Bits + chips
ASE slowing copper wire bonding expansion, says paper
Jessie Shen, DIGITIMES, Taipei

Advanced Semiconductor Engineering (ASE) is slowing down the expansion of its copper wirebonding capacity due to low market visibility, according to a Chinese-language Economic Daily News (EDN) report. The chip packaging and testing house plans...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.