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News tagged SPIL
  • Last update: Tuesday 19 August 2014 [259 news items]

High-end IC backend demand to pick up in 2H13, says SPIL chair

Jun 14, 16:09

Demand for high-end IC packaging and testing is expected to pick up in the second half of 2013 and enjoy sequential growth through the last quarter of the year, thanks to a pull-in...

SPIL chairman Bough Lin

ASE IC backend unit posts record revenues in May

Jun 10, 22:35

Sales of Advanced Semiconductor Engineering's (ASE) core ATM (assembly test and material) business increased 6.3% sequentially and 12.2% from a year ago to NT$12.41 billion (US$419...

SPIL to hike capex budget for 2013

May 29, 22:15

IC backend service company Siliconware Precision Industries (SPIL) has decided to hike its capex budget for 2013 to NT$14.9 billion (US$496.14 million), up nearly 32% from NT$11.3...

Worldwide semiconductor assembly and testing revenues up 2% in 2012, says Gartner

May 3, 15:13

The worldwide semiconductor assembly and test services (SATS) market totaled US$24.5 billion in 2012, a 2.1% increase from 2011, according to Gartner.

Supply for high-end IC packaging to fall short in 2H13, says SPIL chair

May 2, 14:49

Supply for high-end IC packaging is likely to fall short of demand during the second half of 2013, according to Bough Lin, chairman for Siliconware Precision Industries (SPIL). SPIL...

SPIL chairman Bough Lin

ASE, SPIL 2Q13 sales outlook optimistic

Apr 18, 22:10

Market watchers are more optimistic about the IC packaging and testing business in the second quarter of 2013, judging from a rosy outlook provided by TSMC for the quarter. Sales...

ASE, SPIL March sales rebound

Apr 9, 15:35

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their monthly revenues rebound to a sequential growth track in March 2013...

SPIL to deal out cash dividend of NT$1.67 for 2012

Mar 22, 15:39

Taiwan-based IC packaging and testing service provider Siliconware Precision Industries (SPIL) will distribute a cash dividend per share of NT$1.67 for 2012.

ASE, SPIL to see sales rebound in March

Mar 8, 15:04

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both have reported decreased sales for February, but their sales are expected to gain momentum...

Altera, Xilinx to switch from TSMC CoWoS process to PoP packaging for next-generation chips, says paper

Newswatch - Mar 4, 12:18

Altera and Xilinx both have decided to adopt PoP (package on package) packaging technology for its next-generation chips, instead of using chip-on-wafer-on-substrate (CoWoS) process...

Digitimes Research: Taiwan IC backend production value to outperform global industry

Feb 26, 15:42

Production value of Taiwan's dedicated semiconductor packaging and testing industry is forecast to grow 4.9% to US$13.88 billion in 2013, while the global industry will generate a...

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Equipment maker GPTC posts significant revenue and profit growth in January

Feb 26, 14:51

Buoyed by its recent acquisition of a chemical material supplier, as well as brisk demand from IC foundries, Grand Plastic Technology (GPTC) has reported significant on-year growth...

Mobile IC vendors asking to renegotiate backend quotes for 28nm products

Feb 26, 13:46

The available capacity for 28nm mobile chips at IC foundries, mainly Taiwan Semiconductor Manufacturing Company (TSMC), has become sufficient to meet demand since early 2013. Suppliers...

IC backend firms to suffer setback in January-February, says SPIL chair

Jan 31, 12:15

IC packaging and testing companies will suffer setbacks in revenues during January and February because of inventory adjustments at clients, as well as fewer working days due to the...

SPIL chairman Bough Lin

ASE, SPIL to stop ramping copper wirebonding capacity

Jan 31, 11:03

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both stated that they will stop ramping up capacity for copper wire-bonding. Instead, raising...

ASE, SPIL 1Q13 sales likely to drop 10% or more

Jan 28, 20:58

Sales at IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will likely register sequential decreases of 10% or more...

ASE, SPIL 4Q12 sales miss guidance

Jan 10, 14:09

Packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their core business revenues miss their guidance of 2-5%...

SPIL approves NT$11.3 billion for 2013 capex

Dec 21, 11:29

The board of directors of IC packager Siliconware Precision Industries (SPIL) has approved plans to budget NT$11.3 billion (US$389 million) in capex for 2013, which is lower than...

