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News tagged ChipMOS
  • Last update: Wednesday 23 September 2015 [107 news items]

ChipMOS reports 1Q10 revenues up on quarter, meets guidance

Apr 23, 16:00

Packaging and testing service provider ChipMOS Technologies has announced consolidated revenues for the first quarter of 2010 grew 2.3% sequentially to NT$3.67 billion (US$115.7 million),...

Prices for LCD driver IC backend services to rise in 2Q10

Apr 2, 15:56

LCD driver IC packaging and testing house Chipbond Technology is integrating the different quotes offered by it and International Semiconductor Technology (IST) before their merger,...

ChipMOS expects strong 1Q10

Mar 19, 16:19

ChipMOS Technologies expects its revenues for the first quarter of 2010 to stay flat or increase by a single-digit percentage from the fourth quarter of 2009 thanks to increasing...

TSMC, UMC wafer production in southern Taiwan affected by quake

Mar 5, 10:21

Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) have both disclosed the impact of a 6.4-magnitude earthquake that hit southern Taiwan...

SPIL to drop out from LCD driver IC, DRAM segments; sell related equipment to ChipMOS

Mar 1, 11:39

Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...

ChipMOS likely to turn profitable in 1Q10

Feb 23, 11:54

The sale of ChipMOS Technologies' accounts receivable from Spansion may allow the packaging and testing house to return to profits in the first quarter of 2010, according to industry...

ChipMOS to sell Spansion debts to Citigroup

Jan 15, 15:35

ChipMOS Technologies has announced it reached a definitive agreement with Citigroup, under which the memory packaging and testing company will sell the debts it holds in Spansion...

IC packaging and testing companies feeling relief after Tessera lost in lawsuit against DRAM makers

Dec 31, 15:58

Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...

ChipMOS loses DRAM packaging patent lawsuit against Walton

Dec 24, 10:20

Memory packaging and testing house Walton Advanced Engineering has prevailed in a lawsuit in Taiwan brought by rival ChipMOS Technologies pertaining to packaging technology used for...

ChipMOS expects 4Q09 revenues to stay flat or drop slightly on quarter

Nov 12, 12:17

Packaging and testing house ChipMOS Technologies has said revenues for the fourth quarter of 2009 may remain flat or drop by single-digits compared to the third quarter. Demand for...

ChipMOS 3Q09 revenues meet guidance despite 23% drop on year

Oct 19, 14:21

Packaging and testing house ChipMOS Technologies saw consolidated revenues grow 14.1% sequentially to NT$3.35 billion (US$104.5 million) in the third quarter of 2009, and met the...

ChipMOS raises 3Q09 revenue estimates

Oct 5, 15:25

Packaging and testing house ChipMOS Technologies has announced it now expects revenues for the third quarter of 2009 to grow 13-15% sequentially, compared to its previous estimate...

PTI buys Spansion facility in China

Aug 24, 12:15

Memory packaging and testing service provider Powertech Technology (PTI) has announced it has acquired Spansion (Suzhou), the US-based NOR flash maker's packaging and testing facility...

ChipMOS sees improved 2Q09 on sales from LCD business

Aug 21, 15:19

ChipMOS Technologies has announced its net loss on a US GAAP basis narrowed to NT$1.21 billion (US$36.9 million) in the second quarter of 2009, compared to a loss of NT$1.98 billion...

China IC firms more eager to develop patent portfolios, says CSIA

Jul 22, 17:01

China-based Semiconductor Manufacturing International Corporation (SMIC) became the top recipient of wafer foundry patents approved by the China authorities in 2008, whereas Taiwan...

ChipMOS expects margins to turn positive by 4Q09

May 15, 15:28

Taiwan's ChipMOS Technologies, which saw its fourth straight quarterly loss in the first quarter of 2009, has said it expects gross margins to return to positive levels by the fourth...

ChipMOS shipping more Spansion products since March

Mar 26, 12:37

Memory packaging and testing house ChipMOS Technologies has seen a rebound in orders from the LCD, NOR flash and mask ROM sectors since March, and shipments to insolvent flash maker...

ChipMOS diversifying customer base to minimize impact from Spansion insolvency

Mar 20, 12:22

Taiwan's ChipMOS Technologies is looking to diversify its memory customer base, while having lowered its dependence on Spansion significantly, according to company sources. The IC...

