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News tagged SPIL
  • Last update: Monday 6 July 2015 [273 news items]

ASE, SPIL developing low-cost IC substrates

Dec 2, 10:35

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both developed low-cost IC substrates to satisfy demand from mobile chip suppliers, which...

ase

SPIL posts record revenues for October

Nov 6, 12:09

Siliconware Precision Industries (SPIL) saw its October consolidated revenues climb to an all-time high of NT$6.55 billion (US$222.7 million) for October 2013, representing growth...

SPIL posts strong earnings in 3Q13

Oct 31, 21:57

Siliconware Precision Industries (SPIL) has reported net profits of NT$2.18 billion (US$74.21 million) for the third quarter of 2013, up 25.5% on quarter and 41.1% on year. Third-quarter...

ASE September sales rise, SPIL flat

Oct 9, 16:04

Advanced Semiconductor Engineering (ASE) saw September sales of its core IC ATM (assembly test and material) business grow 4.1% on month, while fellow firm Siliconware Precision Industries...

SPIL 3Q13 revenues to stay flat or drop slightly in September

Sep 17, 22:13

Siliconware Precision Industries (SPIL) is expected to see its sales for September stay flat or drop slightly from August before bouncing up in the first half of October buoyed by...

Equipment suppliers expected to benefit from ASE, SPIL investment

Sep 13, 14:20

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will add investment to meet increasing orders in the second half of 2013, and this will bring...

SPIL posts record August sales

Sep 9, 14:30

Consolidated revenues at IC packager Siliconware Precision Industries (SPIL) grew 6.2% on month and 15.3% on year to an all time high of NT$6.51 billion (US$219.1 million) in August...

ASE, SPIL August sales to rise

Aug 22, 20:45

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to report 3-5% sequential increases in August revenues, thanks to brisk...

ASE, SPIL July sales up

Aug 8, 16:12

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported increases in July consolidated revenues from the previous month of...

SPIL optimistic about communications IC market in 2H13

Aug 1, 15:54

Siliconware Precision Industries (SPIL) chairman Bough Lin has expressed optimism that demand for communications ICs will be strong in the second half of 2013 on the back of brisk...

SPIL chairman Bough Lin

Poor smartphone sales cast shadow on SPIL 2H13 sales

Jul 18, 14:07

Disappointing sales of higher-end smartphones might have a negative impact on Siliconware Precision Industries' (SPIL) sales performance during the second half of 2013, according...

Smartphones to buoy SPIL, KYEC revenues in 3Q13

Jul 8, 16:13

IC demand for mobile devices particularly smartphones is expected to drive revenue growth at packaging and testing houses Siliconware Precision Industries (SPIL) and King Yuan Electronics...

SPIL chairman Bough Lin indicated previously that upcoming flagship phones and games consoles would

ASE, SPIL 3Q13 sales to be affected by slower sales of Galaxy S4

Jul 3, 21:59

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are expected to see their sales for the third quarter of 2013 affected by reduced orders from...

SPIL expanding capacity for high-end ICs

Jun 17, 21:29

Siliconware Precision Industries (SPIL) has moved to expand production capacity at a fast pace for high-end IC packaging and testing in anticipation of robust demand for mobile communication...

SPIL chairman Bough Lin

High-end IC backend demand to pick up in 2H13, says SPIL chair

Jun 14, 16:09

Demand for high-end IC packaging and testing is expected to pick up in the second half of 2013 and enjoy sequential growth through the last quarter of the year, thanks to a pull-in...

SPIL chairman Bough Lin

ASE IC backend unit posts record revenues in May

Jun 10, 22:35

Sales of Advanced Semiconductor Engineering's (ASE) core ATM (assembly test and material) business increased 6.3% sequentially and 12.2% from a year ago to NT$12.41 billion (US$419...

SPIL to hike capex budget for 2013

May 29, 22:15

IC backend service company Siliconware Precision Industries (SPIL) has decided to hike its capex budget for 2013 to NT$14.9 billion (US$496.14 million), up nearly 32% from NT$11.3...

Worldwide semiconductor assembly and testing revenues up 2% in 2012, says Gartner

May 3, 15:13

The worldwide semiconductor assembly and test services (SATS) market totaled US$24.5 billion in 2012, a 2.1% increase from 2011, according to Gartner.

Supply for high-end IC packaging to fall short in 2H13, says SPIL chair

May 2, 14:49

Supply for high-end IC packaging is likely to fall short of demand during the second half of 2013, according to Bough Lin, chairman for Siliconware Precision Industries (SPIL). SPIL...

SPIL chairman Bough Lin

ASE, SPIL 2Q13 sales outlook optimistic

Apr 18, 22:10

Market watchers are more optimistic about the IC packaging and testing business in the second quarter of 2013, judging from a rosy outlook provided by TSMC for the quarter. Sales...

ASE, SPIL March sales rebound

Apr 9, 15:35

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their monthly revenues rebound to a sequential growth track in March 2013...

SPIL to deal out cash dividend of NT$1.67 for 2012

Mar 22, 15:39

Taiwan-based IC packaging and testing service provider Siliconware Precision Industries (SPIL) will distribute a cash dividend per share of NT$1.67 for 2012.

