Major Taiwan IC backend firms developing copper pillar bumping

Jun 27, 13:54

Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have...

ASE subsidiary sells DRAM testing equipment to PTI

Jun 27, 11:30

Power ASE Technology, a subsidiary of Advanced Semiconductor Engineering (ASE) specializing in DRAM packaging and testing, has announced that the company has sold some of its high-speed...

TI reportedly cuts wafer starts at TSMC, UMC

Jun 15, 16:49

Texas Instruments (TI) has cut its orders to Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC), according to sources in the industry...

PTI, Walton 3Q11 revenues expected to grow 5-10%

Jun 15, 15:38

Powertech Technology and Walton Advanced Engineering, which specialize in memory IC packaging and testing, are expected to enjoy revenue growth of 5-10% sequentially in the third...

Sigurd May revenues up 5% on easing supply chain concerns

Newswatch - Jun 9, 01:25

IC packaging and testing house Sigurd Microelectronics has announced consolidated revenues increased 4.5% on month to NT$396 million (US$14 million) in May 2011. Sales were able to...

IC packagers post slight growth in May revenues

Jun 8, 10:19

Advanced Semiconductor Engineering (ASE) has announced that sales of its ATM (assembly test and material) division grew 1.8% sequentially to NT$10.95 billion (US$382 million) in May...

KYEC lands new order for FRAM

May 26, 01:00

King Yuan Electronics (KYEC) has obtained orders from Ramtron International, a supplier of non-volatile ferroelectric random access memory (FRAM), according to the chip assembly and...

Improved demand for LCD panels to boost Chipbond 2Q11 performance

May 23, 15:55

The market of large-size LCD panels have been improving recently. LCD driver IC packaging and testing firm Chipbond Technology has stated the possibility of a better second quarter...

ASE, SPIL April sales down slightly on-month

May 9, 16:11

Chip packaging and testing firms Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL) have reported sequential drops of 2.5% and 5.1%, respectively, in...

Packaging material supplier Chang Wah sees growth in 2Q11 sales

May 9, 16:00

Chang Wah Electromaterials, which distributes packaging materials and equipment for the semiconductor and LCD industries, expects sales to grow sequentially in the second quarter...

STATS ChipPAC reaches milestone of over 300 million copper wirebond units shipped

May 4, 13:45

STATS ChipPAC has shipped over 300 million semiconductor packages with copper wirebond interconnect, according to the company. Its previous milestone with shipments of more than 100...

ASE sees 7-9% growth in 2Q11 shipments; copper wire bonding sales rising

May 2, 14:01

Chip packager Advanced Semiconductor Engineering (ASE) expects shipments to increase 7-9% sequentially in the second quarter of 2011, with a higher gross margin, company CFO Joseph...

Normal substrate supply to resume in June, says SPIL chairman

Apr 28, 01:10

Siliconware Precision Industries (SPIL) chairman Bough Lin on April 27 confirmed that the company has been facing stretched lead times for its IC substrates due to limited availability...

IC testing firm Thailin to control packaging house ChipMOS Shanghai

Apr 25, 15:58

IC testing house Thailin Semiconductor will spend US$39.95 million to take up the control of ChipMOS Technologies (Shanghai) through the purchase of Modern Mind Technology, which...

Intel names preferred quality supplier award winners for 2010

Apr 20, 11:21

Intel has announced 16 recipients of the Preferred Quality Supplier (PQS) award, which is part of a company program that encourages suppliers to strive for excellence and continuous...

ChipMOS reports growth in 1Q11 revenues

Apr 19, 16:52

IC packaging and testing firm ChipMOS Technologies (Bermuda) has reported NT$1.57 billion (US$53.3 million) in March 2011 revenues, up 15.7% sequentially and 20.9% on year. Revenues...

STATS ChipPAC expands TSV offering

Apr 19, 10:38

STATS ChipPAC has expanded its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities, according to the company.

