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News tagged Infineon
  • Last update: Monday 15 December 2014 [54 news items]

iPhone 3GS carries US$179 BOM, says iSuppli

Jun 25, 11:02

With the new iPhone 3GS's Bill of Materials (BOM) and feature set nearly the same as the previous model in the iPhone line, you might think the product's component selection would...

2008 industrial semiconductor revenues overtake automotive; Infineon, STMicro remain top-2 suppliers, says Semicast

May 13, 16:24

According to Semicast Research, revenues for semiconductors in the industrial sector exceeded those in the automotive sector for the first time in 2008. Semicast estimates that industrial...

Infineon to delist from NYSE

Apr 6, 09:59

Infineon Technologies has announced that it has applied to voluntarily delist its American depositary shares (ADSs) from the New York Stock Exchange (NYSE). The company expects that...

Car crisis raises concerns over MEMS market, says iSuppli

Mar 24, 14:44

The gut-wrenching downturn in the global automotive industry has spurred the shutdown of Systron Donner Automotive, the world's second-largest supplier of car quartz micro-electromechanical...

Infineon ships more than 100 million chips for ultra-low-cost handsets

Jan 22, 13:55

Infineon Technologies has sold more than 100 million chips for the so called ultra-low-cost handset segment. The X-GOLD101 (E-GOLDvoice) mobile communications chip is the second generation...

Merger of China foundries HHNEC and GSMC likely soon

Jan 14, 11:28

With the current president and CEO of Grace Semiconductor Manufacturing Corporation (GSMC) said to have been charged in a bribery case, industry sources in China have speculated that...

Apple may add Broadcom to its iPhone supply chain, say Taiwan OEMs

Jan 7, 16:50

Apple is rumored to possibly be considering adding Broadcom to its iPhone supply chain, according to Taiwan OEMs who have seen Broadcom's baseband and RF chips on PCBs believed to...

Power management and driver IC market to fall 3% in 2009, says IMS Research

Dec 22, 11:25

The global power management (PW) and driver IC market will experience a revenue decline of around 3% in 2009, mainly due to the current slowdown in consumer spending, IMS Research...

Qimonda receives rescue loan of 325 million euros

Dec 22, 10:00

Qimonda has announced that the company has arranged a financing package of 325 million euros (US$445.58 million) for the ramp up of its Buried Wordline technology. The rescue package...

Taiwan DRAM deserves rescue: Q&A with ProMOS chairman ML Chen

Dec 19, 14:51

The Taiwan DRAM industry has been constructed and developed progressively for over 10 years, playing a decisive role in the global semiconductor market, according to ML Chen, chairman...

ProMOS chairman ML Chen

DRAM maker Winbond may lose technological support if Qimonda falls, says paper

Newswatch - Dec 18, 12:29

Taiwan-based DRAM maker Winbond Electronics may have difficulties securing continued technological support from Qimonda, which could be unable to maintain its operations through out...

MediaTek not to supply handset chips to Nokia or Motorola next year

Nov 26, 11:38

While Texas Instruments (TI), Infineon Technologies and Freescale Semiconductor are expected to be on the supplier lists of Nokia and Motorola for 2.5G handset chips next year, MediaTek...

Infineon introduces ultra-low cost dual-SIM integrated on a single platform

Nov 21, 16:52

Infineon has announced its new ultra-low cost dual-SIM platform. The XMM1028 is based on the X-GOLD102DS and is a cost optimized single baseband solution for dual-SIM platforms. Negating...

Infineon tops market of semiconductors for medical applications, says research firm

Oct 16, 11:41

The industrial/medical sector has risen in importance at many semiconductor vendors over the last few years as suppliers have come to identify the market as dependable throughout...

Arima handset shipments to LGE to jump to 10 million units in 2009

Aug 27, 01:15

LG Electronics (LGE), ambitiously eyeing the emerging markets, has placed orders with Arima Communications for at least 12 new 2.5G handsets, with shipments to reach as many as 10...

STMicroelectronics, STATS ChipPAC and Infineon to set new milestone in establishing wafer-level packaging standards

Aug 8, 09:49

STMicroelectronics, STATS ChipPAC and Infineon Technologies announced that they have signed an agreement to jointly develop next-generation embedded wafer-level ball-grid array (eWLB)...

Commentary: MediaTek set to do battle in global 3G handset chipset market in 2009

Aug 4, 17:21

With MediaTek announcing that it is sampling its 3G WCDMA solution with customers at the end of 2008, the company joins the competition in the global 3G handset chipset market with...

Apple stresses cost reduction for iPhone 3G, teardown reveals

Jul 16, 10:52

The new iPhone 3G sports an evolutionary design that favors cost reduction instead of cutting-edge features, supporting Apple's goal of expanding its market share and achieving a...

KYEC expects IDM business proportion to increase to 30% in 2009

Jun 27, 01:25

With increasing IDM orders from vendors including STMicroelectronics, Infineon and NXP Semiconductors, as well as clients in Europe, IC testing house King Yuan Electronics Company...

54 items [2/2]
2015 China IC design market forecast
2015 China smartphone panel trend forecast

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The transition to 4k TV - UHD TV market forecast, 2014-2017
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.