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News tagged through-silicon via
  • Last update: Friday 14 July 2017 [2 news items]

Toshiba develops 3D flash memory with TSV technology

Jul 14, 15:48

Toshiba has announced development of its BiCS flash three-dimensional (3D) flash memory utilizing through-silicon via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC)...

Toshiba 3D NAND flash with TSV

SEMICON Taiwan 2008: Equipment makers pay more attention to new materials and through-silicon via

Sep 11, 01:15

Semiconductor equipment makers are not being discouraged by the present industry downturn. Material supplier Rohm & Haas Electronic Materials and equipment vendor KLA-Tencor have...

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Global AP demand forecast, 2017-2020

17-Nov-2017 markets closed

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OTC electronic224.17+2.52+1.14% 

Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.