IC testing firm KYEC cautious about 2Q11

Apr 11, 15:04

King Yuan Electronics (KYEC) has expressed concerns that it may experience a particularly weak second quarter of 2011, as clients turn cautious about placing orders due to shortages...

ASE core ATM unit posts 5% sales drop in 1Q11; SPIL also down

Apr 8, 14:30

Advanced Semiconductor Engineering (ASE) has announced that sales of its ATM (assembly test and material) division slid 5.3% sequentially to NT$30.88 billion (US$1.07 billion) in...

Chipbond remains cautious about 2Q11

Apr 8, 11:28

LCD driver IC packaging and testing firm Chipbond Technology has remained cautious about the outlook for the second quarter due to low order visibility. The company expects to report...

IC packager Lingsen shares up on increased InvenSense orders, says report

Newswatch - Apr 7, 14:34

InvenSense, which supplies MEMS gyroscopes for the Nintendo 3DS, is expected to increase its orders to backend partner Lingsen Precision Industries due to strong demand for the recently-launched...

ASE mulls plant expansion, says paper

Newswatch - Apr 6, 15:04

IC packager Advanced Semiconductor Engineering (ASE) has submitted an application to Taiwan's Ministry of Economic Affairs (MOEA), seeking approval to invest US$800-900 million to...

Packaging and testing house Sigurd breaks ground for new factory, says report

Newswatch - Mar 31, 14:32

IC packaging and testing house Sigurd Microelectronics has broken ground on a new factory building located next to its existing production site in Hsinchu, northern Taiwan, according...

Global semiconductor materials sales grow 25% in 2010, says SEMI

Mar 30, 16:10

The global semiconductor materials market increased 25% in 2010 compared to 2009 as the semiconductor industry shipped record units, according to SEMI. Record device shipments are...

ASE shipments affected by material supply interruptions, says paper

Newswatch - Mar 30, 15:02

Major IC packaging house Advanced Semiconductor Engineering (ASE) will have to postpone a portion of its shipments scheduled for the second quarter of 2011 to the third quarter, due...

Outsourced IC backend growth accelerating, says Digitimes Research

Mar 25, 15:11

The total market for semiconductor packaging and testing services grew 17.7% to US$44.755 billion in 2010, according to Digitimes Research. This represents the largest growth since...

Walton to loan Powerchip NT$300 million

Stockwatch - Mar 24, 10:40

Walton Advanced Engineering's board of directors has approved a proposal to lend Powerchip Technology NT$300 million (US$10 million), according to a company filing with the Taiwan...

Elpida says packaging and testing unit back in operation

Mar 17, 12:35

Elpida Memory has announced that Akita Elpida Memory, a packaging and testing subsidiary of Elpida, has resumed production on restoration of electricity supply.

China-based CRM sets up marketing subsidiary in Taiwan

Mar 15, 14:10

China Resources Microelectronics (CRM), a China-based provider of IC design, foundry, packaging/testing services and manufacturing of discrete devices, has initially invested NT$10...

PTI announces investment in Elpida subsidiary

Stockwatch - Mar 11, 12:13

Powertech Technology (PTI), a major memory-IC packaging and testing company in Taiwan, plans to make a JPY4.1 billion (US$49.5 million) investment in EBS, a wholly-owned subsidiary...

PTI sales up 14% on year in February

Mar 9, 11:58

Memory packaging and testing firm Powertech Technology (PTI) has announced that consolidated revenues for February 2011 grew 14.3% from a year earlier to NT$3.2 billion (US$109 mil...

ASE February sales down 11% sequentially

Mar 9, 10:53

Advanced Semiconductor Engineering (ASE) has announced consolidated revenues of NT$13.87 billion (US$471.5 million) for February 2011, down 11.1% sequentially. However, February sales...

Taiwan packaging and testing firms post sequential drops in February

Mar 8, 14:07

All major Taiwan-based chip packaging and testing firms saw sequential declines in consolidated sales in February 2011.