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Firms step up investment in advanced packaging
Major IC packaging and testing houses have stepped up investment in advanced packaging technologies such as wafer-level packaging and flip-chip (FC). Meanwhile, building new production lines for copper wire bonding processes is another investment focus as rising gold prices has discouraged more clients from adopting conventional processes based on gold wire.
IN THE NEWS
Monday 21 November 2011
Focus on small, cost-effective packages: Q&A with STATS ChipPAC CEO Tan Lay Koon
Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that...
Monday 24 October 2011
ASE opens new plant in Taiwan, outlines effort to expand operations
IC packaging and testing firm Advanced Semiconductor Engineering (ASE) on October 23 opened a new plant, named K12, in Kaohsiung, southern Taiwan. During a ceremony marking the opening...
Tuesday 6 September 2011
TSMC high-end IC packaging impacts IC packaging/testing houses
Taiwan Semiconductor Manufacturing Company (TSMC) has undertaken in-house high-end packaging of ICs produced by its foundry processes for fabless IC design houses in the US and Europe...
Wednesday 20 July 2011
Strong growth for semiconductor equipment in advanced packaging market, says Information Network
Advanced packaging is currently growing at a 18% compound annual rate, and equipment manufacturers will be major beneficiaries, according to market research firm The Information Ne...
Thursday 14 July 2011
ASE, SPIL reiterate 2011 capex outlook
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have said they currently have no plans to adjust planned capex for 2011. Meanwhile, both IC packagers...
Friday 1 July 2011
PTI developing advanced packaging technologies
Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...
Monday 27 June 2011
Major Taiwan IC backend firms developing copper pillar bumping
Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have...
Thursday 23 June 2011
SPIL turning focus to SiP packaging, IDM orders
Siliconware Precision Industries (SPIL) is stepping up the development of system-in-package (SiP) specifically for use in handsets, and has been more actively expanding its IDM client...