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News tagged packaging and testing
  • Last update: Thursday 9 October 2014 [685 news items]

ASE, SPIL post slight drops in 4Q11 sales

Jan 9, 16:42

Advanced Semiconductor Engineering (ASE) has announced that revenues of its core IC assembly test and material (ATM) business slid 2.1% sequentially in the fourth quarter of 2011,...

STATS ChipPAC breaks ground for new factory

Jan 6, 01:20

STATS ChipPAC on January 5 hold a groundbreaking ceremony for its new factory in Singapore, according to the chip test and packaging service provider. The new 197,000-square foot...

PTI buys Nexx tool for advanced packaging

Jan 4, 15:49

IC packaging and testing house Powertech Technology (PTI) has acquired a 12-inch electrochemical deposition (ECD) system from Nexx Systems. The Nexx Stratus will be used for copper...

Chipbond, ChipMOS develop alternative to gold bumping

Jan 3, 11:53

Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...

ChipMOS aims at 10-15% revenue growth in 2012

Jan 2, 11:36

Packaging and testing firm ChipMOS Technologies expects its revenues to increase 10-15% to top US$690 million in 2012, thanks to a pick-up in orders for panel-use driver ICs and new...

KYEC chair highlights short-term challenges

Dec 28, 13:58

King Yuan Electronics (KYEC), a Taiwan-based firm specializing in IC testing, has pointed out a number of factors which the prospect for its 2012 business operation will depend on.

KYEC chairman CK Lee

PTI looking to become world No. 4 packaging, testing firm

Dec 26, 12:13

Powertech Technology's (PTI) plan to acquire a controlling stake in Greatek Electronics will further expand its backend service offerings and production capacity for the logic IC...

PTI to see 10-15% revenue drop in 1Q12

Dec 26, 10:07

Powertech Technology (PTI) holds a conservative view towards its business in the first quarter of 2012, due to the ongoing European debt crisis that continues to weigh on demand,...

DK Tsai of PTI

Chip equipment spending to decline following two years of growth, says Gartner

Dec 16, 15:53

Worldwide semiconductor capital equipment spending is expected to total US$51.7 billion in 2012, a 19.5% decline from projected 2011 spending of US$64.2 billion, according to Gartn...

STATS ChipPAC says Thailand factory to resume partial operations in 1Q12

Dec 8, 01:15

STATS ChipPac's operations in Thailand, which have been stopped since October 17 due to recent flooding in the country, are expected to resume partially in the first quarter of 2012,...

ASE revenues down 5% in November

Dec 7, 16:44

Advanced Semiconductor Engineering (ASE) has reported its core ATM (assembly test and material) division generated revenues of NT$10.7 billion (US$356 million) in November 2011, down...

SPIL posts slight drop in November revenues

Dec 6, 15:06

IC assembly and test service provider Silicon Precision Industries (SPIL) has announced consolidated revenues of NT$5.26 billion (US$174 million) for November 2011, down 1.7% on month...

Copper pillar bump penetration of FC packaging to rise

Nov 29, 12:25

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...

Walton to buy stake in Elpida subsidiary

Nov 28, 10:34

Elpida Memory has announced that Taiwan-based Walton Advanced Engineering, which provides packaging and testing services mainly for DRAM products, has agreed to make a JPY3.75 billion...

AKM to outsource more backend processing, says president

Nov 24, 15:52

Japan-based Asahi Kasei Microdevices (AKM), a supplier of mixed-signal ICs for consumer, automotive and communications applications, is looking to raise its backend orders to partners...

AKM president Hideki Kobori

Focus on small, cost-effective packages: Q&A with STATS ChipPAC CEO Tan Lay Koon

Nov 21, 13:48

Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that...

STATS ChipPAC CEO Tan Lay Koon

Toshiba puts on hold sale of Malaysian operation

Nov 17, 15:41

Toshiba and Amkor Technology have both agreed to postpone discussions regarding the previously-announced proposed acquisition by Amkor of Toshiba's semiconductor assembly operations...

STATS ChipPAC to open new wafer-level packaging plant in Taiwan, says paper

Newswatch - Nov 14, 16:40

STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...

ASE to acquire 100% stake in Power ASE

Stockwatch - Nov 11, 11:54

IC packager Advanced Semiconductor Engineering (ASE) has announced plans to acquire up to 107 million shares of Power ASE Technology, a joint venture with memory chipmaker Powerchip...

Thai flooding affects IC backend units of multiple suppliers, says IHS

Nov 4, 11:26

Numerous semiconductor suppliers headquartered around the world maintain assembly and test operations in Thailand, and many of these facilities have been affected by recent flooding...

