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News tagged copper
  • Last update: Thursday 9 July 2015 [155 news items]

Co-Tech hikes copper foil prices

Dec 14, 16:50

Taiwan-based copper foil maker Co-Tech Copper Foil has decided to raise quotes for its products by US$0.2-0.3/kg in December as compared to the levels in November, according to the...

Copper pillar bump penetration of FC packaging to rise

Nov 29, 12:25

Adoption of copper pillar bump for flip-chip (FC) packaging is expected to increase, with its proportion rising from 10-20% in 2010-2011 to 20-30% in 2015, industry sources quoted...

Focus on small, cost-effective packages: Q&A with STATS ChipPAC CEO Tan Lay Koon

Nov 21, 13:48

Despite uncertainties in the semiconductor industry outlook, packaging and testing firm STATS ChipPAC will continue investing in advanced IC packages for space-critical designs that...

STATS ChipPAC CEO Tan Lay Koon

CCL supplier Doosan ramps China plant

Nov 11, 01:10

Korea-based Doosan, a producer of copper clad laminates (CCL), has begun small-volume production at its new plant in Changshu, China. Monthly capacity at the facility is scheduled...

ShineMore gearing up for niche-market CCLs

Nov 4, 15:25

ShineMore Technology Materials, a maker of copper clad laminates (CCL), has revealed plans to grow the ratio of niche-market products in company revenues to 50% in 2012 from 27% estimated...

Copper foil firms cutting back production

Oct 14, 01:30

Copper foil manufacturers have moved to scale back their output by 30-40% as orders plummet to low levels, according to industry sources. The previous cutback took place in 2008,...

Copper foil makers cut quotes for October; may press down CCL prices

Sep 28, 11:55

In line with declining global copper prices, quotes for copper foils from Taiwan makers will drop by 3% on average sequentially in October, the third month in a row that the makers...

FCCL maker Thinflex looks to improving utilization rates

Sep 9, 14:35

Taiwan-based Thinflex, a supplier of flexible copper clad laminates (FCCLs), expects utilization rates at its plants in China and Taiwan will rebound to 70% in the third quarter of...

Proportion of copper wire bonding to rise to over 20% in 2011, says SEMI

Sep 7, 16:36

Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for...

Packaging and testing growth to slow in 3Q11

Aug 17, 10:53

The global semiconductor packaging and testing industry is likely to see less than 5% growth sequentially in the third quarter of 2011, affected by the transition from gold to copper...

ASE and SPIL look to continued growth in copper wire bonding business in 3Q11

Aug 15, 15:15

IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Silicon Precision Industries (SPIL), both expect their sales generated from copper wire bonding to increase...

Co-Tech to ramp up capacity for flexible PCBs

Aug 12, 13:56

Co-Tech Copper Foil has revealed plans to add an additional capacity of 150 metric tons of copper foil by the end of 2011. The new capacity will be allocated for the production of...

CCL supplier ShineMore applies for OTC listing

Jul 21, 12:05

Copper clad laminate (CCL) maker ShineMore Technology Materials has submitted an application to list on Taiwan's over-the-counter (OTC) market, according to the company. It is currently...

Quotes for copper foils, fiber glass fabrics to stay flat in July

Jul 4, 15:02

Quotes for copper foils and fiber glass fabrics, key raw materials for the production of PCBs, are expected to remain unchanged in July after a slide of 3-5% on average in June although...

PTI developing advanced packaging technologies

Jul 1, 01:10

Packaging and testing firm Powertech Technology (PTI) expects the development of new technologies including wafer-level packaging, 3D IC packaging and copper pillar bumping to bear...

Major Taiwan IC backend firms developing copper pillar bumping

Jun 27, 13:54

Major IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), and memory packaging and testing specialist Powertech Technology (PTI), have...

Copper pillar to be mainstream FC packaging technology in 2012

Jun 3, 15:43

IC packagers Advanced Semiconductor Engineering (ASE), Amkor Technology, Siliconware Precision Industries (SPIL) and STATS ChipPAC have all started developing a new flip-chip (FC)...

PCB material prices fall 3-5% in June

Jun 2, 13:49

Quotes for copper foils and fiber glass fabrics, key raw materials for the production of PCBs, have slid by 3-5% on average in June 2011 amid weakening demand and falling global commodity...