ASE, SPIL to see sales rebound in March

Mar 8, 15:04

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both have reported decreased sales for February, but their sales are expected to gain momentum...

Altera, Xilinx to switch from TSMC CoWoS process to PoP packaging for next-generation chips, says paper

Newswatch - Mar 4, 12:18

Altera and Xilinx both have decided to adopt PoP (package on package) packaging technology for its next-generation chips, instead of using chip-on-wafer-on-substrate (CoWoS) process...

Digitimes Research: Taiwan IC backend production value to outperform global industry

Feb 26, 15:42

Production value of Taiwan's dedicated semiconductor packaging and testing industry is forecast to grow 4.9% to US$13.88 billion in 2013, while the global industry will generate a...

Image

Equipment maker GPTC posts significant revenue and profit growth in January

Feb 26, 14:51

Buoyed by its recent acquisition of a chemical material supplier, as well as brisk demand from IC foundries, Grand Plastic Technology (GPTC) has reported significant on-year growth...

Mobile IC vendors asking to renegotiate backend quotes for 28nm products

Feb 26, 13:46

The available capacity for 28nm mobile chips at IC foundries, mainly Taiwan Semiconductor Manufacturing Company (TSMC), has become sufficient to meet demand since early 2013. Suppliers...

IC backend firms to suffer setback in January-February, says SPIL chair

Jan 31, 12:15

IC packaging and testing companies will suffer setbacks in revenues during January and February because of inventory adjustments at clients, as well as fewer working days due to the...

SPIL chairman Bough Lin

ASE, SPIL to stop ramping copper wirebonding capacity

Jan 31, 11:03

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both stated that they will stop ramping up capacity for copper wire-bonding. Instead, raising...

ASE, SPIL 1Q13 sales likely to drop 10% or more

Jan 28, 20:58

Sales at IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) will likely register sequential decreases of 10% or more...

ASE, SPIL 4Q12 sales miss guidance

Jan 10, 14:09

Packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their core business revenues miss their guidance of 2-5%...

SPIL approves NT$11.3 billion for 2013 capex

Dec 21, 11:29

The board of directors of IC packager Siliconware Precision Industries (SPIL) has approved plans to budget NT$11.3 billion (US$389 million) in capex for 2013, which is lower than...

ASE, SPIL to post mixed results for December

Dec 18, 14:08

The top-two Taiwan-based IC backend services companies, Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), are expected to report mixed results...

IC backend services firms to ride high as TSMC ramps capex for 2013, say sources

Dec 17, 21:37

Taiwan-based IC backend services companies will benefit from an increase in capital expenditure (capex) by Taiwan Semiconductor Manufacturing Company (TSMC) in 2013, according to...

iPhone 5 yield rates improving, say sources

Dec 5, 14:44

Yield rates for the production of iPhone 5 in the supply chain appear to have improved recently, as Apple has shortened the standby period for pre-sale orders in the US and Europe...

273 items [2/8]
Realtime news
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  • Intel defines 6 desktop market segments for CPU platforms, say Taiwan makers

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    Before Going to Press | Jul 28, 21:48

  • Demand for UV-A LEDs may take off in 2015, say Taiwan makers

    Before Going to Press | Jul 28, 21:47

  • PC replacement pushed by Windows 10 may come slowly, sat Taiwan makers

    Before Going to Press | Jul 28, 21:46

  • Taiwan IoT makers have to develop innovative applications to compete in global IoT market, says Acer founder

    Before Going to Press | Jul 28, 21:42

  • Epistar may suffer 3Q15 net loss per share of NT$0.18

    Before Going to Press | Jul 28, 21:41

  • Sony to launch new-generation optical discs in cooperation with Panasonic, says Nikkei

    Before Going to Press | Jul 28, 21:40

  • Taiwan accepts ITA 2

    Before Going to Press | Jul 28, 21:38

  • Baidu posts 2Q15 revenues of CNY16.58 billion

    Before Going to Press | Jul 28, 21:37

  • MediaTek 3Q15 sales to rise 15-20%

    Before Going to Press | Jul 28, 21:37

  • China IC backend firms reportedly obtain orders from Qualcomm, MediaTek

    Before Going to Press | Jul 28, 21:36

  • China-, Taiwan-based makers hike August prices for solar-grade polycrystalline silicon wafers

    Before Going to Press | Jul 28, 21:36

  • AUO expects weak panel demand in 2H15

    Before Going to Press | Jul 28, 21:34

  • Smartphone vendors uninterested in Windows 10, say Taiwan makers

    Before Going to Press | Jul 28, 21:34

  • E Ink and Netronix jointly invest in new development facilities

    Before Going to Press | Jul 28, 21:33

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  • SPIL+anticipates+3Q+revenues+to+exceed+NT%2410+billion

    SPIL anticipates 3Q revenues to exceed NT$10 billion

    Bough Lin, chairman of SPIL, stated the company's BGA packaging lines are currently tight. The chip packaging and testing firm plans to install additional 700 fine-pitch wire bonders...

    Photo: Allen Lin, DigiTimes, Jul 29.

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