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News tagged copper
  • Last update: Wednesday 24 April 2013 [136 news items]

STATS ChipPAC reaches milestone of over 300 million copper wirebond units shipped

May 4, 13:45

STATS ChipPAC has shipped over 300 million semiconductor packages with copper wirebond interconnect, according to the company. Its previous milestone with shipments of more than 100...

ASE sees 7-9% growth in 2Q11 shipments; copper wire bonding sales rising

May 2, 14:01

Chip packager Advanced Semiconductor Engineering (ASE) expects shipments to increase 7-9% sequentially in the second quarter of 2011, with a higher gross margin, company CFO Joseph...

Glass fabric price rally to slow in May

Apr 22, 15:51

Prices for fiber glass fabrics in May 2011 will rise at a slower rate compared to 5-10% increases in April as producers of copper clad laminates (CCL) have been reluctant to place...

Glass fabric prices to rise 5-10% in April

Apr 8, 01:30

Prices for fiber glass fabrics, which are used for making copper clad laminates (CCL), are set to increase by 5-10% in April 2011, according to industry sources. Mainstream 7628-size...

SPIL sees boost in copper wirebonding orders, says paper

Newswatch - Mar 4, 15:41

With more fabless IC firms adopting copper wire to package their products for cost reasons, packaging and testing house Siliconware Precision Industries (SPIL) has seen a substantial...

Chipbond, KYEC team up for power IC packaging and testing

Mar 3, 01:05

LCD driver-IC packaging and testing firm Chipbond Technology and King Yuan Electronics (KYEC), which specializes in chip probing and final test services, have signed a memorandum...

Copper foil prices to continue to rally in March, says paper

Newswatch - Feb 22, 14:18

Prices for copper foil, a raw material for making copper clad laminates (CCL), will be adjusted upward again in March, the Chinese-language Commercial Times cited industry...

High copper price damaging profitability of notebook component makers

Feb 15, 01:15

Taiwan-based makers of notebook components such as connector, cable, power supply and cooling modules are seeing their profitability drop as the recent global copper price is hovering...

Rising copper price to trigger competition for securing component supply

Feb 1, 14:47

As London Metal Exchange (LME) spot quotes for copper are expected to steadily climb to a new record level of nearly US$10,000 per metric ton after the Lunar New Year, sources from...

ASE sees flat growth in 1Q11 sales

Jan 31, 16:27

Advanced Semiconductor Engineering (ASE) expects to see revenues generated from its core ATM (assembly test and material) business stay flat sequentially in the first quarter of 2011,...

ASE CFO Joseph Tung

ASE 4Q10 net profits up 44%; full-year profits soar

Jan 28, 17:05

Advanced Semiconductor Engineering (ASE) has announced net profits for the fourth quarter of 2010 climbed 43.8% on year to NT$4.96 billion (US$171 million). Net profits for the whole...

SPIL 4Q10 gross margin up on higher copper wire bonding sales

Jan 27, 01:00

Siliconware Precision Industries (SPIL) saw its gross margin increase to reach 14.3% in the fourth quarter of 2010, up 0.1pp sequentially and beating market estimates. The chip packager...

SPIL chairman Bough Lin

Second-tier IC packagers lower quotes to woo orders from IC designers

Jan 20, 12:07

Second-tier IC packaging and testing companies have lowered their quotes by 5-10% on average recently in order to attract more orders from IC design houses who have been switching...

ASE raises capex for 2011, says paper

Newswatch - Jan 17, 14:24

Advanced Semiconductor Engineering (ASE) has internally raised its capex budget to US$900 million for 2011 from the US$700 million estimated originally, according to a Chinese-language...

Co-Tech posts 16% sequential growth in December revenues

Jan 6, 01:25

Copper foil maker Co-Tech saw December 2010 revenues climb 16% sequentially to NT$470 million (US$16 million), as clients began to build up inventory in anticipation of higher copper...

PCB material prices on the rise

Dec 31, 01:00

Prices for fiber glass yarns and fabrics, key materials for making copper clad laminates (CCL), are set to rise by as much as 15% in January 2011, according to industry sources. The...

Copper foil prices set to continue rising

Dec 29, 01:40

Prices for copper foil, the raw material of copper clad laminates (CCL), will go up by 5-7% in January 2011, according to industry sources. Prices already grew 5% in December.

Co-Tech lowers copper foil quotes by 5% in December 2010

Dec 22, 01:20

With copper prices continuing to trend up, copper foil quotes have increased 5% in December 2010, according to copper foil maker Co-Tech. Copper foil quotes from November 21 to December...

