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News tagged packaging and testing
  • Last update: Friday 11 April 2014 [666 news items]

Amkor licenses proprietary through-mold-via technology to Shinko

Apr 2, 10:22

Amkor Technology has announced that the company has granted Shinko Electric Industries a non-exclusive license to its proprietary through-mold-via (TMV) technology.

ASE, SPIL remain conservative on business outlook

Mar 20, 14:41

While the recent news that Taiwan Semiconductor Manufacturing Company (TSMC) is mulling an upward revision in 2012 capex has boosted market observers' confidence in the outlook for...

ChipMOS expects sales growth in 2012

Mar 19, 16:15

Packaging and testing firm ChipMOS Technologies has forecast consolidated revenues for 2012 will increase 10%. The company revealed that net revenues on a US GAAP basis for 2011 grew...

4G power amplifiers to buoy Sigurd sales in 2012

Mar 15, 14:50

Packaging and testing house Sigurd Microelectronics reportedly has landed new orders for 4G LTE chips, including those placed by Anadigics and other major power amplifier suppliers...

Silterra launches 130nm CMOS logic aluminum backend technology

Mar 14, 14:40

Malaysia-based wafer foundry Silterra has announced the release of 130nm CMOS logic technology with aluminum backend interconnection, CL130AL, for mainstream and high-volume consumer...

Aptos expanding 12-inch wafer level packaging business

Mar 14, 14:30

Aptos Technology, which specializes in backend services for the production of NAND flash chips and devices such as microSD cards, announced March 13 that two of its subsidiaries will...

Chipbond sees flat growth in 1Q12 sales

Mar 13, 14:22

Chipbond Technology, which provides packaging and testing services for driver ICs used mainly in TV and handset panels, expects its consolidated revenues to register flat sequential...

ASE February sales up, SPIL down

Mar 9, 11:01

Advanced Semiconductor Engineering (ASE) saw sales of its core IC ATM (assembly test and material) business grow 3.9% on month to NT$9.49 billion (US$320 million) in February 2012...

STATS ChipPAC intros new 3D eWLB PoP solutions

Mar 7, 11:35

STATS ChipPAC, a semiconductor test and advanced packaging service provider, has announced its next-generation three dimensional (3D) embedded wafer-level ball grid array (eWLB) package-on-package...

SPIL chair sees chip market rebound

Feb 16, 16:40

The global semiconductor market is expected to stage a quick recovery after hitting bottom in the first quarter of 2012, Silicon Precision Industries (SPIL) chairman Bough Lin said...

SPIL chairman Bough Lin

SPIL 4Q11 profits up 5%; 2011 EPS at NT$1.55

Feb 15, 16:02

IC packager Silicon Precision Industries (SPIL) has reported NT$1.17 billion (US$39.7 million) in net profits for the fourth quarter of 2011, up 5.2% from a year earlier, with revenues...

ASE expects sales rebound in 2Q12

Feb 13, 10:46

Advanced Semiconductor Engineering (ASE) has estimated that its core IC assembly test and material (ATM) business will post another sequential decrease of 6-9% in shipments in the...

ASE expects sales rebound in 2Q12

Chipbond sales to rise 5% in 1Q12, says paper

Newswatch - Feb 10, 14:21

LCD driver IC packaging and testing specialist Chipbond Technology is expected to see its consolidated revenues increase as much as 5% sequentially in the first quarter of 2012, beating...

ASE, SPIL post sales drops in January

Feb 9, 01:40

IC packagers Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported decreases in January 2012 consolidated revenues from the previous month...

STATS ChipPAC to shut Thailand plant

Feb 1, 14:34

STATS ChipPAC has announced that the company will not resume assembly operations in its Thailand plant due to extensive equipment and facility damage beyond economic restoration....

SPIL chairman sees chip market at bottom

Jan 12, 14:20

The semiconductor market should hit bottom in the first quarter of 2012, and is expected to begin climbing out of the trough afterwards, according to Bough Lin, chairman for Siliconware...

SPIL chairman Bough Lin

ASE, SPIL post slight drops in 4Q11 sales

Jan 9, 16:42

Advanced Semiconductor Engineering (ASE) has announced that revenues of its core IC assembly test and material (ATM) business slid 2.1% sequentially in the fourth quarter of 2011,...