ASE, SPIL to post mixed results for December

Dec 18, 14:08

The top-two Taiwan-based IC backend services companies, Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), are expected to report mixed results...

IC backend services firms to ride high as TSMC ramps capex for 2013, say sources

Dec 17, 21:37

Taiwan-based IC backend services companies will benefit from an increase in capital expenditure (capex) by Taiwan Semiconductor Manufacturing Company (TSMC) in 2013, according to...

iPhone 5 yield rates improving, say sources

Dec 5, 14:44

Yield rates for the production of iPhone 5 in the supply chain appear to have improved recently, as Apple has shortened the standby period for pre-sale orders in the US and Europe...

SPIL October sales highest for 2012

Nov 6, 14:34

Consolidated revenues at Siliconware Precision Industries (SPIL) in October hit the highest monthly level thus far in 2012, according to statistics released by the Taiwan-based IC...

ASE, SPIL sing different tune for 4Q12

Oct 31, 21:52

Advanced Semiconductor Engineering (ASE) expects its shipments to grow 3-5% in the fourth quarter of 2012, while fellow company Siliconware Precision Industries (SPIL) is looking...

SPIL expects 4Q12 revenues to stay flat or drop slightly

Oct 31, 13:57

IC packager Siliconware Precision Industries (SPIL) expects its consolidated revenues to stay flat or drop by up to 3% sequentially in the fourth quarter of 2012, due to weak demand...

SPIL chairman Bough Lin conservative about company performance in 4Q12

ASE, SPIL to perform rather strongly in 4Q12

Oct 23, 22:11

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will perform relatively strongly in the fourth quarter of 2012 thanks to 28nm orders from Qualcomm...

ASE posts revenue gains in September as SPIL stays flat

Newswatch - Oct 11, 16:05

Advanced Semiconductor Engineering (ASE) has reported consolidated revenues of NT$17.06 billion (US$580.27 million) for September, up 5% sequentially and 10.6% on year.

ASE, SPIL October sales to rise

Oct 2, 01:35

IC backend service companies Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) will both see their October revenues continue to rise sequentially thanks...

packager

Rising value of NT dollar to affect performance of IC backend service firms

Sep 26, 14:40

The rising price of gold and the appreciation of the NT dollar, triggered by the launch the US Federal Reserve's third round of the quantitative easing (QE3) is expected to weigh...

IC backend service providers look to strong revenue gains in September

Sep 18, 01:25

IC backend service companies, including Advanced Semiconductor Engineering (ASE), Silicon Precision Industries (SPIL), King Yuan Electronics (KYEC) and Sigurd Microelectronics, all...

Demand for copper wirebonding machines to slide 50% sequentially in 4Q12

Sep 12, 01:40

Demand for copper wirebonding machines from IC backend service companies is expected to decline 50% in the fourth quarter of 2012 as compared to purchases in the third quarter, according...

IC backend service firms to ramp up investments in 2012

Sep 5, 01:30

Most Taiwan-based IC packaging and testing firms including Advanced Semiconductor Engineering (ASE), Silicon Precision Industries (SPIL) and Powertech Technology (PTI) all plan to...

Taiwan copper wirebonding production value to rise

Sep 3, 12:11

The production value of Taiwan's copper wirebonding segment is expected to rise along with demand over the next three years, according to sources at equipment suppliers.

ASE, SPIL see small growth in July revenues

Aug 8, 01:00

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), two Taiwan-based providers of IC packaging and testing service, saw consolidated revenues of...

Major IC packagers step up 2012 capex

Aug 6, 15:41

Advanced Semiconductor Engineering (ASE), Amkor Technology and Siliconware Precision Industries (SPIL) – the world's leading packaging and testing houses – have all set...

ASE, SPIL make progress in transition to copper wire bonding

Jul 31, 16:12

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...

259 items [2/8]
  • SPIL+anticipates+3Q+revenues+to+exceed+NT%2410+billion

    SPIL anticipates 3Q revenues to exceed NT$10 billion

    Bough Lin, chairman of SPIL, stated the company's BGA packaging lines are currently tight. The chip packaging and testing firm plans to install additional 700 fine-pitch wire bonders...

    Photo: Allen Lin, DigiTimes, Jul 29.

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