GEM Services, which specializes in packaging semiconductor power devices, and CMOS image sensor backend specialist Kingpak Technology both saw their revenues for the first quarter...
Taiwan-based Spirox, which distributes packaging and testing equipment, has signed a new contract with Japan's ShibaSoku under which Spirox will sell ShibaSoku's semiconductor test...
Foxconn Electronics (Hon Hai Precision Industry) has teamed up with China's Jinan municipal government to set up a CNY3.75 billion (US$545.9 million) investment fund to boost the...
Taiwan discrete components maker Panjit International is stepping up the development of high-power IGBT devices for automotive and mass transportation uses while expecting uninterruptible...
Taiwan power discrete component supplier HY Electronic (HYE) has seen clear order visibility for the second half of 2018, as its automotive diodes have passed verifications by Germany...
Despite a nearly 10% on-year drop in 2017 consolidated revenues, Taiwan-based power supply maker AcBel Polytech still expects its 2018 revenues to benefit from volume production of...
With the global PC market entering the traditional slow season and demand from China's automotive electronics market turning weak, medium- to high-power MOSFET chips have seen shipment...
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has introduced two new modules that enable its T2000 IPS system to test high-voltage and high-power...
Lextar Electronics has obtained third-party certification based on AEC (Automotive Electronics Council) Q101 standards for its high-power LED devices for automotive headlights from...
Electric car, solar energy and smart grid manufacturing sectors have become the main focuses of industrial development for many countries recently, and the development of these sectors,...
Shipments of high-power LED chips used in streetlights, direct backlit LCD displays, spotlights, and other applications that require higher brightness are expected to grow at a CAGR...
Genesis Photonics Inc. (GPI), which has been devoted to developing LED epitaxial wafer and chip technology for over 10 years, has made great strides in flip-chip packaging. GPI has...
As high-power LED lighting for commercial purposes is significantly on the rise, demand for COB (chip on board) packaging of high-power LED chips used in lighting will grow fast in...
It is an era dominated by 3C products, and in almost all product categories there are flat panel devices. For such devices, a thin and light design is a common goal, and for mobile...
High-power LED packaging house Lustrous Technology expects shipments to reach one million units in 2011 as shipments are expected to increase significantly in the second half of the...