Tessera terminates patent lawsuit against packaging and testing firms

Mar 18, 10:37

Tessera Technologies has withdrawn a patent infringement lawsuit against Taiwan- and Singapore-based IC packaging and testing service providers, with industry soruces saying that...

KYEC and PTI claim no affect from Spansion bankruptcy filing

Mar 3, 15:24

Taiwan's memory packaging and testing houses King Yuan Electronics Company (KYEC) and Powertech Technology Incorporated (PTI) have filed statements via the Taiwan Stock Exchange (TSE)...

ChipMOS terminates service agreement with Spansion

Feb 25, 10:35

ChipMOS Technologies (Bermuda) has announced that on February 19, 2009 its wholly-owned packaging and testing service supplier ChipMOS Taiwan terminated a service agreement with Spansion...

Driver IC backend utilization rate at 20-30%

Feb 20, 12:07

Driver IC packaging and testing companies Chipbond Technology, ChipMOS Technologies and King Yuan Electronics Company (KYEC) recently have been able to receive mostly rush or short-term...

ChipMOS gives Spansion 30 days to settle overdue payments

Jan 22, 01:05

ChipMOS has sent a notice to Spansion giving the NOR flash maker 30 days to pay off a recent order, or else it will take further action, according to ChipMOS.

ProMOS continues to sell assets

Jan 20, 16:46

Packaging and testing house Powertech Technology (PTI) has announced via a filing with the Taiwan Stock Exchange (TSE) that it has acquired wafer testing equipment worth approximately...

DRAM production cutbacks lead to lower utilization at packaging and testing firms in early 2009

Jan 7, 17:08

Memory IC packaging and testing houses ChipMOS Technologies, Formosa Advanced Technologies Company (FATC), Power ASE Technology and United Test and Assembly Center (UTAC) are said...

ProMOS to sell 12-inch equipment; phasing out 8-inch production

Dec 10, 01:20

ProMOS Technologies plans to sell part of the machinery equipment located at its 12-inch fabs. The company also announced plans to gradually phase out of commodity DRAM production...

ProMOS chairman ML Chen

Packaging and testing houses see weaker NOR flash sales in 4Q

Newswatch - Dec 8, 16:16

Memory packaging and testing houses ChipMOS Technologies and King Yuan Electronics Company (KYEC) have estimated that sales contributions from NOR flash will slide sequentially in...

Micron likely to increase orders for ChipMOS, SPIL and FATC

Nov 28, 15:30

ChipMOS Technologies, Siliconware Precision Industries (SPIL) and Formosa Advanced Technologies Company (FATC) are expected to benefit from Micron Technology after it completes the...

ChipMOS gross margins fall to zero in 3Q, will be negative in 4Q

Nov 12, 12:26

ChipMOS Technologies has reported third quarter revenues of NT$4.36 billion (US$135.3 million), a decrease of 9.5% from NT$4.82 billion (US$149.5 million) in the second quarter of...

Driver IC packaging and testing houses to see utilization drop to 55-66% in 4Q08

Nov 5, 01:00

Driver IC packaging and testing houses Chipbond Technology, International Semiconductor Technology (IST), and ChipMOS Technologies will see their utilization rates drop to 55-60%...

ChipMOS-Spansion relationship to remain unchanged, says paper

Newswatch - Oct 17, 16:05

ChipMOS Technologies has said that its relations with Spansion will remain unchanged despite the announced signing of an MOU between Advanced Semiconductor Engineering (ASE) and Spansion...

ChipMOS September sales down more than 13%

Oct 17, 12:39

ChipMOS Technologies has reported consolidated revenues of NT$1.3 billion (US$40.3 million) for the month of September, a decrease of 13.6% from August 2008 and a decrease of 36.3%...

Taiwan memory IC packaging and testing firms to benefit from Micron-Qimonda deal

Oct 14, 14:59

Taiwan-based memory IC packaging and testing companies are likely to benefit from the Micron-Qimonda deal, according...

ChipMOS cuts 3Q08 guidance due to sluggish DRAM and driver IC businesses

Sep 29, 12:01

Packaging and testing company ChipMOS Technologies has announced a downward adjustment in its third-quarter guidance to reflect the reduction in DRAM production and inventory adjustment...

Micron said to be upping its packaging orders to Taiwan

Aug 26, 01:30

With Micron Technology having reporting losses for five consecutive quarters, the memory maker is expected to outsources more NAND flash packaging orders. Currently, Micron still...

107 items [3/4]
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