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Wednesday 8 September 2010
Solder material maker Shenmao sets monthly sales record in August
Solder material vendor Shenmao Technology posted consolidated revenues of NT$635 million (US$19.86 million) in August 2010, up 0.4% sequentially and 17.33% on year for a new monthly...
Tuesday 31 August 2010
Solder material maker Shenmao plans 10% price rise
Shenmao Technology plans to raise the prices of its solder bumping paste products by 10% to reflect the rising prices for solder, according to the company.
Tuesday 16 March 2010
Solder material supplier Shenmao expects strong 2Q10
Shenmao Technology, a solder bumping paste supplier, has said revenues for the second quarter are expected to hold level or grow from the first quarter. Revenues for the ongoing first...
Monday 1 March 2010
Shenmao sees PV ribbon capacity short of order volumes
Shenmao Technology began production of PV ribbons used in the assembly of solar cells into PV modules in 2009 and has received orders in excess of its existing production capacity,...
Wednesday 10 February 2010
Solder material supplier Shenmao enjoys sequential revenue growth in January
Shenmao Technology, a solder bumping paste supplier, has announced consolidated revenues for January 2010 grew 8.27% sequentially and 132.06% on year to NT$534 million (US$17 million)...
Thursday 19 November 2009
Solder material maker Shenmao expects revenues in 2010 to grow 20% on year
Taiwan-based solder material maker Shenmao Technology expects its revenues in 2010 to grow 20% and reach a record high compared to 2009.
Tuesday 3 November 2009
Taiwan-based solder material maker Shenmao sees high net profits in 3Q09
Taiwan-based solder material maker Shenmao Technology posted record net profits of NT$148 million (US$4.5 million) in the third quarter of 2009 mainly due to orders for BGA spheres...
Thursday 8 October 2009
Solder sphere maker Shenmao sees revenues hit year-high in September
Taiwan-based ball-grid array (BGA) solder sphere maker Shenmao Technology saw its consolidated revenues increase 6.4% sequentially to hit a year-high of NT$575 million (US$17.86 million)...
Friday 11 September 2009
Shenmao expands BGA solder sphere capacity by 70%
Shenmao Technology has expanded its production capacity of ball-grid array (BGA) solder spheres, its main product line, by 70% to meet orders from new clients, according to the com...
Tuesday 12 May 2009
Solder paste supplier Shenmao expected to see 40-50% revenue growth in 2Q09
Shenmao Technology is optimistic about its second-quarter outlook, and market watchers expect its revenues to grow 40-50% in the quarter, with strong sales of solder paste and ball-grid...
Monday 30 March 2009
Material supplier Shenmao adds two customers for BGA solder spheres
Material supplier Shenmao Technology received orders for ball-grid array (BGA) solder spheres from two connector customers earlier in March and will begin volume shipments in April,...
Tuesday 10 February 2009
Stable solder prices help increase Shenmao margin
Solder prices have stayed around US$11,000 per ton for 3-4 months, helping increase electronic material supplier Shenmao Technology's gross margin. Shenmao expects to see better performance...
Wednesday 31 December 2008
Shenmao expects cartronics to drive lead-free solder paste shipments
Shenmao Technology's lead-free solder paste is being validated by clients from the electonics manufacturing service (EMS) and cartronics sectors, two of the new market segments that...
Tuesday 16 September 2008
Shenmao ships PV ribbons ahead of time
According to market watchers, Shenmao Technology, a bumping solder paste supplier, has shipped cartronics solder pastes to a European car component manufacture, successfully entering...
Tuesday 19 August 2008
Shenmao profits jump on lower raw material costs
After dealing with rising raw material costs and exchange loss in the first quarter, Shenmao Technology, the number-one bumping solder paste supplier in Taiwan, had 272% sequential...
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