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Thursday 11 June 2009
Display Taiwan 2009: AUO CULV notebook panel capacity reaches 500,000 units in May
The ultra-thin CULV notebook panel capacity of AU Optronics (AUO) is estimated to have reached 500,000 panels in May, according to market sources. AUO is currently showcasing its...
Thursday 11 June 2009
Intel adds dual-core Celeron CPUs into ultra-thin notebook lineup
Intel recently added two dual-core CPUs into its CULV platform targeting entry-level ultra-thin notebooks – the Celeron 740 and SU2300, according to sources at notebook maker...
Tuesday 9 June 2009
Acer to launch 11.6-inch ultra-thin notebook in July
Acer will launch a Timeline series of ultra-thin notebooks with a screen size of 11.6 inches in July, with Quanta Computer to undertake OEM production, according to industry sources...
Thursday 4 June 2009
Computex 2009: Acer unveils ultra-thin business notebook
Acer has unveiled an ultra-thin business notebook, the TravelMate 8371, at the ongoing Computex 2009. The 13.3-inch TravelMate 8371 is built with an Intel Core 2 Duo processor and...
Wednesday 3 June 2009
Computex promises to deliver on the mobile front
While Intel appears to be stepping away from the netbook market for the moment, ARM-based competitors are stepping in.
Tuesday 2 June 2009
Computex 2009: Intel introduces new CPUs, chipset, and wireless technology
Intel has introduced four new processors, including a low-power version, and a value chipset, to usher in mainstream ultra-thin notebooks. Intel CULV processors will enable new consumer...
Tuesday 2 June 2009
Acer leads CULV notebook competitors by 6-9 months, claims chairman
Acer's global notebook market share is expected to grow further since the company is leading its competitors by six to nine months in the CULV notebook market, according to company...
Wednesday 27 May 2009
HP to launch CULV-based notebooks using old chassis designs
Hewlett-Packard (HP) plans to launch CULV-based notebooks using chassis designs from existing notebooks before introducing ultra-thin designs in the fourth quarter, according to sources...
Monday 25 May 2009
APCB supplying small PCBs for CULV notebooks
Advence Printed Circuit Board (APCB) has received small traditional PCB orders for CULV notebooks. APCB began volume shipments in April, with Wistron one of its major customers, said...
Friday 22 May 2009
Ultra-thin notebook proportion to reach 20%, says Acer manager
Acer expects CULV-based ultra-thin notebooks will account for around 20% of its total notebook shipments in the future as consumer reaction toward the product line are mostly positive,...
Tuesday 19 May 2009
China market: Acer to work with China Mobile for 13.3-inch CULV notebook bundles
Acer is reportedly cooperating with China-based telecom provider China Mobile to bundle its 13.3-inch CULV notebooks with mobile telecom subscriptions, according to market sources.
Tuesday 19 May 2009
Notebook component shortage likely to get worse in 2H09, says Inventec
The supply of key notebook components may continue to worsen in the second half of 2009 leading to increasing costs, according to Alexander Hsu, president of Inventec's finance division...
Friday 15 May 2009
MSI unveils ultra-thin notebooks and Wind Top-series all-in-one PCs
Micro-Star International (MSI) has unveiled CULV-based X-Slim series notebooks and 12-inch Wind U series netbooks as well as Wind Top series all-in-one PCs. However, volume shipments...
Friday 15 May 2009
Unimicron tops HDI capacity among Taiwan PCB makers
Tripod Technology and Unimicron Technology took the lead in shipping HDI boards for CULV notebooks in April.
Friday 15 May 2009
Taiwan vendors slow down CULV notebook volume shipment schedules
Taiwan-based notebook vendors including Acer, Asustek Computer and Micro-Star International (MSI), have all slowed down their volume shipment schedules for Intel CULV-based ultra-thin...