Last update: Tuesday 27 March 2012 [61 news items]
Pegatron turns to second-tier brand and local channel vendors for notebook orders
May 4, 12:06
Pegatron Technology has turned its focus from targeting first-tier brand notebook vendors to second-tier and local channel vendors in each region, according to sources at channel...

Atom market on track, says Intel
Apr 30, 19:02
While recent market reports have some makers claiming that demand for the Intel Atom processor is slowing while other players, notably in the China market, are saying that supply...
Ultra-thin notebooks to drive Inventec shipment growth in 2009
Apr 29, 16:13
Taiwan-based Inventec has landed several CULV-based ultra-thin notebooks orders from Acer including 13.3-inch models, which will start shipping in May-June this year, 15.6-inch models,...
More use of HDI for TFT-LCD panels happening in notebooks, say Taiwan makers
Apr 28, 14:57
More notebook makers are starting to adopt high-density interconnect (HDI) boards for the TFT-LCD panels in their notebooks, and the use of HDI boards in notebooks is expected to...
Gigabyte lands netbook motherboard orders from China-based vendor
Apr 27, 11:24
Gigabyte Technology has received orders for netbook-use motherboards from a China-based branded netbook vendor, and the company is approaching other white-box vendors for more orders,...
Demand for Intel Atom processors slowing
Apr 27, 10:28
Demand for Intel's Atom netbook processors has begun to slow down as the netbook market faces price-cut competition from low-end notebooks as well as the launch of CULV-based notebooks,...
AUO expects LED notebook panel penetration to reach 80% in 2Q09
Apr 24, 14:39
AU Optronics (AUO) estimates its LED notebook panel shipment share will increase to 80% of total notebook panel output in the second quarter from 60% in the first quarter, driven...
Asustek choice of 1.3-megapixel CMOS image sensor for CULV notebook questioned by CIS makers
Apr 21, 17:11
Asustek Computer has decided to adopt a 1.3-megapixel CMOS image sensor (CIS) for its consumer ultra-low voltage (CULV) notebook models to be launched in the second half of 2009,...
Tight supply of ultra-thin LCD panels may undermine Acer CULV notebook shipments
Apr 17, 14:22
Tight supply of 16:9 aspect ratio ultra-thin LCD panels could undermine Acer's efforts in trying to unseat rival vendor Hewlett-Packard (HP) from the number one spot in the global...
Compal reportedly to make ultra-thin notebook for Dell, says paper
Newswatch - Apr 15, 16:24
Compal Electronics has landed ultra-thin notebook orders using Intel's CULV CPUs from Dell which are expected to start shipping in August, according to a Chinese-language Commercial...
Intel CULV platform to help push LED-backlit notebook penetration to 70-80% in 2009
Apr 15, 14:25
The launch of CULV (consumer ultra low voltage) ultra-thin notebooks is expected to boost the penetration rate of LED-backlit notebooks to 70-80% at the end of 2009 from 40% in early...
Taiwan notebook maker rankings may shuffle in 2Q09
Apr 14, 14:36
The ranking of Taiwan notebook makers in terms of shipments may see changes in the second quarter, according to market watchers.
Acer expects notebook shipments to grow 25-30% sequentially in 2Q09
Apr 9, 14:52
Acer chairman JT Wang expects notebook shipments in the second quarter to grow 25-30% sequentially thanks to netbooks and the company's new Timeline ultra-thin notebook series.

