Lam Research and KLA-Tencor have entered into an agreement for Lam to acquire all outstanding KLA-Tencor shares in a cash-and-stock transaction, according to the companies.
Semiconductor equipment maker KLA-Tencor has announced plans to invest a total of US$3 million to set up a local equipment training center in Taiwan slated for completion in April...
KLA-Tencor has announced its next-generation LED patterned wafer inspection tool, the ICOS WI-2280. Designed specifically for defect inspection and 2D metrology for LED applications,...
KLA-Tencor has announced the installation of its first process control systems capable of handling and inspecting 450mm wafers. Fully automated, the Surfscan SP3 450 meets the demanding...
Fab-tool vendor KLA-Tencor has announced the availability of its latest wafer defect inspection systems, and is shipping the products to its clients in the foundry, logic and memory...
KLA-Tencor has announced three new wafer defect inspection systems for leading-edge chip manufacturers: the 2900, Puma 9650 and eS800 systems. Designed to address a wide range of...
KLA-Tencor has announced a new tool for chip manufacturing at the 20nm device nodes and below: the eDR-7000 electron-beam (e-beam) wafer defect review system.
KLA-Tencor has introduced FabVision Solar, a new integrated solution designed to help PV cell manufacturers improve production yield and profitability by enabling manufacturers to...
Globalfoundries, Jeol, KLA-Tencor, NuFlare Technology, Petersen Advanced Lithography and Samsung Electronics have joined the eBeam Initiative - a forum dedicated to the education...
KLA-Tencor has introduced the Teron 600-series reticle defect inspection system to address a major transition in mask design at the 2Xnm logic (3Xnm half-pitch memory) node. The new...
R&D expenses are estimated to equal 25% of KLA-Tencor's overall sales in 2009, with the expenditure mainly on the development of next-generation products for 3X/2Xnm and beyond...
KLA-Tencor has announced two new wafer inspection systems and a new electron-beam (e-beam) review system to address defect issues at the 3Xnm / 2Xnm nodes. Each new tool can preferentially...
KLA-Tencor today (May 13) launched the AcuShape 3D software modeling tool, developed with Tokyo Electron, to meet optical dimension metrology requirements for the 32nm node and bel...
Taiwan Semiconductor Manufacturing Company (TSMC) has recently spent a total of almost NT$5 billion (US$145 million) on five separate machinery equipment purchases. The amount already...
