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News tagged packaging and testing
  • Last update: Tuesday 30 August 2016 [870 news items]

ChipMOS to land more large-size LCD driver IC packaging orders in 2014

Mar 14, 16:23

IC backend service company ChipMOS Technologies is expected to land more packaging orders for large-size LCD driver ICs supporting Ultra HD displays amid increasing penetration, according...

STATS ChipPAC Taiwan posts EPS over NT$4 for 2013

Newswatch - Mar 14, 15:04

IC backend service company STATS ChipPAC Taiwan saw its net profits climb 11.2% to NT$547.62 million (US$18.04 million) in 2013. The earnings translated into an EPS of NT$4.02 for...

ASE may land more packaging orders for Apple A8 CPUs

Mar 11, 21:40

Advanced Semiconductor Engineering (ASE) may land a higher portion of packaging orders for Apple's next-generation A8 processor than the 20% expected previously, according to industry...

apple

ASE reports decreased revenues for February

Mar 7, 15:28

Advanced Semiconductor Engineering (ASE) has reported February consolidated revenues of NT$16.24 billion (US$537 million), down 12.6% sequentially. The performance was in line with...

KYEC February sales up 7%

Mar 7, 15:01

King Yuan Electronics (KYEC), which provides chip probing and final test services for LCD driver ICs and chip components used in mobile devices, has announced consolidated sales for...

SPIL February sales rise 31%

Mar 6, 21:56

Consolidated revenues at IC packager Silicon Precision Industries (SPIL) increased 31.1% from a year earlier to NT$5.57 billion (US$184.1 million) in February 2014, thanks to brisk...

OSE denies rumor of acquisition by memory module maker

Stockwatch - Mar 6, 15:25

Packaging and testing firm Orient Semiconductor Electronics (OSE) has denied local media reports indicating that it will be acquired by a dedicated memory module vendor, according...

PTI expands customer base in logic IC field

Mar 5, 21:55

Packaging and testing firm Powertech Technology (PTI) has reportedly secured orders from application processor and networking chip developers, such as Broadcom and China-based RDA...

PTI capacity for SSDs to grow robustly

Mar 4, 14:35

Packaging and testing firm Powertech Technology (PTI) is looking to boost its overall output for SSD-use NAND flash memory to 150,000-200,000 units a month in May-June, up from the...

PTI to pay Tessera US$196 million in patent lawsuit settlement

Stockwatch - Feb 27, 15:54

Packaging and testing firm Powertech Technology (PTI) has issued a company filing with the Taiwan Stock Exchange (TSE) disclosing it has settled a patent infringement dispute with...

ASE to pay US$30 million to Tessera to settle patent case

Feb 26, 15:34

Advanced Semiconductor Engineering (ASE) has issued a company filing with the Taiwan Stock Exchange (TSE) announcing that the company will pay Tessera a total of US$30 million to...

STATS ChipPAC fcCuBE technology achieves significant growth in 2013

Feb 26, 10:52

STATS ChipPAC has announced that unit shipments of semiconductor packages utilising its patented fcCuBE technology more than quadrupled in 2013 compared to 2012. The performance and...

KYEC enjoys brisk orders for CMOS image sensors, says report

Newswatch - Feb 25, 15:42

Taiwan-based King Yuan Electronics (KYEC), which provides chip probing and final test services for LCD driver ICs and chip components used in mobile devices, has landed a pull-in...

SMIC, JCET form JV for 12-inch bumping and testing

Feb 21, 14:26

Semiconductor Manufacturing International (SMIC) and Jiangsu Changjiang Electronics Technology (JCET), an IC assembly and test services provider in China, have established a joint...

Walton looks to profit growth in 2014

Feb 20, 21:30

Walton Advanced Engineering, which provides packaging and testing services for memory chips, expects to report profit growth for 2014. The firm returned to profitability in 2013.

ASE January sales decrease, SPIL flat

Feb 10, 21:40

Chip packager Advanced Semiconductor Engineering (ASE) saw its January sales decrease 13% on month, while fellow firm Siliconware Precision Industries (SPIL) reported flat sequential...

Chip packager ASE expects 1Q14 shipments to drop 12-15%

Feb 10, 14:03

Advanced Semiconductor Engineering (ASE), the world's largest chip packaging and testing company, expects its first-quarter shipments to decrease 12-15% sequentially due to seasonal...

ASE CFO Joseph Tung

SPIL expects 1Q14 revenues to drop 4-8%

Jan 27, 20:40

IC backend house Siliconware Precision Industries (SPIL) has forecast consolidated revenues for the the first quarter of 2014 will decrease 4-8% sequentially, as production utilization...