LCD makers gear up for CULV notebook panel development
Apr 7, 12:16
LCD panel makers are gearing up to develop ultra-thin panels to go alone with Intel's consumer ultra low voltage-based (CULV-based) platform for notebooks, according to market sour...
Apr 6, 11:05
EMS and PCB assembly (PCBA) companies are purchasing testing equipment including AOI and AXI equipment in anticipation of increased demand for notebook-use high-density interconnect...
Notebook PCB ASPs expected to raise on shift to HDI boards
Newswatch - Apr 1, 12:04
Taiwan's PCB makers expect the shift to high-density interconnect (HDI) boards to help raise the ASPs of notebook PCBs, and are looking forward to the upcoming launch of ultra-thin...
Compal eyeing CULV notebook market for 2H09, says paper
Newswatch - Mar 31, 17:10
Compal Electronics president Ray Chen has pointed out that consumer ultra low voltage-based (CULV-based) ultra-thin notebooks will become a major battlefield for Compal in the second...
HP to launch 13.3-inch CULV notebooks in 2Q09, sources say
Mar 31, 14:23
Hewlett-Packard (HP) has plans to introduce several 13.3-inch consumer ultra low voltage-based (CULV-based) notebooks in the second quarter, with Quanta Computer and Compal Electronics...
Notebook vendors expected to push 13.3-inch segment initially for ultra-thin notebooks
Mar 26, 12:19
The 13.3-inch panel segment is expected to become the mainstream size pushed by global notebook vendors for consumer ultra low voltage-based (CULV-based) ultra-thin notebooks, according...
Intel aggressive in promoting CULV CPUs, say notebook makers
Mar 25, 15:53
Intel is aggressively promoting sales of its upcoming consumer ultra low voltage (CULV) platform offering steep discounts to leading notebook vendors, according to notebook makers.
PCB makers gear up for HDI boards used in low-cost notebooks
Mar 25, 14:59
The upcoming launch of Intel's consumer ultra-low voltage (CULV) CPUs, which target ultra-portable notebooks priced between US$699-899, will help significantly increase demand for...
Global notebook players to gain back market share with ultra-thin notebooks
Mar 20, 16:20
The market shares of Taiwan-based notebook vendors Acer, Asustek Computer and Micro-Star International (MSI) are expected to be impacted as first-tier notebook vendors such as Dell...
Asustek evaluating Qualcomm platform Eee PCs
Mar 5, 15:39
Asustek Computer is evaluating the possibility of developing Eee PCs that adopt Qualcomm's platform, however the company currently does not yet have any mass production plans for...
Intel to launch new CPUs for ultra-thin notebooks
Feb 25, 17:12
Intel plans to launch two new ultra low voltage (ULV) CPUs by the end of March this year mainly targeting the company's consumer ultra low voltage (CULV) platform for ultra-thin notebook...
CeBIT 2009: Asustek and MSI to showcase CULV-based ultra-thin notebook
Feb 24, 12:29
Asustek Computer and Micro-Star International (MSI) plan to showcase their Intel consumer ultra low voltage (CULV) platform-based ultra-thin notebooks at CeBIT this year, according...

Intel to target ultra-portable notebook market with CULV platform
Jan 19, 12:26
Intel plans to push a new consumer ultra-low voltage (CULV) platform into the market for ultra-portable notebooks priced between US$699-899 in the second quarter of 2009. The move...
Weltrend expects to turn into profitability in 2Q12
Bits + chips | 38min ago
June TV panel prices to be flat
Displays | 51min ago
LED industry enjoys high capacity utilization rates in 2Q12
LED | 1h 26min ago
Solar wafer firms inclined to follow solar cell firms to increase quotes
Green energy | 1h 44min ago
Silicon Power Computer & Communications to list on OTC
Bits + chips | 1h 54min ago
Eris Technology to list on OTC at the end of June
Bits + chips | 2h 25min ago
Compal lands notebook ODM orders from Samsung
IT + CE | 3h 33min ago
Price key to popularity of Thunderbolt, say Taiwan motherboard makers
Before Going to Press | 1h 52min ago
TPK to see revenue growth in 3Q12
Before Going to Press | 2h 20min ago
China government focuses on illegal imports of waste materials that carry polysilicon
Before Going to Press | 3h 4min ago
Three Taiwan IC distributors deny Samsung plans to withdraw sales agent rights
Before Going to Press | 3h 5min ago
Taiwan market: China-based vendors competing in entry-level to mid-range smartphone segment
Before Going to Press | 3h 30min ago
TSMC sequential growth in 3Q12 revenues may fall to 5% due to declining book/bill ratio
Before Going to Press | 3h 47min ago
- Asustek, Acer to see 10% of notebook shipments in 2012 feature touchscreen panels
- Acer, Asustek to launch netbooks with upgraded Atom processor in 3Q12
- CMI, AUO see decreasing production costs due to declining equipment depreciation costs
- Intel pushes new battery solutions to reduce ultrabook cost
- International smartphones vendors worried about insufficient LTE chip supply
- AMD prepares low-voltage CPUs for Windows 8 tablet PCs
- Some China solar cell makers looking for Taiwan partnerships
- Taiwan solar firms fear turning into OEM firms for China
- Career to ramp up FPCB capacity by 30% in 2H12
- Hermes Microvision lists on OTC market
- GET refutes production suspension of thin-film solar products
- Packaging and testing firms see mobile DRAM orders rise
- Rexchip shares at stake between Micron-Elpida deal, say sources
- Taiwan market: WiMAX operator Global Mobile obtains NT$640 million loan
- Mighty Bright showcasing LED lighting lineup at the National Stationery Show in New York
- Taiwan LED manufacturers to use silicon substrates for producing LED chips
- China TV makers to further expand products abroad
- China market: 6.8 million iPhones shipped in 1Q12, says Digitimes Research
- BOE may roll out AMOLED panels at Ordos line in 2014
- Overall value of lighting market to shrink as LEDs displace conventional technology, says Pike Research
- MediaTek lands 2.5G handset solution orders from Nokia, say sources
- US solar firms may request duties on China-made solar modules
- Taiwan solar cell makers plan to increase quotes due to expected order increases from China
- Taiwan 1Q12 display production value down 7.7%, says IEK
- Korean vendors compete for OLED market
- Digitimes Research: Embedded and standalone integration in NFC IC development
- Digitimes Research: Solar spot prices in Greater China freeze before final verdict of anti-dumping and anti-subsidy investigation
- Digitimes Research: Solar spot prices in Greater China remain flat despite continuous demand from Europe
- Digitimes Research: April 1 solar FIT cuts in Germany to negatively impact solar spot prices
- Releases
- White papers
- Bulletin
- Embracing the New Generation Intel Atom Family with DDR3 Memory Support
- Got The Message? Ensuring efficient and reliable delivery of content across a mission critical digital signage network
- Emb' Store On-Demand Software Service for Embedded Computing
- Efficient Network Management for Digital Signage
- Design Benefits of the MI/O Extension Solution
- Fujitsu converts Fujitsu Toshiba Mobile Communications into a wholly owned subsidiary
- NEC reaks the speed barriers of microwave transmission with ultra high modulations
- ATO Solution to launch 256Mb SLC NAND Flash - for the first time in fabless industry
- LSI completes acquisition of SandForce
- NEC develops super-resolution technologies for fine magnification of surveillance camera images
22-May-2012 markets closed
| Last | Change |
| TAIEX (TSE) | 7274.89 | +82.66 | +1.15% |

