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News tagged packaging and testing
  • Last update: Friday 11 April 2014 [666 news items]

Thai flooding affects IC backend units of multiple suppliers, says IHS

Nov 4, 11:26

Numerous semiconductor suppliers headquartered around the world maintain assembly and test operations in Thailand, and many of these facilities have been affected by recent flooding...

Chipbond launches share buyback program

Stockwatch - Nov 3, 16:15

LCD driver IC packaging and testing house Chipbond Technology has announced plans to repurchase 10 million, or 1.68%, of the company's outstanding shares, at between NT$22 (US$0.73)...

Chipbond expects flat or slight growth in 4Q11 sales

Nov 3, 01:05

Chipbond Technology, which provides backend services to LCD driver IC suppliers such as Japan's Renesas Electronics, Taiwan-based Novatek Microelectronics and ILi Technology (Ilitek),...

PTI grabs orders from Micron and SanDisk, says report

Newswatch - Nov 2, 16:32

Packaging and testing house Powertech Technology (PTI) reportedly has landed orders for NAND flash memory from Micron Technology and SanDisk, according to a Chinese-language Commercial...

ASE to see lower 4Q11 shipments, flat margin

Oct 31, 10:11

IC packager Advanced Semiconductor Engineering (ASE) has forecast shipments for the fourth quarter of 2011 will decrease 3-4% sequentially, due to weak demand from Europe- and Japan-based...

ASE CFO Joseph Tung

PTI to reduce reliance on PC DRAM

Oct 28, 01:20

Packaging and testing house Powertech Technology (PTI) plans to lower the proportion of standard DRAM products in company revenues to less than 70% in the first quarter of 2012, and...

PTI chairman DK Tsai

Tong Hsing cuts revenue guidance for 4Q11

Oct 26, 16:59

Taiwan's Tong Hsing Electronic Industries now expects to post flat sequential growth in revenues for the fourth quarter of 2011, as some orders for CMOS image sensors (CIS) have been...

Chipbond 3Q11 profit rises on forex gain

Oct 26, 10:00

Driver-IC packaging and testing house Chipbond Technology has announced financial figures for the third quarter of 2011 with net profits hiking almost 80% sequentially, as recent...

FATC gains orders for onboard DRAM, says report

Newswatch - Oct 25, 11:26

Memory backend service provider Formosa Advanced Technologies (FATC) has grabbed testing orders for onboard DRAM products used in ultrabooks, according to a Chinese-language Commercial...

Integration a must for packaging and testing industry, says ASE chairman

Oct 24, 15:04

If an industry like the semiconductor packaging and testing sector has more than 10 companies involved, only 3-4 of them can actually generate profits, according to Jason Chang, chairman...

ASE chairman Jason Chang

ASE opens new plant in Taiwan, outlines effort to expand operations

Oct 24, 11:27

IC packaging and testing firm Advanced Semiconductor Engineering (ASE) on October 23 opened a new plant, named K12, in Kaohsiung, southern Taiwan. During a ceremony marking the opening...

(Right to left) Taiwan president Ma Ying-jeou and ASE chairman Jason Chang

ASE seeking US$200 million syndicated loan, says paper

Newswatch - Oct 17, 15:53

Advanced Semiconductor Engineering (ASE), Taiwan's largest IC packaging and testing firm, is applying for a US$200 million syndicated loan to fund its operations in China, according...

ASE to open US$460 million plant

Oct 14, 01:05

IC packager Advanced Semiconductor Engineering (ASE) is scheduled to open its new US$460 million plant in Kaohsiung, southern Taiwan, on October 23. Chairman Jason Chang will host...

SPIL outperforms fellow backend firms in 3Q11

Oct 11, 12:13

Silicon Precision Industries' (SPIL) consolidated revenues for the third quarter of 2011 rose 10.8% sequentially, beating the firm's targeted 2-6% growth. But Advanced Semiconductor...

VIS, Chipbond post drops in 3Q11 revenues

Oct 11, 12:08

Vanguard International Semiconductor (VIS), a major LCD driver IC foundry service provider, and driver-IC packaging and testing specialist Chipbond Technology both saw their third-quarter...

STATS ChipPAC intros new fan-out WLP offering

Oct 6, 11:19

STATS ChipPAC has announced that its next-generation fan-out type wafer level packaging (FO-WLP) offers the technology to support a broad range of semiconductor markets including...