SPIL, KYEC post slight drops in 4Q13 sales

Jan 10, 15:40

Consolidated sales at IC packaging and testing houses Siliconware Precision Industries (SPIL) and King Yuan Electronics Company (KYEC) registered sequential drops of 1.3% and 3.7%,...

ASE striving to resume normal operations at plant partially shut down over pollution

Stockwatch - Jan 9, 14:09

Advanced Semiconductor Engineering (ASE) is striving to resume normal operations at its K7 factory located in Kaohisung, southern Taiwan, which the company has been ordered to shut...

SPIL looks to strong performance in 4Q13 and 1Q14

Dec 31, 14:21

Siliconware Precision Industries (SPIL) is expected to perform better than expected in the fourth quarter of 2013 and the first quarter of 2014 as the IC backend service firm has...

Packaging material distributor Niching to set up nano silver paste production lines

Dec 26, 16:20

Taiwan-based IC packaging material distributor Niching Industrial has spent NT$125 million (US$4.16 million) for the purchase of a building in preparation for setting up nano silver...

PTI to grow sales of logic IC backend service biz in 2014

Dec 26, 10:29

Memory-IC packaging and testing specialist Powertech Technology (PTI) is expected to enjoy significant growth in sales of its logic IC backend service business in 2014, thanks to...

PTI chairman DK Tsai expresses optimism about company logic IC backend service business

IC supplies may be jeopardized if ASE K7 plant suspends operations for over 3 months

Dec 24, 21:47

While the suspension of operations of Advanced Semiconductor Manufacturing's (ASE) K7 plant is unlikely to affect the backend IC supply chain in the short term, the likelihood of...

ase

ASE closes part of K7 factory due to water pollution

Dec 23, 12:05

Advanced Semiconductor Engineering (ASE) has received a government order to shut down part of its K7 factory located in Kaohisung, southern Taiwan, as a result of water pollution,...

Chipbond facing increasing competition from rivals in Korea

Dec 18, 14:00

Korea-based Nepes and LB Semcon, providers of LCD driver IC packaging and testing services, have recently cut their quotes by nearly 30% putting Chipbond Technology under pressure,...

Chipbond

ASE denies clients are cutting orders

Stockwatch - Dec 16, 16:03

Advanced Semiconductor Enginering (ASE) has issued a company filing with the Taiwan Stock Exchange (TSE) denying Chinese-language media reports indicating the company may see customer...

ASE likely to lose orders as plants might shut down over toxic leaks

Dec 13, 10:23

One or more factories of Taiwan-based Advanced Semiconductor Engineering (ASE), the world's largest IC packaging house, might receive a government order to suspend operations for...

ASE responds to report on toxic wastewater discharged by its Kaohsiung plant

Stockwatch - Dec 10, 11:31

Semiconductor assembly and testing service provider Advanced Semiconductor Engineering (ASE) has provided explanations following a Chinese-language Apple Daily report that...

Semiconductor material supplier Ampoc looks to sequential sales growth in 4Q13

Dec 6, 12:14

Wet-process PCB equipment and semiconductor material supplier Ampoc Far-East is expected to see revenues edge up 3-5% sequentially in the fourth quarter of 2013 thanks to demand from...

Memory backend service firms likely to scale down capex for 2014

Dec 4, 15:08

Memory-IC backend service firms may cut back their capital expenditure budgets for 2014, due to low order visibility from DRAM clients, according to market observers.

Memory IC backend houses likely to cut their capex for 2014

Transformation: Q&A with ChipMOS chairman and CEO SJ Cheng

Nov 20, 15:54

ChipMOS Technologies is among very few firms that have transformed themselves successfully and are no longer influenced by the volatile memory market. Once known as a packaging and...

ChipMOS chairman and CEO SJ Cheng

IC testing firm Ardentec expects 4Q13 sales to drop up to 5%

Nov 13, 15:50

Ardentec, a Taiwan-based provider of wafer and mixed-signal IC testing services, expects to post an up to 5% sequential decrease in fourth-quarter sales. The firm has reported consolidated...

ASE posts record consolidated revenues for October 2013

Nov 8, 16:03

Consolidated revenues at Advanced Semiconductor Engineering (ASE) climbed to an all-time high of NT$20.76 billion (US$707 million) in October 2013, representing growth of 17.7% on...

SPIL posts record revenues for October

Nov 6, 12:09

Siliconware Precision Industries (SPIL) saw its October consolidated revenues climb to an all-time high of NT$6.55 billion (US$222.7 million) for October 2013, representing growth...

870 items [7/25]
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