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Thursday 14 August 2014
Photoimageable coverlay: A new FPCB non-rigid material that enhances hole-plugging with no glue overflow and 0.025mm alignment accuracy
Polyimide (PI) film coverlays are an important material that protects the bendable circuits on flexible printed circuit boards (FPCBs) from being damaged by high temperatures, moistures,...
Thursday 3 October 2013
Photo-imageable coverlays can replace polyimide films
Photo-imageable coverlays (PICs) provide a solution for mass production of flexible HDI (high-density interconnect) boards. PICs are similar to solder masks used in rigid printed...
Monday 22 April 2013
The possibility of using PIC in CSP process
Can photoimageable coverlay (PIC) be adopted for chip scale package (CSP) process, replacing the commonly used dry film to solve the problem of a multilayer chip's insulation layer...
Monday 18 March 2013
Discovering the trends of flexible electronics: FPCB output value is estimated to grow to US$11.63 billion in 2013, up 8.9% from 2012
In a research report on the global flexible circuit board (FPCB) industry from PR Newswire in 2013, Reportlinker.com pointed out that 2012 was an excellent year for FPCB makers as...
Tuesday 22 January 2013
FPC makers testing PICs, eyeing new opportunities: Taiwan-based FPC solder mask maker steps up R&D for PICs
Flexible printed circuit (FPC) coverlays are meant to overlay and protect the fine circuits, giving them flexibility and sheltering them from damage by temperatures, humidity, pollutants...
Friday 28 September 2012
Strong smartphone demand boosts FPCB industry
The Apple iPhone has ignited consumer demand worldwide for 3G smartphones, but many consumers are unaware that Taiwan-based flexible printed circuit board (FPCB) makers have made...
Friday 14 September 2012
Silicon Valley Mercury News visits Taiwan to better understand role of handset FPCB solder masks
San Jose Mercury News, an influential English-language newspaper in the San Francisco Bay Area, was established in 1983 through the merger of San Jose Mercury (founded...
Friday 4 May 2012
DTF 2012 Ultra Mobile & Ecosystem Forum: Trends Towards Thinner and Lighter Devices
To accommodate the trend of thinner and lighter consumer electronics products, Ultrabook standards clearly define the specifications and requirements, such as short boot time, all-time...
Wednesday 20 October 2010
DTF Taiwan LED Supply Chain Technology Forum: Exploring new technology of LED heat dissipation
LED heat dissipation is a much more serious issue than thermal conductivity to the extent that it remains a major bottleneck for systems so far. With in-house developed technology,...
Friday 25 June 2010
Trends in flexible ceramic thermal conductive adhesive applications
Thermal management has always been of critical importance in the high tech industry, but it has taken on an even more critical value as energy savings has become more important due...
Tuesday 16 June 2009
Taiwan companies gearing up for touch panel market
More Taiwan companies have entered the touch panel market where strong growth is expected to be generated by the upcoming Windows 7, according to industry sources. IC distributors...
Tuesday 21 October 2008
Demand for FPCB is increasing; Taiwan solder mask market to grow with better cost competitiveness
Japan is still a more major market than Taiwan for raw materials for flexible PCB (FPCB), but Taiwan, with less than 10% self-sufficiency on ductile solder mask, has been striving...
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Summary of Tech Supply Chain News!
NPUs to become new AI accelerator chip option for edge devices, says DIGITIMES Research
Operation O-RAN: The US plan to neutralize Huawei (and why it will work)
DIGITIMES Insight: Nvidia's path to US$100 billion in sales