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News tagged packaging and testing
  • Last update: Wednesday 9 July 2014 [678 news items]

PTI to see 10-15% revenue drop in 1Q12

Dec 26, 10:07

Powertech Technology (PTI) holds a conservative view towards its business in the first quarter of 2012, due to the ongoing European debt crisis that continues to weigh on demand,...

DK Tsai of PTI

Chip equipment spending to decline following two years of growth, says Gartner

Dec 16, 15:53

Worldwide semiconductor capital equipment spending is expected to total US$51.7 billion in 2012, a 19.5% decline from projected 2011 spending of US$64.2 billion, according to Gartn...

STATS ChipPAC says Thailand factory to resume partial operations in 1Q12

Dec 8, 01:15

STATS ChipPac's operations in Thailand, which have been stopped since October 17 due to recent flooding in the country, are expected to resume partially in the first quarter of 2012,...

ASE revenues down 5% in November

Dec 7, 16:44

Advanced Semiconductor Engineering (ASE) has reported its core ATM (assembly test and material) division generated revenues of NT$10.7 billion (US$356 million) in November 2011, down...

SPIL posts slight drop in November revenues

Dec 6, 15:06

IC assembly and test service provider Silicon Precision Industries (SPIL) has announced consolidated revenues of NT$5.26 billion (US$174 million) for November 2011, down 1.7% on month...

Copper pillar bump penetration of FC packaging to rise

Nov 29, 12:25

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...

Walton to buy stake in Elpida subsidiary

Nov 28, 10:34

Elpida Memory has announced that Taiwan-based Walton Advanced Engineering, which provides packaging and testing services mainly for DRAM products, has agreed to make a JPY3.75 billion...

AKM to outsource more backend processing, says president

Nov 24, 15:52

Japan-based Asahi Kasei Microdevices (AKM), a supplier of mixed-signal ICs for consumer, automotive and communications applications, is looking to raise its backend orders to partners...

AKM president Hideki Kobori

Focus on small, cost-effective packages: Q&A with STATS ChipPAC CEO Tan Lay Koon

Nov 21, 13:48

Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that...

STATS ChipPAC CEO Tan Lay Koon

Toshiba puts on hold sale of Malaysian operation

Nov 17, 15:41

Toshiba and Amkor Technology have both agreed to postpone discussions regarding the previously-announced proposed acquisition by Amkor of Toshiba's semiconductor assembly operations...

STATS ChipPAC to open new wafer-level packaging plant in Taiwan, says paper

Newswatch - Nov 14, 16:40

STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...

ASE to acquire 100% stake in Power ASE

Stockwatch - Nov 11, 11:54

IC packager Advanced Semiconductor Engineering (ASE) has announced plans to acquire up to 107 million shares of Power ASE Technology, a joint venture with memory chipmaker Powerchip...

Thai flooding affects IC backend units of multiple suppliers, says IHS

Nov 4, 11:26

Numerous semiconductor suppliers headquartered around the world maintain assembly and test operations in Thailand, and many of these facilities have been affected by recent flooding...

Chipbond launches share buyback program

Stockwatch - Nov 3, 16:15

LCD driver IC packaging and testing house Chipbond Technology has announced plans to repurchase 10 million, or 1.68%, of the company's outstanding shares, at between NT$22 (US$0.73)...

Chipbond expects flat or slight growth in 4Q11 sales

Nov 3, 01:05

Chipbond Technology, which provides backend services to LCD driver IC suppliers such as Japan's Renesas Electronics, Taiwan-based Novatek Microelectronics and ILi Technology (Ilitek),...

PTI grabs orders from Micron and SanDisk, says report

Newswatch - Nov 2, 16:32

Packaging and testing house Powertech Technology (PTI) reportedly has landed orders for NAND flash memory from Micron Technology and SanDisk, according to a Chinese-language Commercial...

ASE to see lower 4Q11 shipments, flat margin

Oct 31, 10:11

IC packager Advanced Semiconductor Engineering (ASE) has forecast shipments for the fourth quarter of 2011 will decrease 3-4% sequentially, due to weak demand from Europe- and Japan-based...

ASE CFO Joseph Tung

PTI to reduce reliance on PC DRAM

Oct 28, 01:20

Packaging and testing house Powertech Technology (PTI) plans to lower the proportion of standard DRAM products in company revenues to less than 70% in the first quarter of 2012, and...

