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News tagged VIA
  • Last update: Friday 25 August 2017 [288 news items]

Taiwan market: InFocus launches M510t smartphone via cooperation with Asia Pacific Telecom

Oct 1, 15:34

US-based vendor InFocus on September 30 launched the M510t smartphone featuring Qualcomm S400 1.2GHz quad-core processor, 5-inch HD IPS touch screen, in the Taiwan market at a contract-free...

Polysilicon prices not much affected by China moratorium on imports via EPZs, say Taiwan makers

Sep 4, 15:13

Although China has placed a moratorium on polysilicon imports through its export processing zones (EPZs), the measure has yet to show much impact on product pricing, according to...

Polysilicon crystals

D.Phone raises nearly HK$900 million via IPO in Hong Kong

Newswatch - Jul 11, 18:09

D.Phone, the largest handset retail chain in China, has raised nearly HK$900 million (US$116 million) through its IPO on the Hong Kong Stock Exchange, with over 60% of the funds to...

China makers call for punitive taxation on polysilicon imported via EPZs

Jul 2, 12:37

The China government has imposed anti-dumping and anti-subsidization tariffs on solar-grade polysilicon imported from the US, Europe and South Korea, but much of the US-produced polysilicon...

Ambit to subscribe to new shares of Asia Pacific Telecom

Stockwatch - May 26, 21:53

Foxconn Electronics (Hon Hai Precision Industry) on May 26 announced that its wholly owned subsidiary Ambit Microsystems, one of the six next-generation (4G) mobile communication...

Dell to enter home entertainment market via AlienWare

Feb 27, 13:55

Dell is planning to add new product lines under its sub-brand AlienWare and will expand from the PC industry to the home entertainment market, according to sources from the upstream...

VIA reportedly moving x86 CPU resources to new joint venture in China

Feb 19, 22:09

VIA Technologies is rumored to have started shifting its x86 CPU technologies and related personnel to its newly formed IC design joint venture with a China government-owned investment...

MediaTek expands cooperation with VIA Telecom

Jan 6, 21:11

MediaTek announced on January 6 that the company has expanded its strategic tie-up with VIA Telecom. Combining VIA's CDMA 2000 technology, MediaTek will be able to provide a complete...

VIA likely to post smaller loss for 2013

Dec 20, 15:42

VIA Technologies is expected to report smaller losses for 2013, due to profits made by its subsidiaries VIA Labs and VIA Telecom. Its core processor business remains unprofitable.

VIA claims NT$4.14 billion compensation for IP infringements by Asustek, ASMedia

Dec 18, 15:10

IC design house VIA Technologies on December 17 filed with the Taipei Local Court to request NT$4.14 billion (US$139 million) in compensation for losses due to infringement of its...

Compal, Kinpo to sell stakes in Vibo Telecom to 4G licensee Taiwan Star Cellular

Nov 11, 15:31

Compal Electronics and Kinpo Electronics have disclosed they will sell their respective 47.32% and 47.95% stakes in Taiwan-based 3G carrier Vibo Telecom to Taiwan Star Cellular, a...

VIA licenses Cadence Tensilica HiFi audio/voice DSP

Oct 23, 11:08

Cadence Design Systems has announced that VIA Technologies has selected the Cadence Tensilica HiFi audio/voice digital signal processor for a system-on-chip design for set-top boxes,...

VIA Telecom grants MediaTek CDMA 2000 license, says report

Newswatch - Oct 4, 14:41

VIA Telecom has granted MediaTek a license to develop and manufacture SoC solutions implementing the CDMA 2000 standard, according to a Chinese-language Commercial Times...

Epistar aims at largest LED capacity in China via expanding joint venture, says paper

Newswatch - Sep 24, 14:14

Taiwan-based LED epitaxial wafer and chip maker Epistar aims to have the largest production capacity in China among all LED chip makers through expanding production capacity at KFES...

VIA, SiS see weak May revenues

Jun 13, 15:52

Taiwan-based chipmakers VIA Technologies and Silicon Integrated System (SiS) are both suffering from weak performance due to strong competition. VIA had consolidated revenues of NT$284...

Companies gearing up for USB 3.0 hub market boom

Apr 18, 21:43

USB controller chipmakers including ASMedia Technology, Genesys Logic, Realtek Semiconductor, Renesas Electronics, Standard Microsystems Corporation (SMSC), Texas Instruments (TI)...

