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News tagged SPIL
  • Last update: Wednesday 26 August 2015 [281 news items]

SPIL expects 1Q14 revenues to drop 4-8%

Jan 27, 20:40

IC backend house Siliconware Precision Industries (SPIL) has forecast consolidated revenues for the the first quarter of 2014 will decrease 4-8% sequentially, as production utilization...

ASE, SPIL to post mixed results for 1Q14

Jan 21, 12:10

IC packaging and testing service providers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to report a 10-15% decline and flat growth,...

SPIL, KYEC post slight drops in 4Q13 sales

Jan 10, 15:40

Consolidated sales at IC packaging and testing houses Siliconware Precision Industries (SPIL) and King Yuan Electronics Company (KYEC) registered sequential drops of 1.3% and 3.7%,...

ASE striving to resume normal operations at plant partially shut down over pollution

Stockwatch - Jan 9, 14:09

Advanced Semiconductor Engineering (ASE) is striving to resume normal operations at its K7 factory located in Kaohisung, southern Taiwan, which the company has been ordered to shut...

SPIL looks to strong performance in 4Q13 and 1Q14

Dec 31, 14:21

Siliconware Precision Industries (SPIL) is expected to perform better than expected in the fourth quarter of 2013 and the first quarter of 2014 as the IC backend service firm has...

IC backend service firms to ramp up bumping, WL-CSP capacities in 2014, say sources

Dec 31, 11:26

Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend...

ASE likely to lose orders as plants might shut down over toxic leaks

Dec 13, 10:23

One or more factories of Taiwan-based Advanced Semiconductor Engineering (ASE), the world's largest IC packaging house, might receive a government order to suspend operations for...

ASE, SPIL sales fall back in November

Dec 9, 15:32

Advanced Semiconductor Engineering's (ASE) sales of its core IC ATM (assembly test and material) business registered a 5.8% sequential decrease in November, while sales at fellow...

ASE, SPIL developing low-cost IC substrates

Dec 2, 10:35

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both developed low-cost IC substrates to satisfy demand from mobile chip suppliers, which...

ase

SPIL posts record revenues for October

Nov 6, 12:09

Siliconware Precision Industries (SPIL) saw its October consolidated revenues climb to an all-time high of NT$6.55 billion (US$222.7 million) for October 2013, representing growth...

SPIL posts strong earnings in 3Q13

Oct 31, 21:57

Siliconware Precision Industries (SPIL) has reported net profits of NT$2.18 billion (US$74.21 million) for the third quarter of 2013, up 25.5% on quarter and 41.1% on year. Third-quarter...

ASE September sales rise, SPIL flat

Oct 9, 16:04

Advanced Semiconductor Engineering (ASE) saw September sales of its core IC ATM (assembly test and material) business grow 4.1% on month, while fellow firm Siliconware Precision Industries...

SPIL 3Q13 revenues to stay flat or drop slightly in September

Sep 17, 22:13

Siliconware Precision Industries (SPIL) is expected to see its sales for September stay flat or drop slightly from August before bouncing up in the first half of October buoyed by...

Equipment suppliers expected to benefit from ASE, SPIL investment

Sep 13, 14:20

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will add investment to meet increasing orders in the second half of 2013, and this will bring...

SPIL posts record August sales

Sep 9, 14:30

Consolidated revenues at IC packager Siliconware Precision Industries (SPIL) grew 6.2% on month and 15.3% on year to an all time high of NT$6.51 billion (US$219.1 million) in August...

ASE, SPIL August sales to rise

Aug 22, 20:45

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to report 3-5% sequential increases in August revenues, thanks to brisk...

ASE, SPIL July sales up

Aug 8, 16:12

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported increases in July consolidated revenues from the previous month of...

SPIL optimistic about communications IC market in 2H13

Aug 1, 15:54

Siliconware Precision Industries (SPIL) chairman Bough Lin has expressed optimism that demand for communications ICs will be strong in the second half of 2013 on the back of brisk...

SPIL chairman Bough Lin

Poor smartphone sales cast shadow on SPIL 2H13 sales

Jul 18, 14:07

Disappointing sales of higher-end smartphones might have a negative impact on Siliconware Precision Industries' (SPIL) sales performance during the second half of 2013, according...