PTI chairman DK Tsai

Tong Hsing cuts revenue guidance for 4Q11

Oct 26, 16:59

Taiwan's Tong Hsing Electronic Industries now expects to post flat sequential growth in revenues for the fourth quarter of 2011, as some orders for CMOS image sensors (CIS) have been...

Chipbond 3Q11 profit rises on forex gain

Oct 26, 10:00

Driver-IC packaging and testing house Chipbond Technology has announced financial figures for the third quarter of 2011 with net profits hiking almost 80% sequentially, as recent...

FATC gains orders for onboard DRAM, says report

Newswatch - Oct 25, 11:26

Memory backend service provider Formosa Advanced Technologies (FATC) has grabbed testing orders for onboard DRAM products used in ultrabooks, according to a Chinese-language Commercial...

Integration a must for packaging and testing industry, says ASE chairman

Oct 24, 15:04

If an industry like the semiconductor packaging and testing sector has more than 10 companies involved, only 3-4 of them can actually generate profits, according to Jason Chang, chairman...

ASE chairman Jason Chang

ASE opens new plant in Taiwan, outlines effort to expand operations

Oct 24, 11:27

IC packaging and testing firm Advanced Semiconductor Engineering (ASE) on October 23 opened a new plant, named K12, in Kaohsiung, southern Taiwan. During a ceremony marking the opening...

(Right to left) Taiwan president Ma Ying-jeou and ASE chairman Jason Chang

ASE seeking US$200 million syndicated loan, says paper

Newswatch - Oct 17, 15:53

Advanced Semiconductor Engineering (ASE), Taiwan's largest IC packaging and testing firm, is applying for a US$200 million syndicated loan to fund its operations in China, according...

ASE to open US$460 million plant

Oct 14, 01:05

IC packager Advanced Semiconductor Engineering (ASE) is scheduled to open its new US$460 million plant in Kaohsiung, southern Taiwan, on October 23. Chairman Jason Chang will host...

SPIL outperforms fellow backend firms in 3Q11

Oct 11, 12:13

Silicon Precision Industries' (SPIL) consolidated revenues for the third quarter of 2011 rose 10.8% sequentially, beating the firm's targeted 2-6% growth. But Advanced Semiconductor...

VIS, Chipbond post drops in 3Q11 revenues

Oct 11, 12:08

Vanguard International Semiconductor (VIS), a major LCD driver IC foundry service provider, and driver-IC packaging and testing specialist Chipbond Technology both saw their third-quarter...

STATS ChipPAC intros new fan-out WLP offering

Oct 6, 11:19

STATS ChipPAC has announced that its next-generation fan-out type wafer level packaging (FO-WLP) offers the technology to support a broad range of semiconductor markets including...

ASE looks to expand

Sep 23, 01:05

IC packaging and testing service provider Advanced Semiconductor Engineering (ASE) expects its consolidated revenues to top US$30 billion in 2020, and is eyeing a 30% global market...

ASE breaks ground on China headquarters

Sep 22, 01:00

Advanced Semiconductor Engineering (ASE) broke ground at the site of a regional headquarters in Zhangjiang, Shanghai on September 21. Operations are scheduled to commence in 2012,...

ASE announces another share buyback

Stockwatch - Sep 21, 14:28

Advanced Semiconductor Engineering (ASE) has announced a share buyback program, under which the company will repurchase up to 30 million of its common shares from the open market...

ASE to open China regional headquarters

Sep 20, 11:34

Packaging and testing firm Advanced Semiconductor Engineering (ASE) will hold a groundbreaking ceremony for a regional headquarters in Shanghai on September 21, and is also expected...

ChipMOS reiterates 3Q11 outlook

Sep 19, 15:16

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs, has said that its sales guidance for the third quarter of 2011 should remain on track.

ASE to sell CNY-denominated bonds, says paper

Stockwatch - Sep 14, 16:38

Taiwan-based Advanced Semiconductor Engineering (ASE) plans to issue Chinese yuan-denominated bonds worth a total of CNY650 million (US$102 million) in Hong Kong with an aim to boost...

ASE, SPIL post sequential growth in August sales

Sep 8, 01:25

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported sequential growth of 2.9% and 6.7%, respectively, in consolidated revenues...

678 items [7/20]
Realtime news
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    Before Going to Press | 2h 28min ago

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