ASE looks to expand

Sep 23, 01:05

IC packaging and testing service provider Advanced Semiconductor Engineering (ASE) expects its consolidated revenues to top US$30 billion in 2020, and is eyeing a 30% global market...

ASE breaks ground on China headquarters

Sep 22, 01:00

Advanced Semiconductor Engineering (ASE) broke ground at the site of a regional headquarters in Zhangjiang, Shanghai on September 21. Operations are scheduled to commence in 2012,...

ASE announces another share buyback

Stockwatch - Sep 21, 14:28

Advanced Semiconductor Engineering (ASE) has announced a share buyback program, under which the company will repurchase up to 30 million of its common shares from the open market...

ASE to open China regional headquarters

Sep 20, 11:34

Packaging and testing firm Advanced Semiconductor Engineering (ASE) will hold a groundbreaking ceremony for a regional headquarters in Shanghai on September 21, and is also expected...

ChipMOS reiterates 3Q11 outlook

Sep 19, 15:16

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs, has said that its sales guidance for the third quarter of 2011 should remain on track.

ASE to sell CNY-denominated bonds, says paper

Stockwatch - Sep 14, 16:38

Taiwan-based Advanced Semiconductor Engineering (ASE) plans to issue Chinese yuan-denominated bonds worth a total of CNY650 million (US$102 million) in Hong Kong with an aim to boost...

ASE, SPIL post sequential growth in August sales

Sep 8, 01:25

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported sequential growth of 2.9% and 6.7%, respectively, in consolidated revenues...

Proportion of copper wire bonding to rise to over 20% in 2011, says SEMI

Sep 7, 16:36

Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for...

UTAC gains controlling stake in JV with SMIC

Sep 6, 14:27

Semiconductor Manufacturing International Corporation (SMIC) has transferred nearly its entire stake in its packaging and testing joint venture to partner United Test and Assembly...

ASE plans another share buyback

Stockwatch - Sep 2, 01:05

Advanced Semiconductor Engineering (ASE) on August 29 announced that the company executed its fourth share buyback program ahead of schedule. Two days later, ASE issued a filing with...

IC production value to grow modestly through 2014, says ASE

Aug 30, 12:17

The production value of the global semiconductor industry will achieve a CAGR of at least 7% for 2011-2014, IC packager Advanced Semiconductor Engineering (ASE) has commented, adding...

Amkor, Globalfoundries team up for advanced assembly, test solutions

Aug 30, 11:08

Amkor Technology and Globalfoundries have entered into a strategic partnership to develop integrated assembly and test solutions for advanced silicon nodes, according to the companies...

Chipbond 2Q11 profits halved

Aug 24, 17:07

LCD driver IC packaging and testing firm Chipbond Technology has reported net income of NT$254 million (US$8.7 million) on revenues of NT$3.445 billion for the second quarter of 2011...

Sigurd to buy back stock

Aug 24, 10:55

Taiwan-based testing company Sigurd Microelectronics plans to buy back three million shares of its common stock at a price range between NT$15 (US$0.52) and NT$25 per share from August...

Mobile RAM outlook optimistic, say memory backend firms

Aug 23, 13:55

The outlook for mobile RAM remains optimistic despite weaker-than-expected demand thus far in 2011, according to sources at major Taiwan-based memory packaging and testing houses...

PTI cuts 2011 capex, says paper

Newswatch - Aug 22, 12:22

Memory packaging and testing firm Powertech Technology (PTI) has revised downward its capex budget for 2011 to less than NT$10 billion (US$345 million) from the previously-planned...

More firms reducing exposure in DRAM packaging and testing market

Aug 22, 12:00

The growing supply-demand imbalance in the PC DRAM market has discouraged packaging and testing firms from paying attention to the segment, with some looking to completely phase out...

Walton expects flat 3Q11, but drop in 4Q

Aug 18, 01:10

Memory IC packaging and testing firm Walton Advanced Engineering has narrowed its sales forecast for the third quarter to flat growth sequentially, compared with the 0-5% increase...

Walton president Yu Hong-chi

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

666 items [7/20]
2014 global high brightness LED market
China touch tracker

18-Apr-2014 markets closed

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DIGITIMES Translation Services
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