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News tagged packaging and testing
  • Last update: Wednesday 13 May 2015 [729 news items]

PTI 2Q12 beats estimates; sees challenges ahead

Aug 1, 12:09

Memory IC packaging and testing house Powertech Technology (PTI) has reported better-than-expected revenue and EPS results for the second quarter of 2012. But looking forward, the...

ASE, SPIL make progress in transition to copper wire bonding

Jul 31, 16:12

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...

ASE, SPIL expect 3Q12 sales to rise

Jul 30, 14:27

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both expect their third-quarter sales to register another sequential growth buoyed by rising demand...

SPIL chairman Bough Lin expects company sales to grow through 4Q12

STATS ChipPAC profits fall

Jul 27, 11:46

STATS ChipPAC, a Singapore-based provider of semiconductor testing and assembly services, has announced net profits for the second quarter of its fiscal 2012 declined over 50% from...

Chipbond 3Q12 sales to grow up to 5%

Jul 13, 12:03

LCD-driver-IC packaging and testing house Chipbond Technology is expected to report sales growth of up to 5% sequentially for the third quarter of 2012, according to market sources...

STATS ChipPAC announces volume manufacturing of fcCuBE technology

Jul 9, 14:34

STATS ChipPAC has announced its fcCuBE technology - an advanced flip chip packaging technology that features copper (Cu) column bumps, bond-on-lead (BOL) interconnection and enhanced...

PTI, Walton to maintain orders after Micron-Elpida deal

Jul 3, 01:05

Micron Technology's takeover of DRAM maker Elpida Memory will not bring negative effects to Elpida's existing backend partners including Powertech Technology (PTI) and Walton Advanced...

MediaTek-MStar merger to have impact on existing suppliers

Jun 26, 12:37

The planned merger between MediaTek and MStar Semiconductor is expected to vertically integrate their supply chain. However, some market watchers speculate MediaTek will take over...

ASE to expand operations in Korea

Jun 25, 14:54

In view of the growing semiconductor industry in Korea, Advanced Semiconductor Engineering (ASE) is looking to expand its local factory site located in Paju, Gyeonggi Province, with...

ASE, SPIL gearing up for capacity expansion

Jun 21, 14:45

IC packaging and testing firms Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both reiterated their commitment to expand capacity in 2012...

SPIL steps up capacity expansion

Jun 20, 11:53

IC packager Siliconware Precision Industries (SPIL) is stepping up capacity expansion efforts in 2012 with planned capital expenditure of a record NT$17.5 billion, chairman Bough...

Chipbond sees positive outlook for 2012

Jun 18, 14:54

Chipbond Technology is optimistic about the business prospects for 2012, according to the LCD driver IC packaging and testing specialist. The firm added it would continue to build...

Major Taiwan IC backend firms to post over 5% sales growth in 2Q12

Jun 11, 12:27

Major Taiwan-based IC packaging and testing houses including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Chipbond...

ASE-USI deal probed for possible insider trading

Jun 11, 11:39

The Taipei Prosecutors' Office on June 8 began a probe into insider trading suspicions involving Advanced Semiconductor Manufacturing's (ASE) takeover of Universal Scientific Indus...

ASE, SPIL post sales growth in May

Jun 7, 16:09

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their May revenues register single-digit growth.

Chipbond lands 8-inch gold bumping orders from Samsung, says paper

Newswatch - Jun 4, 14:23

LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...

ASE opens new manufacturing facility in China

May 31, 15:09

Packaging and testing firm Advanced Semiconductor Engineering (ASE) has announced the opening of its Phase 3 manufacturing facility in Weihai, Shangdong province, China. The new building...

SPIL to expand packaging, testing capacity at China subsidiary

May 28, 10:39

Siliconware Precision Industries (SPIL), a Taiwan-based provider of IC packaging/testing service, will add investment of US$100 million in Siliconware Technology (Suzhou) to expand...

ASE, SPIL post slight drops in April sales

May 8, 01:10

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported slight decreases in consolidated revenues for April 2012. ASE announced consolidated...