Taiwan makers cut CCL prices along with international copper price drops

May 24, 13:37

Taiwan-based CCL (copper-clad laminate) makers have lowered their quotes by 10% on average recently because of dropping international copper prices and bleak order prospects, according...

STATS ChipPAC reaches milestone of over 300 million copper wirebond units shipped

May 4, 13:45

STATS ChipPAC has shipped over 300 million semiconductor packages with copper wirebond interconnect, according to the company. Its previous milestone with shipments of more than 100...

ASE sees 7-9% growth in 2Q11 shipments; copper wire bonding sales rising

May 2, 14:01

Chip packager Advanced Semiconductor Engineering (ASE) expects shipments to increase 7-9% sequentially in the second quarter of 2011, with a higher gross margin, company CFO Joseph...

Glass fabric price rally to slow in May

Apr 22, 15:51

Prices for fiber glass fabrics in May 2011 will rise at a slower rate compared to 5-10% increases in April as producers of copper clad laminates (CCL) have been reluctant to place...

Glass fabric prices to rise 5-10% in April

Apr 8, 01:30

Prices for fiber glass fabrics, which are used for making copper clad laminates (CCL), are set to increase by 5-10% in April 2011, according to industry sources. Mainstream 7628-size...

SPIL sees boost in copper wirebonding orders, says paper

Newswatch - Mar 4, 15:41

With more fabless IC firms adopting copper wire to package their products for cost reasons, packaging and testing house Siliconware Precision Industries (SPIL) has seen a substantial...

Chipbond, KYEC team up for power IC packaging and testing

Mar 3, 01:05

LCD driver-IC packaging and testing firm Chipbond Technology and King Yuan Electronics (KYEC), which specializes in chip probing and final test services, have signed a memorandum...

Copper foil prices to continue to rally in March, says paper

Newswatch - Feb 22, 14:18

Prices for copper foil, a raw material for making copper clad laminates (CCL), will be adjusted upward again in March, the Chinese-language Commercial Times cited industry...

High copper price damaging profitability of notebook component makers

Feb 15, 01:15

Taiwan-based makers of notebook components such as connector, cable, power supply and cooling modules are seeing their profitability drop as the recent global copper price is hovering...

Rising copper price to trigger competition for securing component supply

Feb 1, 14:47

As London Metal Exchange (LME) spot quotes for copper are expected to steadily climb to a new record level of nearly US$10,000 per metric ton after the Lunar New Year, sources from...

ASE sees flat growth in 1Q11 sales

Jan 31, 16:27

Advanced Semiconductor Engineering (ASE) expects to see revenues generated from its core ATM (assembly test and material) business stay flat sequentially in the first quarter of 2011,...

ASE CFO Joseph Tung

ASE 4Q10 net profits up 44%; full-year profits soar

Jan 28, 17:05

Advanced Semiconductor Engineering (ASE) has announced net profits for the fourth quarter of 2010 climbed 43.8% on year to NT$4.96 billion (US$171 million). Net profits for the whole...

SPIL 4Q10 gross margin up on higher copper wire bonding sales

Jan 27, 01:00

Siliconware Precision Industries (SPIL) saw its gross margin increase to reach 14.3% in the fourth quarter of 2010, up 0.1pp sequentially and beating market estimates. The chip packager...

SPIL chairman Bough Lin

Second-tier IC packagers lower quotes to woo orders from IC designers

Jan 20, 12:07

Second-tier IC packaging and testing companies have lowered their quotes by 5-10% on average recently in order to attract more orders from IC design houses who have been switching...

ASE raises capex for 2011, says paper

Newswatch - Jan 17, 14:24

Advanced Semiconductor Engineering (ASE) has internally raised its capex budget to US$900 million for 2011 from the US$700 million estimated originally, according to a Chinese-language...

Co-Tech posts 16% sequential growth in December revenues

Jan 6, 01:25

Copper foil maker Co-Tech saw December 2010 revenues climb 16% sequentially to NT$470 million (US$16 million), as clients began to build up inventory in anticipation of higher copper...

PCB material prices on the rise

Dec 31, 01:00

Prices for fiber glass yarns and fabrics, key materials for making copper clad laminates (CCL), are set to rise by as much as 15% in January 2011, according to industry sources. The...

155 items [2/5]
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