STATS ChipPAC Taiwan posts EPS over NT$4 for 2013
Newswatch - Mar 14, 15:04
IC backend service company STATS ChipPAC Taiwan saw its net profits climb 11.2% to NT$547.62 million (US$18.04 million) in 2013. The earnings translated into an EPS of NT$4.02 for the year.
China IC backend service companies migrating to advanced processes
Mar 13, 16:08
More IC testing and packaging companies in China are expected to migrate to advanced processes following Semiconductor Manufacturing International Corporation (SMIC) and Jiangsu Changjiang Electronics Technology's (JCET) announced plans to set up a 12-inch bumping joint venture, according to industry...
Commentary: Is it likely for Qualcomm to produce 28nm chips at SMIC?
Mar 13, 15:56
Recent reports from China have cited Qualcomm president Derek Aberle as disclosing that it plans to produce 28nm chips at China-based Semiconductor Manufacturing International Corporation (SMIC). Industry observers in Taiwan have noted that Qualcomm probably is looking to improve its relations with...
TSMC revises upward 1Q14 guidance
Newswatch - Mar 13, 13:53
Taiwan Semiconductor Manufacturing Company (TSMC) has revised upward its guidance for the first quarter of 2014 and also provided additional comments on its outlook for the quarter.
Kinsus, Unimicron set high capex budgets for 2014
Mar 12, 21:28
IC substrate suppliers Kinsus Interconnect Technology and Unimicron Technology will continue to commit huge capital spending for capacity ramps and advanced product development in 2014, according to industry sources.
ChipMOS net profits nearly double in 2013
Newswatch - Mar 12, 15:52
IC backend service company ChipMOS Technologies has announced net profits of NT$2.32 billion (US$76.58 million) for 2013, increasing 99.6% from a year earlier. The earnings translated into an EPS of NT$2.72 for 2013 compared to NT$1.38 of the prior year.
TSMC 20nm wafer production delayed temporarily, but will not affect shipments
Mar 11, 13:45
Taiwan Semiconductor Manufacturing Company (TSMC) has confirmed that its 20nm wafer starts were delayed recently due to a specification issue of materials used in its CMP (chemical mechanical planarization) process. The issue has been resolved, and no shipments will be delayed, said the wafer foundry...
SPIL to perform better than expected in 1Q14
Mar 10, 14:50
IC testing and packaging company Siliconware Precision Industries (SPIL) is expected to perform better than its guidance set for the first quarter of 2014 as clients are building up inventories for the upcoming peak season, according to industry sources.
Taiwan February export value down on month, up on year, says MOF
Mar 10, 10:45
Taiwan recorded a total export value of US$21.29 billion for February 2014, decreasing 12.4% on month but increasing 1.7% on year, while the corresponding total import value of US$19.72 billion dropped 7.6% on month but rose 4.9% on year, according to statistics released by the Ministry of Finance...
ASE reports decreased revenues for February
Mar 7, 15:28
Advanced Semiconductor Engineering (ASE) has reported February consolidated revenues of NT$16.24 billion (US$537 million), down 12.6% sequentially. The performance was in line with the company's guidance for slow sales during the first quarter of 2014.
KYEC February sales up 7%
Mar 7, 15:01
King Yuan Electronics (KYEC), which provides chip probing and final test services for LCD driver ICs and chip components used in mobile devices, has announced consolidated sales for February 2014 increased about 7% from a year earlier to NT$1.11 billion (US$36.8 million).
PC-related IC suppliers see demand pick up
Mar 7, 12:08
Taiwan-based PC-related IC design houses have landed a pull-in of orders recently prompting them to boost wafer starts at foundries, according to industry sources.
SPIL February sales rise 31%
Mar 6, 21:56
Consolidated revenues at IC packager Silicon Precision Industries (SPIL) increased 31.1% from a year earlier to NT$5.57 billion (US$184.1 million) in February 2014, thanks to brisk shipments for wireless communication chips.
OSE denies rumor of acquisition by memory module maker
Stockwatch - Mar 6, 15:25
Packaging and testing firm Orient Semiconductor Electronics (OSE) has denied local media reports indicating that it will be acquired by a dedicated memory module vendor, according to a company filing with the Taiwan Stock Exchange (TSE).
SAS February revenues increase
Mar 6, 11:24
Taiwan-based wafer maker Sino-American Silicon Products (SAS) has reported consolidated revenues of NT$2.181 billion (US$72 million) for February, growing 18.85% sequentially and 40.91% on year, and consolidated revenues for January-February reached NT$4.015 billion, rising 26.61% on year.
PTI expands customer base in logic IC field
Mar 5, 21:55
Packaging and testing firm Powertech Technology (PTI) has reportedly secured orders from application processor and networking chip developers, such as Broadcom and China-based RDA Microelectronics, gradually expanding its customer base in the logic IC field.
Taiwan February CPI down on month, year, says DGBAS
Mar 5, 15:38
Taiwan's February 2014 consumer price index (CPI) of 102.85 (2011 as base year) decreased 0.4% on month and 0.05% on year, while the corresponding wholesale price index (WPI) of 97.39% grew 0.4% on month but slipped 0.48% on year, according to statistics released by the Directorate-General Budget,...
Global chip sales rise 8.8% in January, says SIA
Mar 5, 13:46
Worldwide sales of semiconductors for January 2014 reached US$26.28 billion, an increase of 8.8% from a year ago when sales were US$24.15 billion, according to SIA. Compared to the US$26.65 billion posted in December 2013, January sales represented a 1.4% decrease reflecting normal seasonal trends.
