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SEMICON Taiwan 2012
  • SEMICON Taiwan 2012 took place in Taipei during September 5-7. A series of technology forums were held with industry heavyweights to share their points of view and opinions on the future of technology.

    Last update: Monday 10 September 2012 [9 news items]

IC materials firms spend more on R&D, says Dow exec

Sep 10, 12:08

With semiconductor companies constantly upgrading to the latest advanced technologies, related production materials suppliers are required to raise the technological bar and provide...

STMicro gearing up for MEMS microphones

Sep 10, 10:39

With shipments rising gradually for customer products, STMicroelectronics is gearing up to expand its presence in the global MEMS microphone market and is eyeing to become a leading...

SPTS announces dry etch process technology for via reveal applications

Sep 6, 13:50

SPTS Technologies has announced its dry etch process technology for via reveal applications. Already established as the tool of record at major customer sites, the Pegasus Rapier...

Micron expresses interest in partnering with TSMC

Sep 6, 13:39

Micron Technology is striving to establish strategic cooperation with Taiwan-based contract chipmakers, according to company CEO Mark Durcan. Companies such as Taiwan Semiconductor...

Micron CEO says company seeking cooperation with Taiwan IC foundries

Demand for copper wirebonding packaging to peak in 2014

Sep 6, 13:36

Demand for copper wirebonding packaging will remain strong over the next two years, with the packaging technology to account for 85% of the global wirebonding market in 2014, according...

3D IC commercialization to take place in 2015-16, says ASE

Sep 6, 09:33

The adoption and commercialization of 3D TSV stacking IC technology and products will likely take place in the 2015-16 timeframe, according to Tong Ho-ming, general manager and chief...

Tong Ho-ming, general manager and chief of R&D at ASE

Micron-Elpida tie-up positive for global DRAM industry, says Inotera executive

Sep 5, 12:35

The integration between Micron Technology and Elpida Memory will be positive for the global DRAM industry in terms of production, technology and client interest, according to Scott...

Inotera president Scott Meikle

TSMC looks to build pilot 18-inch wafer line in 2016-2017

Sep 5, 12:17

Taiwan Semiconductor Manufacturing Company (TSMC) is on track in the development of 18-inch (450mm) wafers with the possibility to build a pilot line in 2016-2017 followed by mass...

TSMC executive says company to make 10nm chips on 18-inch wafers with mass production slated for 20

SEMICON Taiwan 2012 to take place in early September

Aug 1, 15:20

SEMICON Taiwan 2012 will take place in Taipei during September 5-7. Theme pavilions will include advanced packaging and testing, green manufacturing, MEMS and secondary market.

Categories: Bits + chips
Realtime news
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  • Qualcomm to extend tie-up with TSMC to FinFET, says executive

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Global AP demand forecast, 2017-2020

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Global notebook shipment forecast, 2017 and beyond
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