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News tagged SEMI
  • Last update: Thursday 18 December 2014 [241 news items]

Lite-On Semi upbeat about 3Q10

Jul 6, 15:11

Lite-On Semiconductor, a CMOS image sensor (CIS) and discrete-IC specialist, has pointed out that the company's order momentum remains strong. Revenues for the third quarter will...

SEMI, SEAJ book-to-bill ratios stay strong in May 2010

Jun 21, 10:37

Japan's semiconductor production equipment manufacturers posted a book-to-bill ratio of 1.13 in May 2010, up from 1.07 in April, according to the Semiconductor Equipment Association...

SEMI approves Taiwan FPD standards

Jun 11, 16:20

SEMI today announced the publication of four new FPD standards that originated from the Taiwan FPD Committee. Although Taiwan has previously contributed to standards efforts led by...

Chip equipment billings up 32% sequentially in 1Q10, says SEMI

Jun 9, 15:18

SEMI has reported that worldwide semiconductor manufacturing equipment billings reached US$7.46 billion in the first quarter of 2010. The billings figure is 32% higher than that in...

North America chip-gear orders up 8% in April 2010, says SEMI

May 21, 14:01

North America-based manufacturers of semiconductor equipment posted US$1.44 billion in orders in April (three-month average basis), up 8.1% from the revised level of US$1.33 billion...

Silicon wafer shipments up 5% in 1Q10, says SEMI

May 14, 13:52

Worldwide silicon wafer area shipments increased to 2,214 million square inches in the first quarter of 2010, a 5% increase from the 2,109 million square inches shipped during the...

North America chip gear book-to-bill ratio at 1.19 in March 2010, says SEMI

Apr 21, 11:50

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.19 in March 2010, having been above parity for nine months in a row.

Chip-gear book-to-bill almost flat in February 2010

Mar 21, 15:34

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.22 in February 2010 compared to 1.23 in January, according to SEMI.

Global semiconductor materials sales drop to US$34.6 billion in 2009, says SEMI

Mar 18, 11:06

The global semiconductor materials market contracted 19% in 2009 compared to 2008 as the semiconductor industry reacted quickly to deteriorating market conditions in the first part...

Chip market scale in China to double in 2010, says SEMI CEO

Mar 17, 12:14

The worldwide semiconductor equipment market will grow 47% in 2010, and the growth in China will be more than 100%, according to Stanley Myers, president and CEO of SEMI, speaking...

Global semiconductor equipment sales down 46% in 2009, says SEMI

Mar 11, 17:06

Worldwide sales of semiconductor manufacturing equipment totaled US$15.92 billion in 2009, representing a 46% decline compared to US$29.52 billion posted in 2008, according to SEMI...

Fab spending heads for 88% growth in 2010, says SEMI

Mar 5, 14:20

Spending on worldwide fab projects, including construction, facilities and equipping, in 2010 could grow by 88% over 2009 levels, according to SEMI. The industry association previously...

Silicon wafer shipments bounce back in 2H09, says SEMI

Feb 24, 15:45

Worldwide silicon wafer area shipments decreased by 18% in 2009 when compared to 2008 area shipments, according to SEMI. The slide indicates improvement compared with the first half...

North America chip equipment orders top US$1 billion in January 2010, says SEMI

Feb 22, 10:12

North America-based manufacturers of semiconductor equipment posted US$1.13 billion in orders in January 2010 (three-month average basis) and a book-to-bill ratio of 1.20, according...

Survey highlights more IC suppliers consider switch to copper wire, says SEMI

Jan 28, 14:19

An increasing number of fabless chip companies and IDMs are considering copper wire for some new products, though a number of issues exist regarding this transition, according to...

North American chip-gear industry posts book-to-bill ratio of 1.03 in December 2009, says SEMI

Jan 22, 12:15

North America-based manufacturers of semiconductor equipment posted US$863.3 million in orders in December 2009 (three-month average basis) and a book-to-bill ratio of 1.03, according...

Japan chip gear book-to-bill slips to 1.18 in November 2009

Dec 18, 14:09

Japan-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.18 in November 2009 compared to the prior month's level of 1.28, according to Semiconductor Equipment...

Chip equipment bookings back on growth track in 3Q09, says SEMI

Dec 18, 12:17

Global semiconductor manufacturing equipment bookings managed both sequential and on-year growth in the third quarter of 2009, according to SEMI. Billings for the quarter were still...

