Bits + chips
ASE, SPIL speeding up copper wire bonding expansion
Ingrid Lee, Taipei; Meiling Chen, DIGITIMES

Advanced Semiconductor Engineering (ASE) plans to add an additional 2,000 copper wirebonders by the end of 2010, while Siliconware Precision Industries (SPIL) will add 200-300 copper wirebonders per quarter in the first half of 2010, according to the...

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