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News tagged teardown
  • Last update: Wednesday 20 March 2013 [12 news items]

Samsung Galaxy S4 carries US$236 bill of materials, IHS teardown reveals

Mar 20, 13:45

The HSPA+ version of Samsung Electronics' Galaxy S4 smartphone carries a US$236 bill of materials (BOM), up significantly from the Galaxy S3, due to major upgrades in the display,...

Microsoft Surface RT more profitable than iPad, IHS teardown reveals

Nov 6, 11:22

The Microsoft Surface RT model with the minimum 32GB of NAND flash memory and an optional black Touch Cover carries a bill of materials (BOM) of US$271, an IHS iSuppli teardown analysis...

IHS teardown reveals many iPhone 5 components change, but most suppliers remain the same

Sep 26, 10:32

A physical teardown of the iPhone 5 confirms the bill of materials (BOM) and manufacturing cost reported last week in an IHS iSuppli virtual teardown. The low-end model with 16GB...

Low-end Google Nexus 7 carries US$152 BOM, IHS teardown reveals

Jul 12, 14:33

The entry-level 8GB version of Google's new Nexus 7 media tablet carries a bill of materials (BOM) of US$151.75, according to preliminary findings from the IHS iSuppli Teardown Analysis...

New iPad costs more to produce, IHS teardown reveals

Mar 20, 15:49

The new iPad, equipped with 32GB of NAND flash memory and 4G LTE wireless capability, carries a bill of materials (BOM) of US$364.35, according to a teardown analysis by IHS iSuppli...

Samsung cuts LTE chip cost by half, ABI Research teardown reveals

Feb 7, 14:46

The Samsung Galaxy Nexus made a big impact on the market in December 2011, thanks to its sleek design, new Android OS (Ice Cream Sandwich) and NFC capability. The smartphone has another...

Kindle Fire teardown reveals cost-saving design, says IHS

Nov 18, 16:32

The IHS iSuppli Teardown Analysis Service has commenced its physical dissection of the Amazon Kindle Fire media tablet and soon will release its preliminary estimate of the device's...

Teardown of HTC ThunderBolt provides insights on rumored LTE iPhone, says IHS iSuppli

Jul 11, 15:58

If the rumors are true that the next-generation iPhone will support 4G LTE, the new Apple smartphone likely will be significantly more expensive to make than the current iPhone 4...

Nokia N8 smartphone matches iPhone 4 costs, iSuppli says

Oct 14, 09:00

Despite major differences in features and component selection, Nokia's new N8 smart phone carries a Bill of Materials (BOM) cost nearly identical to that of the iPhone 4, according...

Motorola Droid costs US$187.75, says iSuppli

Jan 15, 12:30

Motorola's Droid smartphone carries a US$187.75 bill of materials (BOM) and manufacturing cost, according to a dissection conducted by iSuppli.

Google Nexus One carries US$174.15 materials cost, says iSuppli

Jan 11, 14:37

The Nexus One, sold with the Google brand name but manufactured by High Tech Computer (HTC), carries a bill of materials (BOM) of US$174.15, based on a preliminary estimate from iSuppli...

BlackBerry Storm carries combined BOM and manufacturing cost of US$202, iSuppli estimates

Feb 2, 10:41

The BlackBerry Storm 9530 from Research in Motion (RIM) carries a combined materials and manufacturing cost of US$202.89, according to a teardown conducted by iSuppli. This cost includes...

Trends and forecast for 2013 touch panel market

24-May-2013 markets closed

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Trends in China LED chip and packaging sector
  • 2H 2012 global TFT panel market forecast

    Digitimes Research predicts there will be a total of 389 million large-sized TFT LCD panels shipped in 2H12, with 195 million in the third quarter and 194 million in the fourth quarter - with the total representing a 7.6% increase over the first half of this year.

  • Trends and shipment forecast for 2H 2012 smartphone market

    Smartphone shipments in 2010 and 2011 both enjoyed growth of more than 60%. Growth will decelerate in 2012 due to the high base, as well as a slowdown in consumer spending in Western Europe.

  • Trends in Asia LED chip manufacturing industry

    Asia is playing an ever more important role in upstream LED chip manufacturing. The region accounted for 80% of MOCVD demand in 2011 and will account for 90% in 2012, largely because Taiwan, Japan, South Korea and China are the major global centers for LED chip production.