North America chip gear book-to-bill ratio at 1.06 in November 2009

Dec 18, 10:19

North America-based manufacturers of semiconductor equipment posted US$790.5 million in orders in November 2009 (three-month average basis) and a book-to-bill ratio of 1.06, according...

Chip equipment sales to grow over 2010 and 2011, says SEMI

Dec 4, 10:35

Worldwide semiconductor equipment sales are estimated to total US$16 billion in 2009, which indicates that the sector will post another significant decline of approximately 46% following...

North America chip-gear book-to-bill remains above 1.0 in October, says SEMI

Nov 20, 10:49

North America-based semiconductor equipment manufacturers posted US$756.2 million in orders in October 2009 and a book-to-bill ratio of 1.10, according to SEMI. A book-to-bill of...

North American chip equipment orders return to on-year growth track in September 2009, says SEMI

Oct 21, 10:18

September 2009 appears the first time since May 2007 that on-year bookings have risen and is in-line with the gradually improving capital spending outlook for the remainder of this...

Silicon wafer shipments to grow 23% in 2010, says SEMI

Oct 14, 13:54

Silicon wafer shipments to the global semiconductor industry will increase 23% in 2010 compared to total shipments in 2009, according to SEMI. The shipments are estimated to decline...

Chip equipment sales to grow 50% in 2010, says SEMI

Sep 30, 11:40

Worldwide semiconductor equipment sales are forecast to reach US$21 billion in 2010, up 50% from US$14.1 billion in 2009, according to SEMI speaking during the SEMICON Taiwan 2009...

SEMICON Taiwan 2009 (September 30-October 2)

Chip equipment bookings up for fifth consecutive month, says SEMI

Sep 18, 10:28

North America-based manufacturers of semiconductor equipment posted US$599 million in orders in August 2009 (three-month average basis) and a book-to-bill ratio of 1.03, according...

Analysts see chip recovery encouraging fab spending and ASPs

Sep 10, 11:27

IC Insights in its recent research forecast wafer fab capacity utilization will soon return to pre-crisis levels, signaling an upcoming rise in IC ASPs. In addition, SEMI has revised...

Global chip equipment billings down 66% on year in 2Q09, says SEMI

Sep 9, 10:09

Worldwide semiconductor manufacturing equipment billings reached US$2.69 billion in the second quarter of 2009, representing decreases of 13% sequentially and 66% on year, according...

North America chip equipment orders up 62% sequentially in July, says SEMI

Aug 19, 12:04

North America-based manufacturers of semiconductor equipment posted US$569.7 million in orders in July 2009 (three-month average basis) and a book-to-bill ratio of 1.06, according...

Specialty IC foundry VIS sees improved July revenues

Aug 11, 15:32

Vanguard International Semiconductor (VIS), which specializes in analog/mixed-signal and logic ICs, saw July 2009 sales rebound to a 10-month high with an on-year decrease narrowing...

SEMI Taiwan PV Standards Committee established

Aug 6, 15:29

The North American Regional Standards Committee and the International Standards Program under the Semiconductor Equipment & Materials International (SEMI) have endorsed the establishment...

SEMI Taiwan forms high-concentration photovoltaic promotion group

Jul 29, 11:37

Semiconductor Equipment and Materials International (SEMI) Taiwan on July 28 announced the establishment of the SEMI HCPV (high-concentration photovoltaic) promotion group, aiming...

Japan chip equipment bookings rise 37% in June, says SEAJ

Jul 23, 17:00

Japan-based semiconductor equipment manufacturers posted about 35.58 billion yen (US$377.32 million) in orders in June 2009 (three-month average basis) and a book-to-bill ratio of...

North American chip equipment orders continue recovery in June, says SEMI

Jul 22, 12:19

North America-based manufacturers of semiconductor equipment posted US$323.4 million in orders in June 2009 (three-month average basis) and a book-to-bill ratio of 0.77, according...

Chip equipment sales to fall 52% in 2009, says SEMI

Jul 15, 14:43

Worldwide semiconductor equipment sales are forecast to reach US$14.14 billion in 2009, experiencing its second straight yearly decline following a 31% drop in 2008, according to...

More than 200 companies to take part in PV Taiwan 2009

Jul 10, 10:23

More than 200 Taiwan and overseas companies in the solar industry will take part in PV Taiwan 2009, Taiwan's international photovoltaic (PV) forum and exhibition scheduled for October...

241 items [6/7]
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