PCB maker Unimicron Technology has seen demand for its HDI boards remain robust, likely to help maintain the capacity utilization for this product segment at 80-90% in the third quarter...
Robust ABF substrate demand boosted profits at Unimicron Technology and Kinsus Interconnect Technology in the second quarter of 2022, which both climbed to record highs.
Nan Ya PCB is looking to grow its automotive IC substrate sales as a proportion of company revenue to over 10% in 2022, up from 7-8% in 2021, according to company sources.
Unimicron Technology will continue ramping up its ABF substrate capacity till 2025 to cope with increasing demand from the 5G, AIoT, HPC and networking device sectors.
Taiwan-based ASE Technology and Unimicron Technology have both seized flip chip ball grid array (FC-BGA) packaging and related substrate orders for Apple's just unveiled M2 processors,...
Taiwan-based ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology are expected to commercialize additional capacities boosting their...
COVID lockdowns in Kunshan and other Chinese cities, where high-tech manufacturing hubs are located, are impacting local businesses, including PCB makers seeing their production and...
OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...
Robust ABF substrate demand for datacenter applications will boost revenues and profits at Taiwan-based suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect...
An extended COVID lockdown in Kunshan, China is not much constraining PCB and IC substrate supply from plants there operated by Taiwan-based makers Unimicron Technology and Nan Ya...
ABF substrate suppliers continue to see customers queue up for their available capacities, with the visibility of orders extended to at least 2027, according to industry sources.
Taiwan's leading PCB specialist Zhen Ding Technology is gearing up to carry out its ambitious 10-year development roadmaps for IC substrates, aiming to rank among the world's top-5...
Shipments of new Apple devices may more or less be affected by the COVID lockdowns in Shenzhen and Dongguan, where its supply chain partners including Foxconn, Unimicron Technology...
Apple has just unveiled its M1 Ultra SoC built using in-house-developed UltraFusion packaging architecture, which will be fabricated by TSMC with a 5nm process node and advanced packaging...
