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News tagged VIA
  • Last update: Friday 31 July 2015 [238 news items]

Companies gearing up for USB 3.0 hub market boom

Apr 18, 21:43

USB controller chipmakers including ASMedia Technology, Genesys Logic, Realtek Semiconductor, Renesas Electronics, Standard Microsystems Corporation (SMSC), Texas Instruments (TI)...

VIA Labs lands new orders for USB 3.0 hub controllers

Apr 15, 23:49

Taiwan-based VIA Labs has grabbed USB 3.0 hub controller orders for docking stations from Lenovo, with shipments kicking off in the third quarter, according to industry sources. Monthly...

Quarter of tablet users to pay bills via their devices by 2017, says Juniper Research

Mar 25, 14:34

A new report from research firm Juniper Research has found that a growing user acceptance of push mobile banking and a sharp rise in tablet adoption will drive users of transactional...

Taiwan market: TV vendors look to offer special deals via cooperation with content providers

Mar 4, 21:38

Rumors are spreading in Taiwan that local-based TV vendors are looking to clear out their reserves by offering low-priced or even free TVs to consumers upon the consumers' agreement...

VIA announces Android BSP enabling split-screen multi-touch digital signage display at DSE 2013

Feb 27, 14:43

VIA Technologies has announced its latest Android board support package (BSP) for the VIA Vantage digital signage line which enables a split-screen multi-touch user experience that...

VIA forms IC joint venture with Shanghai Alliance Investment

Jan 17, 18:45

VIA Technologies has announced that it has set up an IC design house jointly with Shanghai Alliance Investment Company targeting the growing chip market in China.

MediaTek, VIA to compete with Qualcomm, Nvidia for processors used in inexpensive tablets

Jan 14, 21:13

Taiwan-based vendors Acer and Asustek Computer, in order to minimize production cost, have adopted dual-core processors developed by Taiwan-based MediaTek and China-based WonderMedia...

VIA Labs obtains USB-IF certification for USB 3.0 hub controllers

Dec 25, 11:37

USB device controller supplier VIA Labs has received USB-IF (USB Implementers Forum) certification for its VL811 and VL812 USB 3.0 hub controller ICs, according to industry sources...

Agilent invests in Taiwan-based Adlink via private placement

Dec 20, 20:48

Taiwan-based industrial computing product maker Adlink Technology on December 20 announced that Agilent Technologies, a California-based supplier of electronic measurement instruments...

USB 3.0 chipmakers push into USB hub business

Dec 17, 15:42

As Intel started natively supporting USB 3.0 technology with its Ivy Bridge platform, third-party chipmakers including Renesas Electronics, ASMedia, Etron Technology and VIA Labs...

Asustek refutes rumors about adopting ARM platform from VIA

Dec 10, 22:27

Commenting on a recent market rumor that Asustek Computer considers to adopt entry-level ARM-based platform from WonderMedia, a subsidiary of VIA Technologies, for an US$99 7-inch...

VIA Labs to roll out new USB 3.0 flash drive controllers built on 85nm

Dec 3, 14:23

VIA Labs, a subsidiary of VIA Technologies specializing in USB 3.0 integrated chip controllers, will roll out new solutions for USB flash drives in December. The new VIA VL752-series...

ASMedia to be listed at the end of December

Nov 14, 22:19

ASMedia Technology, an Asustek Computer subsidiary that focuses on producing USB 3.0 controller chips, is set to be listed on the Taiwan Stock Exchange (TSE) at the end of December,...

Aptina benefiting from product differentiation via CIS chips, says executive

Nov 8, 15:24

Aptina, which supplies a complete lineup of CMOS image sensors, will benefit from the increasing emphasis on camera functionalities and the image processing capabilities of smartphones...

VIA announces first Pico-ITX motherboard with 3D display capabilities

Sep 10, 14:34

VIA Technologies has announced the EPIA-P910 Pico-ITX motherboard, the first VIA motherboard to feature the latest VIA VX11H MSP in combination with a VIA QuadCore E-series processor...

SPTS announces dry etch process technology for via reveal applications

Sep 6, 13:50

SPTS Technologies has announced its dry etch process technology for via reveal applications. Already established as the tool of record at major customer sites, the Pegasus Rapier...

VIA suffers close to 15% on-month drop in August revenues

Sep 6, 13:44

VIA Technologies has announced revenues of NT$246 million (US$8.25 million) for August 2012, down 14.58% on month and 22.9% on year. Revenues performance in September is only expected...