Smartphones to buoy SPIL, KYEC revenues in 3Q13

Jul 8, 16:13

IC demand for mobile devices particularly smartphones is expected to drive revenue growth at packaging and testing houses Siliconware Precision Industries (SPIL) and King Yuan Electronics...

SPIL chairman Bough Lin indicated previously that upcoming flagship phones and games consoles would

ASE, SPIL 3Q13 sales to be affected by slower sales of Galaxy S4

Jul 3, 21:59

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to see their sales for the third quarter of 2013 affected by reduced orders from...

SPIL expanding capacity for high-end ICs

Jun 17, 21:29

Siliconware Precision Industries (SPIL) has moved to expand production capacity at a fast pace for high-end IC packaging and testing in anticipation of robust demand for mobile communication...

SPIL chairman Bough Lin

High-end IC backend demand to pick up in 2H13, says SPIL chair

Jun 14, 16:09

Demand for high-end IC packaging and testing is expected to pick up in the second half of 2013 and enjoy sequential growth through the last quarter of the year, thanks to a pull-in...

SPIL chairman Bough Lin

ASE IC backend unit posts record revenues in May

Jun 10, 22:35

Sales of Advanced Semiconductor Engineering's (ASE) core ATM (assembly test and material) business increased 6.3% sequentially and 12.2% from a year ago to NT$12.41 billion (US$419...

SPIL to hike capex budget for 2013

May 29, 22:15

IC backend service company Siliconware Precision Industries (SPIL) has decided to hike its capex budget for 2013 to NT$14.9 billion (US$496.14 million), up nearly 32% from NT$11.3...

Worldwide semiconductor assembly and testing revenues up 2% in 2012, says Gartner

May 3, 15:13

The worldwide semiconductor assembly and test services (SATS) market totaled US$24.5 billion in 2012, a 2.1% increase from 2011, according to Gartner.

Supply for high-end IC packaging to fall short in 2H13, says SPIL chair

May 2, 14:49

Supply for high-end IC packaging is likely to fall short of demand during the second half of 2013, according to Bough Lin, chairman for Siliconware Precision Industries (SPIL). SPIL...

SPIL chairman Bough Lin

ASE, SPIL 2Q13 sales outlook optimistic

Apr 18, 22:10

Market watchers are more optimistic about the IC packaging and testing business in the second quarter of 2013, judging from a rosy outlook provided by TSMC for the quarter. Sales...

ASE, SPIL March sales rebound

Apr 9, 15:35

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their monthly revenues rebound to a sequential growth track in March 2013...

SPIL to deal out cash dividend of NT$1.67 for 2012

Mar 22, 15:39

Taiwan-based IC packaging and testing service provider Siliconware Precision Industries (SPIL) will distribute a cash dividend per share of NT$1.67 for 2012.

ASE, SPIL to see sales rebound in March

Mar 8, 15:04

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both have reported decreased sales for February, but their sales are expected to gain momentum...

Altera, Xilinx to switch from TSMC CoWoS process to PoP packaging for next-generation chips, says paper

Newswatch - Mar 4, 12:18

Altera and Xilinx both have decided to adopt PoP (package on package) packaging technology for its next-generation chips, instead of using chip-on-wafer-on-substrate (CoWoS) process...

Digitimes Research: Taiwan IC backend production value to outperform global industry

Feb 26, 15:42

Production value of Taiwan's dedicated semiconductor packaging and testing industry is forecast to grow 4.9% to US$13.88 billion in 2013, while the global industry will generate a...

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Equipment maker GPTC posts significant revenue and profit growth in January

Feb 26, 14:51

Buoyed by its recent acquisition of a chemical material supplier, as well as brisk demand from IC foundries, Grand Plastic Technology (GPTC) has reported significant on-year growth...

Mobile IC vendors asking to renegotiate backend quotes for 28nm products

Feb 26, 13:46

The available capacity for 28nm mobile chips at IC foundries, mainly Taiwan Semiconductor Manufacturing Company (TSMC), has become sufficient to meet demand since early 2013. Suppliers...

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  • SPIL+anticipates+3Q+revenues+to+exceed+NT%2410+billion

    SPIL anticipates 3Q revenues to exceed NT$10 billion

    Bough Lin, chairman of SPIL, stated the company's BGA packaging lines are currently tight. The chip packaging and testing firm plans to install additional 700 fine-pitch wire bonders...

    Photo: Allen Lin, DigiTimes, Jul 29.

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