Chipbond launches share buyback program

Stockwatch - Nov 3, 16:15

LCD driver IC packaging and testing house Chipbond Technology has announced plans to repurchase 10 million, or 1.68%, of the company's outstanding shares, at between NT$22 (US$0.73)...

Chipbond expects flat or slight growth in 4Q11 sales

Nov 3, 01:05

Chipbond Technology, which provides backend services to LCD driver IC suppliers such as Japan's Renesas Electronics, Taiwan-based Novatek Microelectronics and ILi Technology (Ilitek),...

PTI grabs orders from Micron and SanDisk, says report

Newswatch - Nov 2, 16:32

Packaging and testing house Powertech Technology (PTI) reportedly has landed orders for NAND flash memory from Micron Technology and SanDisk, according to a Chinese-language Commercial...

ASE to see lower 4Q11 shipments, flat margin

Oct 31, 10:11

IC packager Advanced Semiconductor Engineering (ASE) has forecast shipments for the fourth quarter of 2011 will decrease 3-4% sequentially, due to weak demand from Europe- and Japan-based...

ASE CFO Joseph Tung

PTI to reduce reliance on PC DRAM

Oct 28, 01:20

Packaging and testing house Powertech Technology (PTI) plans to lower the proportion of standard DRAM products in company revenues to less than 70% in the first quarter of 2012, and...

PTI chairman DK Tsai

Tong Hsing cuts revenue guidance for 4Q11

Oct 26, 16:59

Taiwan's Tong Hsing Electronic Industries now expects to post flat sequential growth in revenues for the fourth quarter of 2011, as some orders for CMOS image sensors (CIS) have been...

Chipbond 3Q11 profit rises on forex gain

Oct 26, 10:00

Driver-IC packaging and testing house Chipbond Technology has announced financial figures for the third quarter of 2011 with net profits hiking almost 80% sequentially, as recent...

FATC gains orders for onboard DRAM, says report

Newswatch - Oct 25, 11:26

Memory backend service provider Formosa Advanced Technologies (FATC) has grabbed testing orders for onboard DRAM products used in ultrabooks, according to a Chinese-language Commercial...

Integration a must for packaging and testing industry, says ASE chairman

Oct 24, 15:04

If an industry like the semiconductor packaging and testing sector has more than 10 companies involved, only 3-4 of them can actually generate profits, according to Jason Chang, chairman...

ASE chairman Jason Chang

ASE opens new plant in Taiwan, outlines effort to expand operations

Oct 24, 11:27

IC packaging and testing firm Advanced Semiconductor Engineering (ASE) on October 23 opened a new plant, named K12, in Kaohsiung, southern Taiwan. During a ceremony marking the opening...

(Right to left) Taiwan president Ma Ying-jeou and ASE chairman Jason Chang

ASE seeking US$200 million syndicated loan, says paper

Newswatch - Oct 17, 15:53

Advanced Semiconductor Engineering (ASE), Taiwan's largest IC packaging and testing firm, is applying for a US$200 million syndicated loan to fund its operations in China, according...

ASE to open US$460 million plant

Oct 14, 01:05

IC packager Advanced Semiconductor Engineering (ASE) is scheduled to open its new US$460 million plant in Kaohsiung, southern Taiwan, on October 23. Chairman Jason Chang will host...

SPIL outperforms fellow backend firms in 3Q11

Oct 11, 12:13

Silicon Precision Industries' (SPIL) consolidated revenues for the third quarter of 2011 rose 10.8% sequentially, beating the firm's targeted 2-6% growth. But Advanced Semiconductor...

VIS, Chipbond post drops in 3Q11 revenues

Oct 11, 12:08

Vanguard International Semiconductor (VIS), a major LCD driver IC foundry service provider, and driver-IC packaging and testing specialist Chipbond Technology both saw their third-quarter...

STATS ChipPAC intros new fan-out WLP offering

Oct 6, 11:19

STATS ChipPAC has announced that its next-generation fan-out type wafer level packaging (FO-WLP) offers the technology to support a broad range of semiconductor markets including...

685 items [7/20]
Realtime news
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    Before Going to Press | 11h 20min ago

  • TPCA Show 2014 to take place from October 22-24

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    Before Going to Press | Oct 21, 20:35

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    Before Going to Press | Oct 21, 20:12

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    Before Going to Press | Oct 21, 20:10

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  • Ultra HD monitor development on the rise; touchscreen units declining

    Before Going to Press | Oct 21, 20:08

  • TV vendors aim to ship 34 million Ultra HD TVs in 2015

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