STATS ChipPAC breaks ground for new factory

Jan 6, 01:20

STATS ChipPAC on January 5 hold a groundbreaking ceremony for its new factory in Singapore, according to the chip test and packaging service provider. The new 197,000-square foot...

PTI buys Nexx tool for advanced packaging

Jan 4, 15:49

IC packaging and testing house Powertech Technology (PTI) has acquired a 12-inch electrochemical deposition (ECD) system from Nexx Systems. The Nexx Stratus will be used for copper...

Chipbond, ChipMOS develop alternative to gold bumping

Jan 3, 11:53

Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...

ChipMOS aims at 10-15% revenue growth in 2012

Jan 2, 11:36

Packaging and testing firm ChipMOS Technologies expects its revenues to increase 10-15% to top US$690 million in 2012, thanks to a pick-up in orders for panel-use driver ICs and new...

KYEC chair highlights short-term challenges

Dec 28, 13:58

King Yuan Electronics (KYEC), a Taiwan-based firm specializing in IC testing, has pointed out a number of factors which the prospect for its 2012 business operation will depend on.

KYEC chairman CK Lee

PTI looking to become world No. 4 packaging, testing firm

Dec 26, 12:13

Powertech Technology's (PTI) plan to acquire a controlling stake in Greatek Electronics will further expand its backend service offerings and production capacity for the logic IC...

PTI to see 10-15% revenue drop in 1Q12

Dec 26, 10:07

Powertech Technology (PTI) holds a conservative view towards its business in the first quarter of 2012, due to the ongoing European debt crisis that continues to weigh on demand,...

DK Tsai of PTI

Chip equipment spending to decline following two years of growth, says Gartner

Dec 16, 15:53

Worldwide semiconductor capital equipment spending is expected to total US$51.7 billion in 2012, a 19.5% decline from projected 2011 spending of US$64.2 billion, according to Gartn...

STATS ChipPAC says Thailand factory to resume partial operations in 1Q12

Dec 8, 01:15

STATS ChipPac's operations in Thailand, which have been stopped since October 17 due to recent flooding in the country, are expected to resume partially in the first quarter of 2012,...

ASE revenues down 5% in November

Dec 7, 16:44

Advanced Semiconductor Engineering (ASE) has reported its core ATM (assembly test and material) division generated revenues of NT$10.7 billion (US$356 million) in November 2011, down...

SPIL posts slight drop in November revenues

Dec 6, 15:06

IC assembly and test service provider Silicon Precision Industries (SPIL) has announced consolidated revenues of NT$5.26 billion (US$174 million) for November 2011, down 1.7% on month...

Copper pillar bump penetration of FC packaging to rise

Nov 29, 12:25

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...

Walton to buy stake in Elpida subsidiary

Nov 28, 10:34

Elpida Memory has announced that Taiwan-based Walton Advanced Engineering, which provides packaging and testing services mainly for DRAM products, has agreed to make a JPY3.75 billion...

AKM to outsource more backend processing, says president

Nov 24, 15:52

Japan-based Asahi Kasei Microdevices (AKM), a supplier of mixed-signal ICs for consumer, automotive and communications applications, is looking to raise its backend orders to partners...

AKM president Hideki Kobori

Focus on small, cost-effective packages: Q&A with STATS ChipPAC CEO Tan Lay Koon

Nov 21, 13:48

Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that...

STATS ChipPAC CEO Tan Lay Koon

Toshiba puts on hold sale of Malaysian operation

Nov 17, 15:41

Toshiba and Amkor Technology have both agreed to postpone discussions regarding the previously-announced proposed acquisition by Amkor of Toshiba's semiconductor assembly operations...

STATS ChipPAC to open new wafer-level packaging plant in Taiwan, says paper

Newswatch - Nov 14, 16:40

STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...

ASE to acquire 100% stake in Power ASE

Stockwatch - Nov 11, 11:54

IC packager Advanced Semiconductor Engineering (ASE) has announced plans to acquire up to 107 million shares of Power ASE Technology, a joint venture with memory chipmaker Powerchip...

666 items [6/20]
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2014 global mobile application processor market forecast