ASMedia office raided in IPR row

Sep 3, 10:54

Law enforcement authorities have raided ASMedia Technology's office in an investigation reportedly over alleged infringement on intellectual property rights related to its USB 3.0...

ASMedia USB 3.0 chips reportedly attract orders from Seagate

Taiwan panel makers to maintain profits via China handset vendors

Aug 16, 15:06

China-based handset vendors will be the major source for maintaining profits for Taiwan-based panel makers during the second half of the year as mobile phone sales across the globe...

VIA reportedly has become acquisition target for a China communications chip player

Aug 16, 01:10

Chip maker VIA Technologies is reportedly being targeted by a China-based communications chip player for acquisition, according to market watchers.

Epistar to take over Huga Optotech via share swap

Aug 10, 01:25

LED chipmaker Epistar will completely take over subsidiary Huga Optotech through a share swap in which one Epistar share will be exchanged for 4.85 Huga shares, Epistar has announced...

VIA expects on-month growth in July revenues

Jul 31, 01:45

After seeing declining revenue performance in the first half, CPU maker VIA Technologies expects its revenues in July will enjoy on-month growth, but due to China market is having...

Unifosa to merge with Proware via stock swap

Jul 11, 01:40

Unifosa, a Taiwan-based ODM/OEM of DRAM and NAND flash memory modules, on July 10 announced that it will merge with Proware Technology, a Taiwan-based provider of RAID storage solutions,...

China white-box tablets expected to see fewer shipments than forecast

Jul 3, 01:00

China's 7-inch and 10-inch white-box tablet shipments are expected to reach only 16-17 million units in 2012, not matching market watchers' original forecast of at least 20 million...

China white-box tablet PCs expected to see less shipment than forecast

VIA announces ARM-based digital signage system with Android support

Jun 21, 11:52

VIA Technologies has announced the VIA ARM digital signage (DS) system.

VIA announces on-month growth, but on-year drop in March revenues

Apr 5, 15:04

Taiwan-based VIA Technologies has announced revenues of NT$357 million (US$12.1 million) for March, up 16.09% on month, but dropping 25.01% on year, while revenues for the first quarter...

VIA announces 2 new system-on-module solutions

Mar 23, 17:42

VIA Technologies has announced the two latest VIA modules in the growing VIA Modular Solutions portfolio, the VIA COMe-8X92 and the VIA QSM-8Q90. The modular design approach allows...

VIA COMe-8X92 system-on-module solution

ASMedia, VIA Labs grab USB 3.0 controller orders from Japan

Mar 19, 15:48

ASMedia Technology and VIA Labs have secured orders for USB 3.0 controller chips used in external hard drives from Japan-based vendors such as Toshiba and Sony, with volume shipments...

Taiwan-based controller design houses reportedly cut into supply chain of Japan-based electronics v

VIA Telecom ships 18 million CDMA handset solutions in 2011, says paper

Newswatch - Jan 30, 14:00

VIA Telecom shipped 18 million units of CDMA chipset solutions in 2011, including 10 million units for entry-level CMDA handsets, the Chinese-language Commercial Times quoted...

VIA, SiS achieve results from non-PC industry

Jan 12, 01:05

Taiwan-base chipset makers VIA Technologies and Silicon Integrated Systems (SiS), although already phasing out of the PC chipset market, have both entered different markets and achieved...

VIA refutes report about being acquired by China telecom carrier

Jan 10, 01:25

VIA Technologies, commenting about a recent report stated that China-based telecom carrier Datang Telecom Technology (DTT) has recently discussed with VIA chairman Cher Wang the ...

VIA announces VB7009 Mini-ITX embedded motherboard

Jan 4, 16:19

VIA Technologies has announced the VIA VB7009 embedded Mini-ITX motherboard. Measuring only 17x17cm, the VIA VB7009 Mini-ITX is a flexible embedded board for POS and kiosks.

VIA VB7009 embedded Mini-ITX motherboard

VIA releases new Mini-ITX motherboard for digital home media enthusiasts

Nov 15, 16:57

VIA Technologies has announced the VIA VE-900 Mini-ITX motherboard, immediately available worldwide. The motherboard provides the ideal platform for DIY enthusiasts to custom build...

VIA suffers continued net loss in 3Q11

Nov 4, 17:07

VIA Technologies posted revenues of NT$990 million (US$34.1 million), gross margin of 27.82%, net operating loss of NT$189 million, net loss of NT$1.513 billion including a loss of...

Opera looks to develop new businesses via acquisition; step up cooperation with Taiwan device makers

Oct 13, 16:28

Browser developer Opera Software will target Internet companies in four segments – advertisement, messaging, payment and social networking – for future acquisition in...

