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News tagged packaging and testing
  • Last update: Wednesday 29 July 2015 [741 news items]

PTI ramping up logic IC backend service business

Sep 21, 01:10

Powertech Technology (PTI) has managed to increase the ratio of logic IC backend service business to more than 20% of its total sales recently, and expects its 3D IC technology to...

3D IC commercialization to take place in 2015-16, says ASE

Sep 6, 09:33

The adoption and commercialization of 3D TSV stacking IC technology and products will likely take place in the 2015-16 timeframe, according to Tong Ho-ming, general manager and chief...

Tong Ho-ming, general manager and chief of R&D at ASE

STATS ChipPAC advances TSV capabilities with qualification of mid-end manufacturing

Aug 29, 16:49

STATS ChipPAC has announced that its through-silicon-via (TSV) capabilities have achieved a new milestone with the qualification of its 300mm mid-end manufacturing operation and transition...

Backend firms expect orders for 28nm chips to pick up

Aug 29, 16:10

Taiwan Semiconductor Manufacturing Company (TSMC) is producing 28nm process ICs for Qualcomm and the first batch of shipments will be delivered to packaging and testing houses in...

ChipMOS announces new share buyback program

Aug 21, 13:58

ChipMOS Technologies has announced plans to effect a new US$10 million share repurchase program in compliance with Rule 10b5-1 and Rule 10b-18 under the Securities Exchange Act of...

ChipMOS expects 4-8% growth in 3Q12 sales

Aug 20, 15:46

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, expects to post sales growth of 4-8% sequentially in the third quarter of...

Japan IDMs to increase outsourcing of logic IC backend processing

Aug 17, 11:35

Major Japan-based IDM companies including Renesas, Sony and Toshiba are set to increase outsourcing of backend processing for logic ICs, and have approached existing and potential...

Sigurd to buy stake in fellow backend firm

Stockwatch - Aug 16, 15:08

Sigurd Microelectronics, a Taiwan-based packaging and testing company specializing in consumer and mature logic ICs, has unveiled plans to participate in an upcoming fundraiser by...

KYEC holds positive view for 2H12

Aug 15, 13:56

King Yuan Electronics (KYEC) expects its sales will be driven by brisk demand coming from the handset sector in the third quarter of 2012. The IC testing house has seen orders for...

Chipbond revenues hit two-year high in July 2012

Aug 10, 14:15

LCD driver IC packaging and testing firm Chipbond Technology has announced consolidated revenues of NT$1.27 billion (US$42.3 million) for July 2012 - the highest monthly result since...

Memory backend companies post mixed results in July

Aug 9, 14:42

Memory backend service companies have posted mixed results for July, with Powertech Technology (PTI) and Formosa Advanced Technologies (FATC) seeing their revenues decline for the...

Major IC packagers step up 2012 capex

Aug 6, 15:41

Advanced Semiconductor Engineering (ASE), Amkor Technology and Siliconware Precision Industries (SPIL) – the world's leading packaging and testing houses – have all set...

PTI 2Q12 beats estimates; sees challenges ahead

Aug 1, 12:09

Memory IC packaging and testing house Powertech Technology (PTI) has reported better-than-expected revenue and EPS results for the second quarter of 2012. But looking forward, the...

ASE, SPIL make progress in transition to copper wire bonding

Jul 31, 16:12

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have made progress toward the transition from gold to copper wire bonding, and have also stepped...

ASE, SPIL expect 3Q12 sales to rise

Jul 30, 14:27

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both expect their third-quarter sales to register another sequential growth buoyed by rising demand...

SPIL chairman Bough Lin expects company sales to grow through 4Q12

STATS ChipPAC profits fall

Jul 27, 11:46

STATS ChipPAC, a Singapore-based provider of semiconductor testing and assembly services, has announced net profits for the second quarter of its fiscal 2012 declined over 50% from...

Chipbond 3Q12 sales to grow up to 5%

Jul 13, 12:03

LCD-driver-IC packaging and testing house Chipbond Technology is expected to report sales growth of up to 5% sequentially for the third quarter of 2012, according to market sources...

STATS ChipPAC announces volume manufacturing of fcCuBE technology

Jul 9, 14:34

STATS ChipPAC has announced its fcCuBE technology - an advanced flip chip packaging technology that features copper (Cu) column bumps, bond-on-lead (BOL) interconnection and enhanced...