VIA Labs lands new orders for USB 3.0 hub controllers

Apr 15, 23:49

Taiwan-based VIA Labs has grabbed USB 3.0 hub controller orders for docking stations from Lenovo, with shipments kicking off in the third quarter, according to industry sources. Monthly...

Quarter of tablet users to pay bills via their devices by 2017, says Juniper Research

Mar 25, 14:34

A new report from research firm Juniper Research has found that a growing user acceptance of push mobile banking and a sharp rise in tablet adoption will drive users of transactional...

Taiwan market: TV vendors look to offer special deals via cooperation with content providers

Mar 4, 21:38

Rumors are spreading in Taiwan that local-based TV vendors are looking to clear out their reserves by offering low-priced or even free TVs to consumers upon the consumers' agreement...

VIA announces Android BSP enabling split-screen multi-touch digital signage display at DSE 2013

Feb 27, 14:43

VIA Technologies has announced its latest Android board support package (BSP) for the VIA Vantage digital signage line which enables a split-screen multi-touch user experience that...

VIA forms IC joint venture with Shanghai Alliance Investment

Jan 17, 18:45

VIA Technologies has announced that it has set up an IC design house jointly with Shanghai Alliance Investment Company targeting the growing chip market in China.

MediaTek, VIA to compete with Qualcomm, Nvidia for processors used in inexpensive tablets

Jan 14, 21:13

Taiwan-based vendors Acer and Asustek Computer, in order to minimize production cost, have adopted dual-core processors developed by Taiwan-based MediaTek and China-based WonderMedia...

VIA Labs obtains USB-IF certification for USB 3.0 hub controllers

Dec 25, 11:37

USB device controller supplier VIA Labs has received USB-IF (USB Implementers Forum) certification for its VL811 and VL812 USB 3.0 hub controller ICs, according to industry sources...

Agilent invests in Taiwan-based Adlink via private placement

Dec 20, 20:48

Taiwan-based industrial computing product maker Adlink Technology on December 20 announced that Agilent Technologies, a California-based supplier of electronic measurement instruments...

USB 3.0 chipmakers push into USB hub business

Dec 17, 15:42

As Intel started natively supporting USB 3.0 technology with its Ivy Bridge platform, third-party chipmakers including Renesas Electronics, ASMedia, Etron Technology and VIA Labs...

Asustek refutes rumors about adopting ARM platform from VIA

Dec 10, 22:27

Commenting on a recent market rumor that Asustek Computer considers to adopt entry-level ARM-based platform from WonderMedia, a subsidiary of VIA Technologies, for an US$99 7-inch...

VIA Labs to roll out new USB 3.0 flash drive controllers built on 85nm

Dec 3, 14:23

VIA Labs, a subsidiary of VIA Technologies specializing in USB 3.0 integrated chip controllers, will roll out new solutions for USB flash drives in December. The new VIA VL752-series...

ASMedia to be listed at the end of December

Nov 14, 22:19

ASMedia Technology, an Asustek Computer subsidiary that focuses on producing USB 3.0 controller chips, is set to be listed on the Taiwan Stock Exchange (TSE) at the end of December,...

Aptina benefiting from product differentiation via CIS chips, says executive

Nov 8, 15:24

Aptina, which supplies a complete lineup of CMOS image sensors, will benefit from the increasing emphasis on camera functionalities and the image processing capabilities of smartphones...

VIA announces first Pico-ITX motherboard with 3D display capabilities

Sep 10, 14:34

VIA Technologies has announced the EPIA-P910 Pico-ITX motherboard, the first VIA motherboard to feature the latest VIA VX11H MSP in combination with a VIA QuadCore E-series processor...

SPTS announces dry etch process technology for via reveal applications

Sep 6, 13:50

SPTS Technologies has announced its dry etch process technology for via reveal applications. Already established as the tool of record at major customer sites, the Pegasus Rapier...

VIA suffers close to 15% on-month drop in August revenues

Sep 6, 13:44

VIA Technologies has announced revenues of NT$246 million (US$8.25 million) for August 2012, down 14.58% on month and 22.9% on year. Revenues performance in September is only expected...

