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News tagged packaging and testing
  • Last update: Wednesday 1 April 2015 [715 news items]

ASE, SPIL post sales growth in May

Jun 7, 16:09

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their May revenues register single-digit growth.

Chipbond lands 8-inch gold bumping orders from Samsung, says paper

Newswatch - Jun 4, 14:23

LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...

ASE opens new manufacturing facility in China

May 31, 15:09

Packaging and testing firm Advanced Semiconductor Engineering (ASE) has announced the opening of its Phase 3 manufacturing facility in Weihai, Shangdong province, China. The new building...

SPIL to expand packaging, testing capacity at China subsidiary

May 28, 10:39

Siliconware Precision Industries (SPIL), a Taiwan-based provider of IC packaging/testing service, will add investment of US$100 million in Siliconware Technology (Suzhou) to expand...

ASE, SPIL post slight drops in April sales

May 8, 01:10

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported slight decreases in consolidated revenues for April 2012. ASE announced consolidated...

Chipbond, ChipMOS 2Q12 sales expected to grow

May 7, 15:41

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales register single-digit growth sequentially thanks...

ASE to issue overseas convertible bonds worth NT$9 billion

May 4, 14:02

Taiwan's Advanced Semiconductor Engineering (ASE), which provides semiconductor assembly and test services, has announced plans to issue overseas convertible bonds worth up to NT$9...

PTI, Walton post better-than-expected 1Q12 profits

May 2, 16:33

Despite early media speculation that Elpida Memory's bankruptcy filing would impact its supply-chain partners' business performance, Powertech Technology (PTI) and Walton Advanced...

Memory backend firms likely to post double-digit growth in 2Q12

Apr 18, 11:16

The visibility of orders for DRAM memory will become clearer in the second quarter of 2012, as demand is picking up from notebook vendors who are gearing up for product launch, industry...

PTI seeing orders for NAND flash pick up

Apr 16, 14:33

Packaging and testing firm Powertech Technology (PTI) expects sales of its NAND flash memory products to grow and contribute to sequential revenue growth in the second quarter of...

Second-tier packaging and testing firms post sales growth in 1Q12

Apr 11, 14:16

Revenues at Taiwan's second-tier packaging-and-testing houses Giga Solution, Greatek Electronics, Lingsen Precision Industries and Thailin Semiconductor all registered single-digit...

ASE 1Q12 sales slip

Apr 10, 13:47

Consolidated revenues at Advanced Semiconductor Engineering (ASE) registered declines of 7.1% sequentially and 6.3% on year in the first quarter of 2012. Sales of its core IC assembly...

KYEC 1Q12 sales down 3%; expects mild growth in 2Q

Apr 9, 16:31

Revenues at King Yuan Electronics (KYEC) slid 3.5% sequentially in the first quarter of 2012. The IC testing firm expects to report mild growth for the second quarter.

PTI enters board of Greatek

Apr 5, 15:47

Greatek Electronics has granted Powertech Technology (PTI), which holds 44.09% of its stock, six out of seven board seats with PTI chairman DK Tsai reelected as the chairman of Greatek's...

Amkor licenses proprietary through-mold-via technology to Shinko

Apr 2, 10:22

Amkor Technology has announced that the company has granted Shinko Electric Industries a non-exclusive license to its proprietary through-mold-via (TMV) technology.

ASE, SPIL remain conservative on business outlook

Mar 20, 14:41

While the recent news that Taiwan Semiconductor Manufacturing Company (TSMC) is mulling an upward revision in 2012 capex has boosted market observers' confidence in the outlook for...

ChipMOS expects sales growth in 2012

Mar 19, 16:15

Packaging and testing firm ChipMOS Technologies has forecast consolidated revenues for 2012 will increase 10%. The company revealed that net revenues on a US GAAP basis for 2011 grew...

4G power amplifiers to buoy Sigurd sales in 2012

Mar 15, 14:50

Packaging and testing house Sigurd Microelectronics reportedly has landed new orders for 4G LTE chips, including those placed by Anadigics and other major power amplifier suppliers...

