Bits + chips
Elpida develops 4-layer DRAM package with 0.8mm thickness
Press release; Jessie Shen, DIGITIMES

Elpida Memory and its subsidiary, Akita Elpida Memory, have announced development of a four-layer 0.8mm DRAM package. The thin package consists of four low-power consumption 2Gb DDR2 mobile RAM chips, assembled using package-on-package (PoP) technolo...

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