Unimicron Technology, Kinsus Interconnect Technology and Nan Ya PCB are all poised to generate substantial revenue increases in the second half of 2021, as strong order momentum for...
DRAM chipmaker Nanya Technology saw its revenue reach a 34-month high of NT$7.95 billion (US$285.6 million) in July 2021, while specialty DRAM and flash chipmaker Winbond Electronics'...
Taiwan-based Nan Ya PCB expects its revenues to grow quarter by quarter in the second half of the year along with gradual capacity expansions at its plants in Taiwan and China, after...
Nan Ya Plastics expects to enjoy more robust growth in sales of its copper foil and other electronic materials in the second half of 2021, while seeking more vertical integration...
IC substrate maker Kinsus Interconnect Technology saw its net profits for second-quarter 2021 shoot up 202% on year to NT$1.01 billion (US$36.1 million), thanks to substantial improvements...
ABF substrate supply is likely to remain short of demand through 2023 although makers in Taiwan, Japan and South Korea have all geared up capacity expansions at the request of chipmaking...
Niche-market DDR3 memory prices will continue to register double-digit increases in the third and fourth quarters of 2021, due mainly to supply-side constraints, according to industry...
ABF substrate prices are likely to rise quarter by quarter in the second half of the year, as demand for such substrates continues to outgrow new capacity supply, according to industry...
DRAM contract prices, which registered a substantial increase in the second quarter of 2021, are expected to continue their rally in the third quarter, according to chipmaker Nanya...
Nan Ya PCB and Kinsus Interconnect Technology both saw their June revenue climb over 30% from a year earlier, driven mainly by the arrival of new production capacity, according to...
DRAM chipmaker Nanya Technology has reported revenue of NT$22.64 billion (US$808.9 million) for the second quarter of 2021, the highest in 11 quarters.
Taiwan memory backend specialists are optimistic about their business prospects for the second half of the year as memory demand for handset and other consumer electronics applications...
Intel, AMD and Nvidia are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025, according to...