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News tagged CULV
  • Last update: Tuesday 27 March 2012 [61 news items]

Pegatron turns to second-tier brand and local channel vendors for notebook orders

May 4, 12:06

Pegatron Technology has turned its focus from targeting first-tier brand notebook vendors to second-tier and local channel vendors in each region, according to sources at channel...

Pegatron showcased several CULV-based ultra-thin notebooks, netbooks and nettops at ISS

Atom market on track, says Intel

Apr 30, 19:02

While recent market reports have some makers claiming that demand for the Intel Atom processor is slowing while other players, notably in the China market, are saying that supply...

Ultra-thin notebooks to drive Inventec shipment growth in 2009

Apr 29, 16:13

Taiwan-based Inventec has landed several CULV-based ultra-thin notebooks orders from Acer including 13.3-inch models, which will start shipping in May-June this year, 15.6-inch models,...

More use of HDI for TFT-LCD panels happening in notebooks, say Taiwan makers

Apr 28, 14:57

More notebook makers are starting to adopt high-density interconnect (HDI) boards for the TFT-LCD panels in their notebooks, and the use of HDI boards in notebooks is expected to...

Gigabyte lands netbook motherboard orders from China-based vendor

Apr 27, 11:24

Gigabyte Technology has received orders for netbook-use motherboards from a China-based branded netbook vendor, and the company is approaching other white-box vendors for more orders,...

Demand for Intel Atom processors slowing

Apr 27, 10:28

Demand for Intel's Atom netbook processors has begun to slow down as the netbook market faces price-cut competition from low-end notebooks as well as the launch of CULV-based notebooks,...

AUO expects LED notebook panel penetration to reach 80% in 2Q09

Apr 24, 14:39

AU Optronics (AUO) estimates its LED notebook panel shipment share will increase to 80% of total notebook panel output in the second quarter from 60% in the first quarter, driven...

Asustek choice of 1.3-megapixel CMOS image sensor for CULV notebook questioned by CIS makers

Apr 21, 17:11

Asustek Computer has decided to adopt a 1.3-megapixel CMOS image sensor (CIS) for its consumer ultra-low voltage (CULV) notebook models to be launched in the second half of 2009,...

Tight supply of ultra-thin LCD panels may undermine Acer CULV notebook shipments

Apr 17, 14:22

Tight supply of 16:9 aspect ratio ultra-thin LCD panels could undermine Acer's efforts in trying to unseat rival vendor Hewlett-Packard (HP) from the number one spot in the global...

Compal reportedly to make ultra-thin notebook for Dell, says paper

Newswatch - Apr 15, 16:24

Compal Electronics has landed ultra-thin notebook orders using Intel's CULV CPUs from Dell which are expected to start shipping in August, according to a Chinese-language Commercial...

Intel CULV platform to help push LED-backlit notebook penetration to 70-80% in 2009

Apr 15, 14:25

The launch of CULV (consumer ultra low voltage) ultra-thin notebooks is expected to boost the penetration rate of LED-backlit notebooks to 70-80% at the end of 2009 from 40% in early...

Taiwan notebook maker rankings may shuffle in 2Q09

Apr 14, 14:36

The ranking of Taiwan notebook makers in terms of shipments may see changes in the second quarter, according to market watchers.

Acer expects notebook shipments to grow 25-30% sequentially in 2Q09

Apr 9, 14:52

Acer chairman JT Wang expects notebook shipments in the second quarter to grow 25-30% sequentially thanks to netbooks and the company's new Timeline ultra-thin notebook series.

JT Wang, chairman of Acer

LCD makers gear up for CULV notebook panel development

Apr 7, 12:16

LCD panel makers are gearing up to develop ultra-thin panels to go alone with Intel's consumer ultra low voltage-based (CULV-based) platform for notebooks, according to market sour...

EMS and PCBA companies expected to increase investment in testing equipment as notebook HDI demand picks up

Apr 6, 11:05

EMS and PCB assembly (PCBA) companies are purchasing testing equipment including AOI and AXI equipment in anticipation of increased demand for notebook-use high-density interconnect...

Notebook PCB ASPs expected to raise on shift to HDI boards

Newswatch - Apr 1, 12:04

Taiwan's PCB makers expect the shift to high-density interconnect (HDI) boards to help raise the ASPs of notebook PCBs, and are looking forward to the upcoming launch of ultra-thin...

Compal eyeing CULV notebook market for 2H09, says paper

Newswatch - Mar 31, 17:10

Compal Electronics president Ray Chen has pointed out that consumer ultra low voltage-based (CULV-based) ultra-thin notebooks will become a major battlefield for Compal in the second...

HP to launch 13.3-inch CULV notebooks in 2Q09, sources say

Mar 31, 14:23

Hewlett-Packard (HP) has plans to introduce several 13.3-inch consumer ultra low voltage-based (CULV-based) notebooks in the second quarter, with Quanta Computer and Compal Electronics...

Notebook vendors expected to push 13.3-inch segment initially for ultra-thin notebooks

Mar 26, 12:19

The 13.3-inch panel segment is expected to become the mainstream size pushed by global notebook vendors for consumer ultra low voltage-based (CULV-based) ultra-thin notebooks, according...

Intel aggressive in promoting CULV CPUs, say notebook makers

Mar 25, 15:53

Intel is aggressively promoting sales of its upcoming consumer ultra low voltage (CULV) platform offering steep discounts to leading notebook vendors, according to notebook makers.

PCB makers gear up for HDI boards used in low-cost notebooks

Mar 25, 14:59

The upcoming launch of Intel's consumer ultra-low voltage (CULV) CPUs, which target ultra-portable notebooks priced between US$699-899, will help significantly increase demand for...

Global notebook players to gain back market share with ultra-thin notebooks

Mar 20, 16:20

The market shares of Taiwan-based notebook vendors Acer, Asustek Computer and Micro-Star International (MSI) are expected to be impacted as first-tier notebook vendors such as Dell...

Asustek evaluating Qualcomm platform Eee PCs

Mar 5, 15:39

Asustek Computer is evaluating the possibility of developing Eee PCs that adopt Qualcomm's platform, however the company currently does not yet have any mass production plans for...

Intel to launch new CPUs for ultra-thin notebooks

Feb 25, 17:12

Intel plans to launch two new ultra low voltage (ULV) CPUs by the end of March this year mainly targeting the company's consumer ultra low voltage (CULV) platform for ultra-thin notebook...

CeBIT 2009: Asustek and MSI to showcase CULV-based ultra-thin notebook

Feb 24, 12:29

Asustek Computer and Micro-Star International (MSI) plan to showcase their Intel consumer ultra low voltage (CULV) platform-based ultra-thin notebooks at CeBIT this year, according...

MSI CULV-based X-Slim notebooks include the X320, X340 and X600

Intel to target ultra-portable notebook market with CULV platform

Jan 19, 12:26

Intel plans to push a new consumer ultra-low voltage (CULV) platform into the market for ultra-portable notebooks priced between US$699-899 in the second quarter of 2009. The move...

61 items [2/2]
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  • A%2DData+4G+DDR2+SO%2DDIMM+makes+its+debut

    A-Data 4G DDR2 SO-DIMM makes its debut

    A-Data Technology has introduced its 4GB DDR2 SO-DIMM DRAM module for CULV-based netbook PCs. The 200-pin DDR2-800 4GB SO-DIMM uses an original DRAM IC coupled with eight-layered...

    Photo: Company, Dec 18.

Analysis of China revised domestic semiconductor industry goals
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2014 global smartphone market forecast