Taipei, Friday, October 20, 2017 15:12 (GMT+8)
cloudy
Taipei
24°C
News tagged DDR2
  • Last update: Tuesday 16 April 2013 [143 news items]

DDR3 to account for 8% of Inotera wafer starts by end of year

Newswatch - Aug 7, 16:33

By converting all of its DDR2 capacity to 70nm, Inotera Memories helped its parent company Nanya Technology post the strongest sequential sales growth among its Taiwan rivals in July...

Nvidia to launch Intel-based MCP7A IGP chipset in August

Jul 18, 01:10

Nvidia is planning to start mass producing its latest Intel platform IGP chipset, the GeForce 9-Series mGPU – nForce 730i MCP (MCP7A), in the middle of August with motherboards...

DRAM tester vendors ready for DDR3, but no crossover in sight yet

Jun 10, 16:14

Despite leading memory tester vendors Advantest and Verigy both having rolled out solutions for DDR3 testing, projection of a meaningful crossover between DDR3 and DDR2 has yet to...

143 items [5/5]
Realtime news
  • Taiwan market: Xiaomi launches new flagship smartphone

    Mobile + telecom | 6min ago

  • TSMC raises IC market forecasts for 2017

    Bits + chips | 20min ago

  • China market: Giga Diamond Materials expanding diamond wire capacity

    Green energy | 57min ago

  • ASML 3Q17 sales exceed guidance on extra EUV deliveries

    Bits + chips | 1h 43min ago

  • Epistar files infringement complaint against All Star Lighting Supplies

    LED | 2h 4min ago

  • Prologium partners with Weltmeister to develop LCB-powered cars

    IT + CE | 2h 42min ago

  • Taiwan attracts foreign direct investment of US$5.2 billion in January-September

    IT + CE | 3h 24min ago

  • White-box smartphone players adopting new innovations to enhance competitiveness

    Displays | 3h 50min ago

  • IC makers maximize 300mm, 200mm wafer capacity, says IC Insights

    Bits + chips | 4h 53min ago

  • Taiwan market: Perobot sets up first Pepper Lab

    IT + CE | 5h 3min ago

  • Asustek, Gigabyte reorganization efforts to bear fruit in 1Q18

    IT + CE | Oct 19, 17:43

  • Leadframe maker SDI resumes production at China plant

    Before Going to Press | Oct 19, 22:04

  • Backend houses expect rising memory demand for servers and datacenters

    Before Going to Press | Oct 19, 22:03

  • UREC seeking partnerships with local silicon wafer suppliers

    Before Going to Press | Oct 19, 22:00

  • Taiwan foundries enjoying rising orders from fabless firms

    Before Going to Press | Oct 19, 21:57

  • White-box notebook makers showcasing ultra-thin and 2-in-1 devices in Hong Kong

    Before Going to Press | Oct 19, 21:53

  • Taiwan analog IC firms to enjoy strong 4Q17

    Before Going to Press | Oct 19, 21:52

Pause
 | 
View more
  • Protech+EB%2D821LF+embedded+board

    Protech EB-821LF embedded board

    Protech Systems has unveiled a new 3.5-inch embedded board, EB-821LF. A small form factor measuring 102mm x 145mm, the EB-821LF integrates a full-range of functions for general industrial...

    Photo: Company, Feb 16.

  • Arbor+M1040+medical+tablet+PC

    Arbor M1040 medical tablet PC

    Arbor technology has unveiled its new M1040, a portable medical tablet PC aiming for mobile clinical assistant (MCA) applications. The M1040 is built with an Intel Atom N450 processor...

    Photo: Company, Jan 20.

  • Samsung+4Gb+LPDDR2+DRAM+

    Samsung 4Gb LPDDR2 DRAM

    Samsung Electronics has started sampling what it claims is the industry's first monolithic 4Gb, low-power DDR2 (LPDDR2) DRAM using 30nm-class technology. The chip will be used in...

    Photo: Company, Dec 6.

  • Computex+2010%3A+Winchip+Calligraphy%2Dseries+high%2Dcapacity+memory+kits

    Computex 2010: Winchip Calligraphy-series high-capacity memory kits

    Winchip Technologies has debuted its new DRAM modules, which include high-capacity DDR2 and DDR3 products, low-voltage DDR3 modules and overclocking DDR3 series, at Computex 2010...

    Photo: Company, Jun 4.

  • Kingston+HyperX+blu+memory+modules

    Kingston HyperX blu memory modules

    Kingston Technology has announced the release of an entry-level line of HyperX memory modules for overclockers and gamers. The HyperX blu memory modules have a new look, run at standard...

    Photo: Company, Jun 1.

UMC
Global AP demand forecast, 2017-2020

20-Oct-2017 markets closed

 LastChange

TAIEX (TSE)10728.88-31.41-0.29% 

TSE electronic462.74-2.18-0.47% 

GTSM (OTC)144.77-0.10-0.07% 

OTC electronic217.69+0.04+0.02% 

Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.