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News tagged Texas Instruments
  • Last update: Wednesday 11 October 2017 [100 news items]

Global short supply of HDDs expected in 2H11

Jun 20, 10:47

Although Texas Instruments and Renesas Electronics, the global suppliers HDD chips, have resumed operations at their Japan factories damaged by the earthquake on March 11, 2011, demand...

TI reportedly cuts wafer starts at TSMC, UMC

Jun 15, 16:49

Texas Instruments (TI) has cut its orders to Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC), according to sources in the industry...

Microsoft postpones IDP for 2 weeks to re-consult with chip players

Jun 2, 01:10

Microsoft has postponed its Integrated Development Program (IDP) for Windows 8 as the plan created significant dissatisfaction within the upstream supply chain. Microsoft is set to...

TSMC receives more requests to produce analog chips using 12-inch, advanced processes

May 13, 01:10

A number of international analog IC companies have been in talks with Taiwan Semiconductor Manufacturing Company (TSMC) for allocation of 12-inch wafer production capacity to put...

Hard drive industry to continue facing shortage in May

May 10, 01:35

Japan's earthquake in March has significantly impacted the supply status of the hard drive industry and the effect is expected to persist in May with two of the top-5 makers - Western...

TI certifies 8-inch wafers from SAS, says paper

Newswatch - Apr 15, 11:36

Eight-inch epitaxy wafers by Taiwan-based Sino-American Silicon Products (SAS) has been certified by Texas Instruments (TI), according to a Chinese-language Commercial Times...

Yole lists top-30 MEMS companies in 2010: Big-4 capture one third of total market

Apr 13, 16:06

The worldwide MEMS industry enjoyed a growth of 25% in 2010, according to a recent Yole Developpement report. Major players Texas Instruments (TI), Hewlett-Packard (HP), Robert Bosch...

TI announces first USB-IF certified four-port host controller

Apr 13, 10:34

Texas Instruments (TI) has announced that it is the first semiconductor company to receive certification from the USB Implementer's Forum (USB-IF) for its SuperSpeed USB (USB 3.0)...

IC packager Lingsen shares up on increased InvenSense orders, says report

Newswatch - Apr 7, 14:34

InvenSense, which supplies MEMS gyroscopes for the Nintendo 3DS, is expected to increase its orders to backend partner Lingsen Precision Industries due to strong demand for the recently-launched...

Commentary: TI triggers new competition in analog IC market

Apr 7, 11:00

After dedicating its own 12-inch wafer fab to the production of analog ICs, TI has taken over National Semiconductor (NS), with the aim of boosting its share in the global market...

TI to acquire National Semiconductor for US$6.5 billion

Apr 6, 11:21

Texas Instruments (TI) has signed a definitive agreement to purchase National Semiconductor in an all-cash transaction of about US$6.5 billion. Both companies will operate independently...

Spansion increases outsourcing proportion to SMIC, says paper

Newswatch - Mar 30, 15:52

NOR chip vendor Spansion will increase the proportion of its outsourcing to Semiconductor Manufacturing International Corporation (SMIC) to avoid potential supply chain disruptions,...

Japan earthquake impacts auto industry, says IHS

Mar 24, 14:51

The earthquake and subsequent tsunami have impacted the entire automotive industry supply chain in Japan, including the infotainment segment, according to IHS iSuppli. This will have...

Digitimes Insight: Sony, Renesas, TI impacted by earthquake for supply of ODD components

Mar 23, 12:12

Sony, Renesas Electronics and Texas Instruments (TI), among makers of components of optical disc drives (ODDs) in Japan, have suffered the most impact of the large earthquake hitting...

Sony, Renesas, TI impacted by earthquake for supply of ODD components

Integrated mobile processors to challenge standalone application processors, says Petrov Group (part 2)

Mar 16, 12:19

Recently several handset IC companies have announced integrated mobile processors – products that integrate baseband processor and application processor together with graphics...

Japan earthquake damages factories, says TI

Mar 15, 13:35

Texas Instruments (TI) has said that its manufacturing site in Miho, Japan, about 40 miles northwest of Tokyo, suffered substantial damage during the recent earthquake.

Standalone application processors are wining in mobility markets, says Petrov Group (part 1)

Mar 8, 15:40

Several years ago there was a widely accepted expectation that application mobile processors would be fully integrated with baseband processors on a single chip. However, today we...

Pico projectors and personal projectors show increasing popularity of DLP models, says PMA

Mar 1, 16:50

Consumers of front projectors from the US storefronts and direct marketers (web and catalog) are increasingly choosing smaller, sub-500 lumen brightness, "New Era" projectors,...

USB 3.0 interface to become mainstream sooner or later: Q&A with Dan Harmon, interface product marketing manager, Texas Instruments

Feb 23, 15:32

Texas Instruments (TI) is actively venturing into the USB 3.0 interface market for notebooks, desktops and smartphones as rival Renesas Electronics is still thriving in the segment...

Dan Harmon, interface product marketing manager, TI

More handset makers to launch dual-core models

Jan 27, 01:20

Most major handset makers all plan to launch dual-core smartphones in 2011 as Nvidia, Qualcomm, Samsung Electronics, Texas Instruments (TI) and Broadcom have come out with dual-core...

CES 2011: RIM showcases PlayBook tablet PC

Jan 7, 16:33

RIM is showcasing its PlayBook tablet PC at Consumer Electronics Show (CES) 2011 and the company will mainly push the device's multi-tasking capability as the main promoting point...