Altera to switch 14nm chip orders back to TSMC, says paper
Newswatch - Mar 5, 11:45
Altera is expected to have Taiwan Semiconductor Manufacturing Company (TSMC) fabricate its next-generation FPGA chips using TSMC's newly implemented 16nm FinFET+ process, instead of producing the chips using Intel's 14nm tri-gate transistor technology, according to a Chinese-language Commercial...
PTI capacity for SSDs to grow robustly
Mar 4, 14:35
Packaging and testing firm Powertech Technology (PTI) is looking to boost its overall output for SSD-use NAND flash memory to 150,000-200,000 units a month in May-June, up from the current 100,000 units, according to company chairman DK Tsai.
Tong Hsing, Lingsen see MEMS driving 2014 growth
Mar 4, 13:45
Tong Hsing Electronic Industries, which provides assembly and packaging services for CMOS image sensors as well as other niche ICs, expects robust growth in sales generated from its services for MEMS products particularly automotive pressure sensors.
Lingsen, KYEC new production capacity to come online in 2Q14
Mar 3, 21:52
MEMS backend service companies Lingsen Precision Industries and King Yuan Electronics (KYEC) both will have their new production capacity ready for commercial production in the second quarter of 2014, according to industry sources.
UMC 28nm HKMG process verified by Broadcom, says paper
Newswatch - Mar 3, 15:28
The 28nm HKMG process at United Microelectronics Corporation (UMC) has been verified by Broadcom, allowing the Taiwan-based foundry house to begin wafer starts for the US-based chipset vendor in the second quarter of 2014, according to a Chinese-language Economic Daily News (EDN)...
PTI to pay Tessera US$196 million in patent lawsuit settlement
Stockwatch - Feb 27, 15:54
Packaging and testing firm Powertech Technology (PTI) has issued a company filing with the Taiwan Stock Exchange (TSE) disclosing it has settled a patent infringement dispute with Tessera. PTI will pay Tessera a total of US$196 million based on the settlement.
Toshiba, Canon team up for 15nm NAND flash, says report
Feb 27, 14:35
Toshiba, the world's second-largest maker of NAND flash memory behind Samsung Electronics, will work with fab-tool maker Canon to develop 15nm NAND chips with volume production slated for 2015, according to a report in the Japanese-language Nikkan Kogyo Shimbun.
Tong Hsing sees net profits up over 20% in 2013
Feb 27, 14:32
Module packaging service and LED substrate vendor Tong Hsing Electronic Industries has reported net profits of NT$1.58 billion (US$52.18 million) for 2013, up 20.6% from a year earlier.
China auto semiconductor market drives up 11% in 2013, says IHS
Feb 27, 10:31
The fast-growing semiconductor market for China's automotive industry is set for double-digit expansion in revenues in 2014, propelled by an increasing desire among Chinese car buyers for added vehicle safety features and helpful infotainment applications like car navigation, according to IHS.
ASE to pay US$30 million to Tessera to settle patent case
Feb 26, 15:34
Advanced Semiconductor Engineering (ASE) has issued a company filing with the Taiwan Stock Exchange (TSE) announcing that the company will pay Tessera a total of US$30 million to settle a patent infringement suit filed in the United States District Court for the Northern District of California.
3S ramping MEMS microphone chip shipments
Feb 26, 15:10
IC design house Solid State System (3S) is ramping up shipments of its MEMS microphone chips, buoyed by new orders for low- to mid-end smartphones and tablets, according to the company.
Taiwan January unemployment hits 67-month low, says DGBAS
Feb 26, 15:03
Taiwan had 462,000 jobless citizens in January 2014, equivalent to an unemployment rate of 4.02%, which was the lowest monthly level since July 2008 and down 0.06pp on month and 0.14pp on year, according to statistics released by the Directorate-General of Budget, Accounting and Statistics (DGBAS)...
Hermes Microvision expects 2014 sales to rise 25-30%
Feb 26, 15:01
E-beam inspection equipment supplier Hermes Microvision (HMI) expects to post 25-30% revenue growth in 2014, thanks to rising orders of tools for 1Xnm processes and demand created by new technologies, according to company general manager Jack Y Yau.
Intel remains top semiconductor R&D spender, says IC Insights
Feb 26, 11:21
IC Insights has released its 2013 ranking of semiconductor companies by R&D spending. Intel continued to top all other chip companies, accounting for 37% of the top-10 spending and 19% of total worldwide semiconductor R&D expenditures.
STATS ChipPAC fcCuBE technology achieves significant growth in 2013
Feb 26, 10:52
STATS ChipPAC has announced that unit shipments of semiconductor packages utilising its patented fcCuBE technology more than quadrupled in 2013 compared to 2012. The performance and cost advantages of this advanced flip-chip packaging technology has driven adoption by customers in the mobile, consumer...
Equipment supplier Csun to see revenues grow 5-10% in 1Q14
Feb 25, 21:58
PCB, LCD and semiconductor equipment supplier Csun Manufacturing is expected to see its revenues grow 5-10% sequentially in the first quarter of 2014 despite the impact of seasonal factors, according to industry sources.
TSMC remains key foundry partner for 28nm chips, says MediaTek
Feb 25, 16:05
In response to recent market speculation indicating that MediaTek is shifting some of its 28nm chip orders to Globalfoundries and United Microelectronics (UMC), MediaTek president Hsieh Ching-chiang indicated that Taiwan Semiconductor Manufacturing Company (TSMC) remains the company's major foundry...
KYEC enjoys brisk orders for CMOS image sensors, says report
Newswatch - Feb 25, 15:42
Taiwan-based King Yuan Electronics (KYEC), which provides chip probing and final test services for LCD driver ICs and chip components used in mobile devices, has landed a pull-in of orders for CMOS image sensors, according to a Chinese-language Commercial Times report.