bracing for major declines in shipments. Digitimes Research has conducted analyses on three mobile device sectors, namely notebooks, smartphones and tablets in the wake of the outbreak.