| TSE electronic | 277.63 | +3.99 | +1.46% |

| GTSM (OTC) | 104.57 | +2.00 | +1.95% |

| OTC electronic | 134.14 | +2.91 | +2.22% |

- Thousands protest Taiwan leader's inauguration (May 19) - AP (via Google)
- 40% of employees in Asia/Pacific will be mobile workers by 2015, says IDC (May 14) - IDC
- Globalfoundries welcomes President Barack Obama (May 4) - Company release
- India gives 4G to Qualcomm at last (May 8) - Tech Eye.net
- Abu Dhabi fund Mubadala plans US$5.5 billion spending in 2012 (May 9) - Reuters
- French, Greek voters say no to austerity (May 7) - Washington Post
- SK Hynix won't bid for Elpida (May 3) - Wall Street Journal
- Google, authors go head to head over digital books (May 3) - Reuters
- Commentary: A Micron-Elpida merger would improve DRAM industry health
- Simon Sze and his invention of floating-gate NVM
- Commentary: Long-term solar material supply contracts increase losses during industry downturns
- Commentary: Grid parity in India may happen sooner than expected
- Commentary: US protectionism on domestic solar industry may backfire

Keeping industrial interesting: Q&A with analog and mixed signal solution provider Maxim
According to analog and mixed-signal semiconductor maker Maxim Integrated Products, the industrial...

Over the next 30 years, the world's middle class (defined as per capita income of more than US$8,000...

Turning C code into silicon in 8-16 weeks: Q&A with semi startup Algotochip
Silicon Valley startup Algotochip specializes in architecting and implementing all aspects of a complete...

The rise of China Star Optoelectronics Technology: Q&A with CEO He Chengming
The ramping-up of 8.5G production at China-based BOE Technology and China Star Optoelectronics Technology...
- Notebook market overview - Jun 2011
The notebook industry in 2010 experienced several major events that significantly changed the industry's ecosystem for the year and the industry is also believed...
- LCD TV overview - Jun 2011
Growth of the global LCD TV market was not as strong as expected in 2010 as the market continued to feel the aftershocks of the economic recession that had hit...
- Taiwan motherboard industry overview - Jun 2011
The motherboard industry began 2010 with optimism and expected to see a reversal of the previous two years' declines in revenues and shipments as the impact of...
- Taiwan DRAM module industry overview - Jun 2011
The year 2010 represented a peak in recent years for the DRAM module industry. Optimism surfaced in the second half of 2009 thanks to a return of demand on the...
- Taiwan ICT industry development and outlook
A presentation prepared for Taiwan Ministry of Economic Affairs (MOEA), offering an overview of Taiwan's key ICT industries and the dynamics influencing future development. The report is free for download.
- Standards and scale of Asia LED lighting markets
Digitimes Research projects marked growth in LED markets across Asia over the next five years. This Digitimes Research Special Report provides an overview of the standards in the major LED lighting markets in Asia.
- Development of electronics manufacturing bases in China central and western regions
The recently published 12th Five Year Plan clearly states the intention to reform the industrial structure. Central government policy has succeeded in making the central and western regions the most important manufacturing sites for the coming decade.


