Chipbond, ChipMOS 2Q12 sales expected to grow

May 7, 15:41

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales register single-digit growth sequentially thanks...

ASE to issue overseas convertible bonds worth NT$9 billion

May 4, 14:02

Taiwan's Advanced Semiconductor Engineering (ASE), which provides semiconductor assembly and test services, has announced plans to issue overseas convertible bonds worth up to NT$9...

PTI, Walton post better-than-expected 1Q12 profits

May 2, 16:33

Despite early media speculation that Elpida Memory's bankruptcy filing would impact its supply-chain partners' business performance, Powertech Technology (PTI) and Walton Advanced...

Memory backend firms likely to post double-digit growth in 2Q12

Apr 18, 11:16

The visibility of orders for DRAM memory will become clearer in the second quarter of 2012, as demand is picking up from notebook vendors who are gearing up for product launch, industry...

PTI seeing orders for NAND flash pick up

Apr 16, 14:33

Packaging and testing firm Powertech Technology (PTI) expects sales of its NAND flash memory products to grow and contribute to sequential revenue growth in the second quarter of...

Second-tier packaging and testing firms post sales growth in 1Q12

Apr 11, 14:16

Revenues at Taiwan's second-tier packaging-and-testing houses Giga Solution, Greatek Electronics, Lingsen Precision Industries and Thailin Semiconductor all registered single-digit...

ASE 1Q12 sales slip

Apr 10, 13:47

Consolidated revenues at Advanced Semiconductor Engineering (ASE) registered declines of 7.1% sequentially and 6.3% on year in the first quarter of 2012. Sales of its core IC assembly...

KYEC 1Q12 sales down 3%; expects mild growth in 2Q

Apr 9, 16:31

Revenues at King Yuan Electronics (KYEC) slid 3.5% sequentially in the first quarter of 2012. The IC testing firm expects to report mild growth for the second quarter.

PTI enters board of Greatek

Apr 5, 15:47

Greatek Electronics has granted Powertech Technology (PTI), which holds 44.09% of its stock, six out of seven board seats with PTI chairman DK Tsai reelected as the chairman of Greatek's...

Amkor licenses proprietary through-mold-via technology to Shinko

Apr 2, 10:22

Amkor Technology has announced that the company has granted Shinko Electric Industries a non-exclusive license to its proprietary through-mold-via (TMV) technology.

ASE, SPIL remain conservative on business outlook

Mar 20, 14:41

While the recent news that Taiwan Semiconductor Manufacturing Company (TSMC) is mulling an upward revision in 2012 capex has boosted market observers' confidence in the outlook for...

ChipMOS expects sales growth in 2012

Mar 19, 16:15

Packaging and testing firm ChipMOS Technologies has forecast consolidated revenues for 2012 will increase 10%. The company revealed that net revenues on a US GAAP basis for 2011 grew...

4G power amplifiers to buoy Sigurd sales in 2012

Mar 15, 14:50

Packaging and testing house Sigurd Microelectronics reportedly has landed new orders for 4G LTE chips, including those placed by Anadigics and other major power amplifier suppliers...

Silterra launches 130nm CMOS logic aluminum backend technology

Mar 14, 14:40

Malaysia-based wafer foundry Silterra has announced the release of 130nm CMOS logic technology with aluminum backend interconnection, CL130AL, for mainstream and high-volume consumer...

Aptos expanding 12-inch wafer level packaging business

Mar 14, 14:30

Aptos Technology, which specializes in backend services for the production of NAND flash chips and devices such as microSD cards, announced March 13 that two of its subsidiaries will...

Chipbond sees flat growth in 1Q12 sales

Mar 13, 14:22

Chipbond Technology, which provides packaging and testing services for driver ICs used mainly in TV and handset panels, expects its consolidated revenues to register flat sequential...

729 items [7/21]
Taiwan server shipment forecast and industry analysis, 2015
2015 China smartphone panel trend forecast

22-May-2015 markets closed

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