238 items [2/7]
Realtime news
  • Japan sees decreased 2Q15 PV module shipments, says JPEA

    Green energy | 4h 30min ago

  • Japan market: HTC to beef up marketing of SIM-free smartphones

    Mobile + telecom | 4h 32min ago

  • Samsung holding meetings with telecom providers to introduce new 18-inch tablet, say reports

    Mobile + telecom | 4h 34min ago

  • Toshiba sells shares in Topcon

    IT + CE | 4h 35min ago

  • Taiwan IC design houses see order visibility continue improving

    Bits + chips | 4h 35min ago

  • Digitimes Research: Osram expected to keep leading status in automotive lighting

    Before Going to Press | 4h 46min ago

  • 2014 Nobel physics laureate Shuji Nakamura to make speech in Taiwan

    Before Going to Press | 4h 47min ago

  • SPIL looks to effective results of SiP packaging development with Foxconn

    Before Going to Press | 4h 47min ago

  • LG looking into 9.7G facilities, say reports

    Before Going to Press | 4h 48min ago

  • Toshiba sells shares in Topcon

    Before Going to Press | 4h 49min ago

  • Taiwan PCB makers seeing growing threat from China competitors

    Before Going to Press | 4h 50min ago

  • HTC to lay off 600 employees working in northern Taiwan

    Before Going to Press | 4h 51min ago

  • TSMC plan to set up own-use power plant may not be feasible, says Taipower chairman

    Before Going to Press | 4h 52min ago

  • Digitimes Research: More advanced IC manufacturing process to take root in China

    Before Going to Press | 4h 54min ago

  • Xiaomi said to release notebook in 2016 with help from Inventec and Foxconn

    Before Going to Press | 4h 55min ago

  • South Korea market: SK Telecom to launch smartphone produced by FIH Mobile

    Before Going to Press | 4h 55min ago

  • Taiwan being used to circumvent China anti-dumping, anti-subsidization tariffs

    Before Going to Press | 4h 57min ago

  • Solartech Energy receives solar cell orders with shipments scheduled through November

    Before Going to Press | 4h 59min ago

  • Sony Mobile Taiwan looking to acquire a 20% market share with new wearables

    Before Going to Press | 4h 59min ago

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  • VIA+ARTiGO+A900+Android+system

    VIA ARTiGO A900 Android system

    VIA Technologies has launched the VIA ARTiGO A900 Android system. With its 3D graphics and HD video performance, I/O connectivity options, and software development tools, the VIA...

    Photo: Company, Sep 24.

  • VIA+Viega+ruggedized+Android+tablet

    VIA Viega ruggedized Android tablet

    VIA Technologies has announced the VIA Viega, a ruggedized 10.1-inch Android tablet. The IP65-rated VIA Viega sports a durable design that protects against spills, rain, and dust...

    Photo: Company, Jul 18.

  • VIA+Android+BSP+enables+split%2Dscreen+multi%2Dtouch+function

    VIA Android BSP enables split-screen multi-touch function

    VIA Technologies has announced its latest Android board support package (BSP) for the VIA Vantage digital signage line which enables a split-screen multi-touch user experience that...

    Photo: Company, Mar 4.

  • VIA+EPIA%2DP910+Pico%2DITX+motherboard

    VIA EPIA-P910 Pico-ITX motherboard

    VIA Technologies has announced the EPIA-P910 Pico-ITX motherboard, the first VIA motherboard to feature the latest VIA VX11H MSP in combination with a VIA QuadCore E-series processor...

    Photo: Company, Sep 11.

  • VIA+ARM+DS+digital+signage+system

    VIA ARM DS digital signage system

    VIA Technologies has announced the VIA ARM digital signage (DS) system. Developed for the Android operating system, the VIA ARM DS is an all-in-one system-ready solution for managing...

    Photo: Company, Jun 25.

  • China smartphone AP shipments – 4Q 2014

    Smartphone AP shipments to China grew 38% on year and 10.1% on quarter in the fourth quarter of 2014, as the expanding coverage of LTE services helped drive shipments.

Kromax
2015 China smartphone panel trend forecast

31-Aug-2015 markets closed

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TAIEX (TSE)8019.18+194.63+2.49% 

TSE electronic307.57+6.94+2.31% 

GTSM (OTC)107.6+2.04+1.93% 

OTC electronic133.75+3.46+2.66% 

Analysis of China revised domestic semiconductor industry goals
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.