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News tagged Infineon
  • Last update: Monday 15 December 2014 [54 news items]

iPhone 3GS carries US$179 BOM, says iSuppli

Jun 25, 11:02

With the new iPhone 3GS's Bill of Materials (BOM) and feature set nearly the same as the previous model in the iPhone line, you might think the product's component selection would...

2008 industrial semiconductor revenues overtake automotive; Infineon, STMicro remain top-2 suppliers, says Semicast

May 13, 16:24

According to Semicast Research, revenues for semiconductors in the industrial sector exceeded those in the automotive sector for the first time in 2008. Semicast estimates that industrial...

Infineon to delist from NYSE

Apr 6, 09:59

Infineon Technologies has announced that it has applied to voluntarily delist its American depositary shares (ADSs) from the New York Stock Exchange (NYSE). The company expects that...

Car crisis raises concerns over MEMS market, says iSuppli

Mar 24, 14:44

The gut-wrenching downturn in the global automotive industry has spurred the shutdown of Systron Donner Automotive, the world's second-largest supplier of car quartz micro-electromechanical...

Infineon ships more than 100 million chips for ultra-low-cost handsets

Jan 22, 13:55

Infineon Technologies has sold more than 100 million chips for the so called ultra-low-cost handset segment. The X-GOLD101 (E-GOLDvoice) mobile communications chip is the second generation...

Merger of China foundries HHNEC and GSMC likely soon

Jan 14, 11:28

With the current president and CEO of Grace Semiconductor Manufacturing Corporation (GSMC) said to have been charged in a bribery case, industry sources in China have speculated that...

Apple may add Broadcom to its iPhone supply chain, say Taiwan OEMs

Jan 7, 16:50

Apple is rumored to possibly be considering adding Broadcom to its iPhone supply chain, according to Taiwan OEMs who have seen Broadcom's baseband and RF chips on PCBs believed to...

Power management and driver IC market to fall 3% in 2009, says IMS Research

Dec 22, 11:25

The global power management (PW) and driver IC market will experience a revenue decline of around 3% in 2009, mainly due to the current slowdown in consumer spending, IMS Research...

Qimonda receives rescue loan of 325 million euros

Dec 22, 10:00

Qimonda has announced that the company has arranged a financing package of 325 million euros (US$445.58 million) for the ramp up of its Buried Wordline technology. The rescue package...

Taiwan DRAM deserves rescue: Q&A with ProMOS chairman ML Chen

Dec 19, 14:51

The Taiwan DRAM industry has been constructed and developed progressively for over 10 years, playing a decisive role in the global semiconductor market, according to ML Chen, chairman...

ProMOS chairman ML Chen

DRAM maker Winbond may lose technological support if Qimonda falls, says paper

Newswatch - Dec 18, 12:29

Taiwan-based DRAM maker Winbond Electronics may have difficulties securing continued technological support from Qimonda, which could be unable to maintain its operations through out...

MediaTek not to supply handset chips to Nokia or Motorola next year

Nov 26, 11:38

While Texas Instruments (TI), Infineon Technologies and Freescale Semiconductor are expected to be on the supplier lists of Nokia and Motorola for 2.5G handset chips next year, MediaTek...

Infineon introduces ultra-low cost dual-SIM integrated on a single platform

Nov 21, 16:52

Infineon has announced its new ultra-low cost dual-SIM platform. The XMM1028 is based on the X-GOLD102DS and is a cost optimized single baseband solution for dual-SIM platforms. Negating...

Infineon tops market of semiconductors for medical applications, says research firm

Oct 16, 11:41

The industrial/medical sector has risen in importance at many semiconductor vendors over the last few years as suppliers have come to identify the market as dependable throughout...

Arima handset shipments to LGE to jump to 10 million units in 2009

Aug 27, 01:15

LG Electronics (LGE), ambitiously eyeing the emerging markets, has placed orders with Arima Communications for at least 12 new 2.5G handsets, with shipments to reach as many as 10...

STMicroelectronics, STATS ChipPAC and Infineon to set new milestone in establishing wafer-level packaging standards

Aug 8, 09:49

STMicroelectronics, STATS ChipPAC and Infineon Technologies announced that they have signed an agreement to jointly develop next-generation embedded wafer-level ball-grid array (eWLB)...

Commentary: MediaTek set to do battle in global 3G handset chipset market in 2009

Aug 4, 17:21

With MediaTek announcing that it is sampling its 3G WCDMA solution with customers at the end of 2008, the company joins the competition in the global 3G handset chipset market with...

Apple stresses cost reduction for iPhone 3G, teardown reveals

Jul 16, 10:52

The new iPhone 3G sports an evolutionary design that favors cost reduction instead of cutting-edge features, supporting Apple's goal of expanding its market share and achieving a...

KYEC expects IDM business proportion to increase to 30% in 2009

Jun 27, 01:25

With increasing IDM orders from vendors including STMicroelectronics, Infineon and NXP Semiconductors, as well as clients in Europe, IC testing house King Yuan Electronics Company...

54 items [2/2]
Realtime news
  • Acer unveils smart classrooms in China

    IT + CE | 1h 51min ago

  • Testing equipment supplier Zen Voce to list on Taiwan OTC securities market

    Bits + chips | 2h 12min ago

  • Notebook panel pricing declines 1% throughout mid-December, says DisplaySearch

    Displays | 2h 34min ago

  • Taiwan market: NCC to probe 4G cooperation row

    Mobile + telecom | 2h 59min ago

  • SPIL to meet 4Q14 guidance

    Bits + chips | 3h 25min ago

  • Ardentec responds to report on 2014 earnings

    Bits + chips - Stockwatch | Dec 25, 22:26

  • Digitimes Research: Microsoft Band to make headway in mobile device market

    Mobile + telecom | Dec 25, 22:25

  • Touch panel makers faced with increasing competition from panel makers, say Taiwan makers

    Displays | Dec 25, 22:20

  • Digitimes Research: Smart wearable device shipments in Japan in 2014 estimated at 2.75 million units

    Before Going to Press | Dec 25, 22:07

  • Compal Electronics plans to hike ODM prices by 5-15% to reflect wage hikes in China

    Before Going to Press | Dec 25, 22:06

  • Asustek expects to ship 8 million ZenFone smartphones in 2014

    Before Going to Press | Dec 25, 22:03

  • Chunghwa Telecom setting up data center

    Before Going to Press | Dec 25, 22:02

  • Ardentec responds to report on 2014 earnings

    Before Going to Press | Dec 25, 22:02

  • China PV power stations, systems found to have quality problems, says CGC

    Before Going to Press | Dec 25, 22:01

  • TSMC investment plan in central Taiwan being blocked

    Before Going to Press | Dec 25, 21:56

  • Innolux denies change in chairman again

    Before Going to Press | Dec 25, 21:56

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Wireless broadband developments in Southeast Asia markets
Trends and forecasts for the China FPD industry, 2014-2017

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Greater China touch panel shipment forecast through 2015
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • Greater China touch panel shipment forecast through 2015

    This Special Report provides forecasts through 2015 for Greater China touch panel shipments with breakdowns based on technology (glass, film, resistive), application (smartphone, NB and tablet) and by firm.

  • 2014 global tablet demand forecast

    This report analyzes the main players, their strategies and shipments forecasts for 2014, as well as other factors contributing to either growth or decline in various segments within the tablet market, with a particular focus on Apple, Google, Samsung, and Microsoft, along with whitebox vendors.