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News tagged WL-CSP
  • Last update: Tuesday 31 December 2013 [3 news items]

IC backend service firms to ramp up bumping, WL-CSP capacities in 2014, say sources

Dec 31, 11:26

Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend...

Integrated handheld solutions driving demand for wafer-level packaging, says ASE

Apr 13, 16:00

Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...

Image sensor packaging house XinTec to ship 300,000 WL-CSP wafers in 2008

Oct 13, 13:48

Image sensor and MEMS-chip packaging house XinTec is expected to ship 300,000 wafer-level chip-scale packaging (WL-CSP) wafers in 2008, with shipments to gain more momentum in 2009,...

Tags: WL-CSP
2014 China smartphone market and industry
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