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Monday 7 June 2021
Taiwan backend houses caught in cluster COVID infections
Taiwan's major dedicated IC testing house King Yuan Electronics (KYEC) has been ordered by the Central Epidemic Command Center (CECC) to have all its migrant workers undergo a 14-day...
Monday 24 May 2021
OSATs may further hike service quotes in 3Q21
Taiwan OASTs are expected to enforce a new round of quote hikes in the third quarter of the year to reflect ever-rising prices for raw materials particularly for QFN wire-bonding...
Wednesday 19 May 2021
Greatek building new backend processing plants
Logic IC backend specialist Greatek Electronics is constructing two new factories, which are set to be completed for commercial runs in 2022, but the company has already seen clients...
Friday 14 May 2021
TSMC, high-tech firms unscathed by massive outage in Taiwan
TSMC and other major high-tech firms in Taiwan have reported little impact from a five-hour rolling power blackout that affected many parts of the country on May 13.
Thursday 13 May 2021
DDI packaging materials demand stays robust
Demand for packaging materials for processing high-end display driver ICs (DDI) remains strong, as backend houses including Chipbond Technology and ChipMOS Technologies still maintain...
Wednesday 12 May 2021
Taiwan OSATs see order preparation times extended
Major Taiwan-based OSATs including ASE Technology, Powertech Technology (PTI), Chipbond Technology and ChipMOS Technologies have seen their order preparation times extended to three...
Wednesday 5 May 2021
Driver IC backend capacity utilization unstable
Display driver IC (DDI) backend specialists Chipbond Technology and ChipMOS Technologies have seen unstable capacity utilization for processing small- to medium-size applications...
Tuesday 4 May 2021
OSATs face increasingly tight supply of packaging materials
OSATs have been notified by their Japan-based packaging materials suppliers including Showa Denko about a potential supply shortfall of as much as 50% between May and June, according...
Thursday 22 April 2021
ChipMOS to expand backend capacity for memory chips
Backend house ChipMOS Technologies will expand production capacity for memory chips by 30-40% in 2021 to meet strong demand from major memory module makers in Taiwan, according to...
Monday 12 April 2021
Backend demand stays strong for MOSFETs, niche DRAMs
Persistently strong demand for MOSFET chips and niche-type DRAM have kept backend specialists including Walton Advanced Engineering, ChipMos Technologies and GEM Services running...
Monday 22 March 2021
IC materials distributors buoyed by strong e-paper DDI demand
Semiconductor materials distributors are expected to gain profit momentum from brisk sales of COG or COF packaging materials driven by robust demand for e-paper and ESL (electronic...
Wednesday 17 March 2021
ChipMOS expects double-digit sales growth in 2021
Taiwan's display driver IC (DDI) backend specialist ChipMOS Technologies expects to post a double-digit revenue growth in 2021 with better profits than 2020, driven by robust DDI...
Friday 12 March 2021
DRAM probe card demand ramping up
Major memory probe card vendors in the US and Japan have seen a surge in demand from DRAM suppliers, with delivery lead times for their orders already extended to around 20 weeks...
Wednesday 10 March 2021
Packaging materials vendors gaining from strong DDI demand
Packaging materials suppliers have seen a surge in orders from display driver IC (DDI) backend specialists, and are poised to enjoy strong DDI demand throughout 2021, according to...
Wednesday 3 March 2021
BGA packaging for memory controller ICs hits snag on ABF substrate shortages
Backend demand for memory controller ICs has been increasingly strong promising clear order visibility for BGA and FC-BGA packaging processes at OSAT firms, but their operations are...
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