ASMedia office raided in IPR row

Sep 3, 10:54

Law enforcement authorities have raided ASMedia Technology's office in an investigation reportedly over alleged infringement on intellectual property rights related to its USB 3.0...

ASMedia USB 3.0 chips reportedly attract orders from Seagate

Taiwan panel makers to maintain profits via China handset vendors

Aug 16, 15:06

China-based handset vendors will be the major source for maintaining profits for Taiwan-based panel makers during the second half of the year as mobile phone sales across the globe...

VIA reportedly has become acquisition target for a China communications chip player

Aug 16, 01:10

Chip maker VIA Technologies is reportedly being targeted by a China-based communications chip player for acquisition, according to market watchers.

288 items [3/9]
Realtime news
  • LPWAN offers two-way communications for data collection, remote control

    Mobile + telecom | 9h 43min ago

  • Taiwan foreign direct investment totals US$4.9 billion in January-August

    Bits + chips | 10h 55min ago

  • Taiwan August export order value increases

    Bits + chips | 11h 4min ago

  • Taiwan market: Optoma launches LED projector

    Displays | 11h 15min ago

  • EU sets new minimum prices for China PV imports

    Before Going to Press | 8h 51min ago

  • Google Play eyes opportunities from VR, AR, Chromebook

    Before Going to Press | 9h 46min ago

  • KYEC grabs testing orders for analog, PA chips from Murata

    Before Going to Press | 10h 34min ago

  • Innolux to expand 6G fab capacity

    Before Going to Press | 10h 44min ago

  • Japan, Korea, Taiwan among top-5 Google Play markets

    Before Going to Press | 10h 45min ago

  • DRAM bit growth to reach 19.6% in 2018, says DRAMeXchange

    Before Going to Press | 10h 49min ago

  • Tokyo Electron optimistic about etching equipment demand for 3D NAND, FinFET

    Before Going to Press | 11h 1min ago

  • HTC in trading halt pending release of material information

    Before Going to Press | 11h 9min ago

  • TSMC to hold over 70% of PWM IC orders from Qualcomm

    Before Going to Press | 11h 10min ago

  • Taiwan August export order value increases

    Before Going to Press | 11h 16min ago

  • Taiwan foreign direct investment totals US$4.9 billion in January-August

    Before Going to Press | 11h 20min ago

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  • VIA+Artigo+A830+IoT+kiosk+solution

    VIA Artigo A830 IoT kiosk solution

    VIA Technologies has announced its latest kiosk solution, the VIA Artigo A830, featuring anti-static lightning and surge protection. With HDMI and LVDS touch panel dual screen support,...

    Photo: Company, Dec 5.

  • VIA+ARTiGO+A900+Android+system

    VIA ARTiGO A900 Android system

    VIA Technologies has launched the VIA ARTiGO A900 Android system. With its 3D graphics and HD video performance, I/O connectivity options, and software development tools, the VIA...

    Photo: Company, Sep 24.

  • VIA+Viega+ruggedized+Android+tablet

    VIA Viega ruggedized Android tablet

    VIA Technologies has announced the VIA Viega, a ruggedized 10.1-inch Android tablet. The IP65-rated VIA Viega sports a durable design that protects against spills, rain, and dust...

    Photo: Company, Jul 18.

  • VIA+Android+BSP+enables+split%2Dscreen+multi%2Dtouch+function

    VIA Android BSP enables split-screen multi-touch function

    VIA Technologies has announced its latest Android board support package (BSP) for the VIA Vantage digital signage line which enables a split-screen multi-touch user experience that...

    Photo: Company, Mar 4.

  • VIA+EPIA%2DP910+Pico%2DITX+motherboard

    VIA EPIA-P910 Pico-ITX motherboard

    VIA Technologies has announced the EPIA-P910 Pico-ITX motherboard, the first VIA motherboard to feature the latest VIA VX11H MSP in combination with a VIA QuadCore E-series processor...

    Photo: Company, Sep 11.

UMC
Global AP demand forecast, 2017-2020

20-Sep-2017 markets closed

 LastChange

TAIEX (TSE)10519.17-56.97-0.54% 

TSE electronic447.25-2.84-0.63% 

GTSM (OTC)142.07-0.40-0.28% 

OTC electronic210.41-0.69-0.33% 

Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.