STATS ChipPAC, Intersil qualify copper wire interconnect for analog and mixed-signal devices

Dec 16, 01:00

STATS ChipPAC and Intersil have qualified the use of copper wire interconnect solutions on a number of high-end analog and mixed-signal devices which are in volume production, STATS...

Copper foil prices up another 5%

Dec 10, 01:00

Quotes for copper foil have risen for the fourth consecutive month, up by 5% in December 2010 compared with November, according to industry sources. The upward trend reflects strengthening...

Gold price increase spurs adoption of copper-wire bonding

Dec 8, 01:50

With gold futures climbing to an historical high and copper prices relatively stable, IC packaging houses could see their gross margins eroded. The price difference between gold-wire...

ASE grabs copper wirebonding orders from second-tier players

Nov 24, 01:10

With Silicon Precision Industries (SPIL) quickly catching up with Advanced Semiconductor Engineering (ASE) in copper wirebonding, ASE is currently attempting to win orders over second-tier...

CCL makers post mixed results for October

Nov 9, 10:50

CCL (copper clad laminate) maker Iteq has registered NT$1.67 billion (US$55.3 million) in October consolidated revenues, up 1.8% from September. Fellow company Elite Materials (EMC)...

Co-Tech October revenues down 11.5% on-month

Nov 5, 01:45

Copper foil maker Co-Tech has posted revenues of NT$478 million (US$15.8 million) for October 2010, down 11.5% sequentially. But revenues were up 30% from a year ago.

Prices for copper foil up 5% in November

Nov 4, 01:15

Prices for copper foil, a raw material for making copper clad laminates (CCL), have hiked 5% in November 2010 to reflect rising copper costs, according to industry sources. Meanwhile,...

ASE plans for 2011 capex of US$700-800 million

Newswatch - Nov 1, 16:43

Advanced Semiconductor Engineering (ASE) plans to budget US$700-800 million for 2011, similar to its 2010 budget according to the company. The packaging and testing firm also said...

CCL maker Iteq reports self-evaluated 3Q10 results

Oct 20, 01:10

Copper clad laminate (CCL) maker Iteq has reported third-quarter revenues of NT$5.36 billion (US$173.69 billion), down 5% sequentially. Pre-tax profit fell to NT$497 million or NT$5.75...

Co-Tech expecting copper foil shipments decline in 4Q10

Oct 18, 14:53

Co-Tech Copper Foil expects its revenues to be lower than expected in the fourth quarter of 2010 due to a decline in shipments of its copper foils in October and unclear order visibility...

Taiwan component makers under pressure of increased costs due to rising copper prices

Oct 13, 16:00

As London Metal Exchange (LME) quotes for copper have risen to US$8,290/ton, the highest since July 2008, plus labor costs in China are rising, Taiwan-based makers of electronic connectors...

CCL makers 4Q10 profit to fall due to copper foil price hike and weak high-season demand

Oct 13, 01:15

Copper clad laminate (CCL) makers could see fourth-quarter 2010 profits contract due to an increase in copper foil quotes, which rose 3-5% in September and another 5% in October....

ASE and SPIL likely to see 1Q11 profits halve, says paper

Newswatch - Oct 12, 14:29

Major chip packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are likely to see their profits for the first quarter of 2011 halve from...

IC back-end firms 4Q10 gross margins likely hurt by strong NT dollar, rising material costs

Oct 5, 14:08

Soaring gold and copper prices, as well as losses resulting from the appreciation of the NT dollar, are likely to affect packaging and testing firms' gross margins in the fourth quarter...

ASE to budget US$700 million in capex for 2011, says paper

Newswatch - Oct 4, 17:00

IC packaging and testing house Advanced Semiconductor Engineering (ASE) plans to budget US$700 million in capex for 2011, flat on year, an unnamed company executive has been cited...

Copper foil supply may fall short of demand in the next two years, says Co-Tech president

Sep 28, 01:40

Supply of copper foils will likely fall short of demand in 2011 and 2012, being constrained by major makers' relatively conservative expansion plans, according to Tony Ke, president...

Co-Tech ramping up production of thin copper foils

Sep 24, 12:07

Taiwan-based Co-Tech Copper Foil expects its production of thin copper foils of below 0.5 oz will account for 62% of its total output in October 2010 compared to 57-58% currently.

Co-Tech Copper chairman Chen Chung Hsing
136 items [2/4]
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    Photo: Company, Sep 1.

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    Photo: Company, Apr 12.

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    Photo: Company, Dec 4.

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GKB Security Corporation
Trends and forecast for 2013 touch panel market

22-May-2013 11:45 (GMT+8)

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