Silterra launches 130nm CMOS logic aluminum backend technology

Mar 14, 14:40

Malaysia-based wafer foundry Silterra has announced the release of 130nm CMOS logic technology with aluminum backend interconnection, CL130AL, for mainstream and high-volume consumer...

Aptos expanding 12-inch wafer level packaging business

Mar 14, 14:30

Aptos Technology, which specializes in backend services for the production of NAND flash chips and devices such as microSD cards, announced March 13 that two of its subsidiaries will...

Chipbond sees flat growth in 1Q12 sales

Mar 13, 14:22

Chipbond Technology, which provides packaging and testing services for driver ICs used mainly in TV and handset panels, expects its consolidated revenues to register flat sequential...

ASE February sales up, SPIL down

Mar 9, 11:01

Advanced Semiconductor Engineering (ASE) saw sales of its core IC ATM (assembly test and material) business grow 3.9% on month to NT$9.49 billion (US$320 million) in February 2012...

STATS ChipPAC intros new 3D eWLB PoP solutions

Mar 7, 11:35

STATS ChipPAC, a semiconductor test and advanced packaging service provider, has announced its next-generation three dimensional (3D) embedded wafer-level ball grid array (eWLB) package-on-package...

SPIL chair sees chip market rebound

Feb 16, 16:40

The global semiconductor market is expected to stage a quick recovery after hitting bottom in the first quarter of 2012, Silicon Precision Industries (SPIL) chairman Bough Lin said...

SPIL chairman Bough Lin

SPIL 4Q11 profits up 5%; 2011 EPS at NT$1.55

Feb 15, 16:02

IC packager Silicon Precision Industries (SPIL) has reported NT$1.17 billion (US$39.7 million) in net profits for the fourth quarter of 2011, up 5.2% from a year earlier, with revenues...

ASE expects sales rebound in 2Q12

Feb 13, 10:46

Advanced Semiconductor Engineering (ASE) has estimated that its core IC assembly test and material (ATM) business will post another sequential decrease of 6-9% in shipments in the...

ASE expects sales rebound in 2Q12

Chipbond sales to rise 5% in 1Q12, says paper

Newswatch - Feb 10, 14:21

LCD driver IC packaging and testing specialist Chipbond Technology is expected to see its consolidated revenues increase as much as 5% sequentially in the first quarter of 2012, beating...

ASE, SPIL post sales drops in January

Feb 9, 01:40

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported decreases in January 2012 consolidated revenues from the previous month...

STATS ChipPAC to shut Thailand plant

Feb 1, 14:34

STATS ChipPAC has announced that the company will not resume assembly operations in its Thailand plant due to extensive equipment and facility damage beyond economic restoration....

SPIL chairman sees chip market at bottom

Jan 12, 14:20

The semiconductor market should hit bottom in the first quarter of 2012, and is expected to begin climbing out of the trough afterwards, according to Bough Lin, chairman for Siliconware...

SPIL chairman Bough Lin

ASE, SPIL post slight drops in 4Q11 sales

Jan 9, 16:42

Advanced Semiconductor Engineering (ASE) has announced that revenues of its core IC assembly test and material (ATM) business slid 2.1% sequentially in the fourth quarter of 2011,...

STATS ChipPAC breaks ground for new factory

Jan 6, 01:20

STATS ChipPAC on January 5 hold a groundbreaking ceremony for its new factory in Singapore, according to the chip test and packaging service provider. The new 197,000-square foot...

PTI buys Nexx tool for advanced packaging

Jan 4, 15:49

IC packaging and testing house Powertech Technology (PTI) has acquired a 12-inch electrochemical deposition (ECD) system from Nexx Systems. The Nexx Stratus will be used for copper...

Chipbond, ChipMOS develop alternative to gold bumping

Jan 3, 11:53

Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...

ChipMOS aims at 10-15% revenue growth in 2012

Jan 2, 11:36

Packaging and testing firm ChipMOS Technologies expects its revenues to increase 10-15% to top US$690 million in 2012, thanks to a pick-up in orders for panel-use driver ICs and new...

715 items [7/21]
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2015 global notebook demand forecast
Analysis of China revised domestic semiconductor industry goals

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