CES 2011: RIM PlayBook tablet PC

CES 2011: Microsoft announces support of SoC architectures for next-generation Windows

Jan 6, 14:41

Microsoft has announced at Consumer Electronics Show (CES) 2011, that the next version of Windows will support system on a chip (SoC) architectures, including ARM-based systems from...

Steven Sinofsky, president, Microsoft Windows and Windows Live Division, announces the next version

CES 2011: TI announces DLP Pico HD chipset

Jan 6, 13:08

At the International Consumer Electronics Show (CES), Texas Instruments (TI) has unveiled a new era for portable high definition (HD) entertainment with the new DLP Pico HD chipset...

CES 2011: DLP Pico technology lights up new, on-the-go possibilities

Jan 6, 13:07

Texas Instruments (TI) DLP Products has announced that more than 30 DLP Pico-enabled products, covering a wide variety of useful and unique form factors, will be on display by the...

Outsourcing of IC backend services growing

Dec 30, 12:38

IDMs including Microchip Technology, NXP Semiconductors, STMicroelectronics and Texas Instruments (TI) have all increased outsourcing for their backend production since the fourth...

TI capacity expansion to benefit wafer probing company Ardentec

Dec 28, 01:00

More than 50% of Ardentec's revenues now come from IDM clients, especially from major client Texas Instruments (TI). Ardentec, a wafer probing service provider, indicated that orders...

Leveraging flexible pricing: Q&A with TI Taiwan GM Robin Chen

Nov 19, 16:29

Speculation has circulated in Taiwan that Texas Instruments' (TI) 12-inch wafer foundry plant, which is about to enter volume production for analog chips, will allow the chip vendor...

TI Taiwan GM Robin Chen

Li-Ion/Poly batteries drive high growth of battery management ICs from headsets to electric vehicles, says Petrov Group

Oct 21, 16:10

The requirement for power-efficient and high performance solutions in Li-Ion/Poly battery-powered devices and equipment continues to open profitable growth opportunities for existing...

TI reportedly to slash analog IC prices

Oct 15, 14:25

Texas Instruments (TI) reportedly plans to cut prices for its analog ICs again soon following a reduction launched in August – a move which is design to counter the aggressive...

TI expects shipments of DLP 3D Ready chips to reach 2-3 million units in 2011

Sep 2, 17:01

Texas Instruments (TI) vice president of DLP business Kent Novak at a conference has commented that the company's shipments of DLP 3D Ready chips will increase to 2-3 million units...

Texas Instruments (TI) vice president of DLP business Kent Novak

Thirty billion power conversion ICs enable power management applications, says Petrov Group

Aug 24, 13:53

The analog power conversion IC segment dominates the power management market; it accounts for about 30 billion units and US$11 billion revenues with a forecast average growth rate...

Power management ICs in portable devices represent nearly 40% of total analog IC revenues, says Petrov Group

Aug 10, 15:20

The annual unit growth rate for portable devices is estimated at more than 12%, from about two billion in 2008 to over 3.4 billion devices in 2013. These devices have an increasing...

STM is the market share leader in ESD and EMI protection devices, says Petrov Group

Aug 2, 15:03

The market for electro-static discharge (ESD) and electromagnetic interference (EMI) protection devices is nearly invisible. However, it is a large (US$6 billion and 16+ billion unit...

UMC buys 12-inch tools from TI

Jul 16, 10:30

United Microelectronics Corporation (UMC) has announced that it is looking to further increase its production capacity with the purchase of numerous 12-inch CMOS chip manufacturing...

TI buys fab from Spansion Japan, continues analog production expansion

Jul 15, 16:39

Texas Instruments (TI) has acquired two wafer fabs and manufacturing equipment located in Aizu-Wakamatsu, Japan, from Spansion Japan for an undisclosed sum, according to the company...

100 items [2/3]
  • TI+DLP+LightCrafter+Display

    TI DLP LightCrafter Display

    Texas Instruments (TI) has developed a new 0.2-inch DLP2000 chipset and US$99 DLP LightCrafter Display 2000 evaluation module (EVM), making it more affordable to leverage DLP technology...

    Photo: Company, Sep 15.

  • TI%2DInnovator+Rover

    TI-Innovator Rover

    Texas Instruments (TI) has announced the TI-Innovator Rover, the company's first robotics solution for middle and high school students that makes learning STEM subjects a moving experience...

    Photo: Company, Sep 15.

  • CES+2011%3A+RIM+PlayBook+tablet+PC

    CES 2011: RIM PlayBook tablet PC

    RIM showcased its PlayBook tablet PC with multi-tasking capability at CES 2011 and the company will target mainly the enterprise market. The PlayBook features a 7-inch panel and...

    Photo: Yen-Shyang Hwang, Jan 10.

  • Vivitek+D8300+full+HD+home+theater+projector+

    Vivitek D8300 full HD home theater projector

    Vivitek is showcasing its full HD home theater projectors at the CEDIA 2010. The D8300 features 1080p resolution, 6500 lumens brightness and 2000:1 contrast ratio. The projecter...

    Photo: company, Sep 29.

  • TI+TPS92010+reference+board+for+general+LED+lighting

    TI TPS92010 reference board for general LED lighting

    Texas Instruments (TI) has introduced a complete LED lighting driver reference board in collaboration with Lemnis Lighting. The TPS92010 LED-lamp reference board applies TI's semiconductor...

    Photo: Company, Apr 16.

UMC
Global AP demand forecast, 2017-2020

20-Oct-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
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    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.