AMD's MI300 can co-exist with ASICs and GPU solutions in the AI chip market, CEO Lisa Su has said recently, stressing that its latest AI chip is very powerful and gaining market traction...
Microsoft's top executives have heralded the present era as the "Edison moment for AI" during their high-profile appearance at the annual summit of the Taiwan Semiconductor Industry...
Microsoft achieved its most robust sales growth in the past six quarters, driven by the resurgence of cloud computing, the increasing demand for new artificial intelligence products,...
Realtek Semiconductor remains cautious about its sales prospects for the fourth quarter of 2023, as unfavorable macro conditions continue to weigh on end-market demand, according...
PC demand is rebounding, but the supply chain should remain cautious about the possibility of black swan events, according to Acer chairman and CEO Jason Chen.
In the rapidly evolving semiconductor industry, the emergence of CXL (Compute Express Link) as an interconnect specification has captured the spotlight. Samsung Electronics and SK...
From the perspective of the component and end-device market, 2023 has not been a very good year for the tech industry, However, for software giant Microsoft, the emergence of AI has...
Generative AI has driven the demand for high-performance computing (HPC) and high-speed transmission, which in turn is adding development momentum to silicon photonics optical communication...
The scale of generative AI is estimated to double in three years, but its widespread adoption must still rely on developers creating more customized applications, according to Andrew...
Speculation has emerged that Microsoft has scaled down its orders for Nvidia's H100 AI chips, which some industry sources believe could help other companies get their hands on more...
Taiwan-based IC design houses are optimistic about demand from a new surge of PC replacements anticipated for 2024, driven by replacements for PCs bought during the pandemic and Microsoft's...
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...