PTI, Walton to maintain orders after Micron-Elpida deal

Jul 3, 01:05

Micron Technology's takeover of DRAM maker Elpida Memory will not bring negative effects to Elpida's existing backend partners including Powertech Technology (PTI) and Walton Advanced...

MediaTek-MStar merger to have impact on existing suppliers

Jun 26, 12:37

The planned merger between MediaTek and MStar Semiconductor is expected to vertically integrate their supply chain. However, some market watchers speculate MediaTek will take over...

ASE to expand operations in Korea

Jun 25, 14:54

In view of the growing semiconductor industry in Korea, Advanced Semiconductor Engineering (ASE) is looking to expand its local factory site located in Paju, Gyeonggi Province, with...

ASE, SPIL gearing up for capacity expansion

Jun 21, 14:45

IC packaging and testing firms Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have both reiterated their commitment to expand capacity in 2012...

SPIL steps up capacity expansion

Jun 20, 11:53

IC packager Siliconware Precision Industries (SPIL) is stepping up capacity expansion efforts in 2012 with planned capital expenditure of a record NT$17.5 billion, chairman Bough...

Chipbond sees positive outlook for 2012

Jun 18, 14:54

Chipbond Technology is optimistic about the business prospects for 2012, according to the LCD driver IC packaging and testing specialist. The firm added it would continue to build...

Major Taiwan IC backend firms to post over 5% sales growth in 2Q12

Jun 11, 12:27

Major Taiwan-based IC packaging and testing houses including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), Powertech Technology (PTI) and Chipbond...

ASE-USI deal probed for possible insider trading

Jun 11, 11:39

The Taipei Prosecutors' Office on June 8 began a probe into insider trading suspicions involving Advanced Semiconductor Manufacturing's (ASE) takeover of Universal Scientific Indus...

ASE, SPIL post sales growth in May

Jun 7, 16:09

IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) both saw their May revenues register single-digit growth.

Chipbond lands 8-inch gold bumping orders from Samsung, says paper

Newswatch - Jun 4, 14:23

LCD driver IC packaging and testing specialist Chipbond Technology reportedly has landed orders for 8-inch gold bumping from Samsung Electronics with shipments to begin in the third...

ASE opens new manufacturing facility in China

May 31, 15:09

Packaging and testing firm Advanced Semiconductor Engineering (ASE) has announced the opening of its Phase 3 manufacturing facility in Weihai, Shangdong province, China. The new building...

SPIL to expand packaging, testing capacity at China subsidiary

May 28, 10:39

Siliconware Precision Industries (SPIL), a Taiwan-based provider of IC packaging/testing service, will add investment of US$100 million in Siliconware Technology (Suzhou) to expand...

ASE, SPIL post slight drops in April sales

May 8, 01:10

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported slight decreases in consolidated revenues for April 2012. ASE announced consolidated...

Chipbond, ChipMOS 2Q12 sales expected to grow

May 7, 15:41

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales register single-digit growth sequentially thanks...

ASE to issue overseas convertible bonds worth NT$9 billion

May 4, 14:02

Taiwan's Advanced Semiconductor Engineering (ASE), which provides semiconductor assembly and test services, has announced plans to issue overseas convertible bonds worth up to NT$9...

PTI, Walton post better-than-expected 1Q12 profits

May 2, 16:33

Despite early media speculation that Elpida Memory's bankruptcy filing would impact its supply-chain partners' business performance, Powertech Technology (PTI) and Walton Advanced...

Memory backend firms likely to post double-digit growth in 2Q12

Apr 18, 11:16

The visibility of orders for DRAM memory will become clearer in the second quarter of 2012, as demand is picking up from notebook vendors who are gearing up for product launch, industry...

741 items [7/22]
Realtime news
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    Before Going to Press | Jul 29, 21:51

  • High-end graphics cards become new focus for vendors

    Before Going to Press | Jul 29, 21:51

  • Low order visibility for 2H15, says SPIL chairman

    Before Going to Press | Jul 29, 21:49

  • WearWise unveils new wearable camera

    Before Going to Press | Jul 29, 21:48

  • Motorola launches 3 new smartphones

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  • Corning announces 2Q15 core sales of US$2.5 Billion

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