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News tagged ChipMOS
  • Last update: Friday 28 March 2014 [90 news items]

ChipMOS diversifying customer base to minimize impact from Spansion insolvency

Mar 20, 12:22

Taiwan's ChipMOS Technologies is looking to diversify its memory customer base, while having lowered its dependence on Spansion significantly, according to company sources. The IC...

Tessera terminates patent lawsuit against packaging and testing firms

Mar 18, 10:37

Tessera Technologies has withdrawn a patent infringement lawsuit against Taiwan- and Singapore-based IC packaging and testing service providers, with industry soruces saying that...

KYEC and PTI claim no affect from Spansion bankruptcy filing

Mar 3, 15:24

Taiwan's memory packaging and testing houses King Yuan Electronics Company (KYEC) and Powertech Technology Incorporated (PTI) have filed statements via the Taiwan Stock Exchange (TSE)...

ChipMOS terminates service agreement with Spansion

Feb 25, 10:35

ChipMOS Technologies (Bermuda) has announced that on February 19, 2009 its wholly-owned packaging and testing service supplier ChipMOS Taiwan terminated a service agreement with Spansion...

Driver IC backend utilization rate at 20-30%

Feb 20, 12:07

Driver IC packaging and testing companies Chipbond Technology, ChipMOS Technologies and King Yuan Electronics Company (KYEC) recently have been able to receive mostly rush or short-term...

ChipMOS gives Spansion 30 days to settle overdue payments

Jan 22, 01:05

ChipMOS has sent a notice to Spansion giving the NOR flash maker 30 days to pay off a recent order, or else it will take further action, according to ChipMOS.

ProMOS continues to sell assets

Jan 20, 16:46

Packaging and testing house Powertech Technology (PTI) has announced via a filing with the Taiwan Stock Exchange (TSE) that it has acquired wafer testing equipment worth approximately...

DRAM production cutbacks lead to lower utilization at packaging and testing firms in early 2009

Jan 7, 17:08

Memory IC packaging and testing houses ChipMOS Technologies, Formosa Advanced Technologies Company (FATC), Power ASE Technology and United Test and Assembly Center (UTAC) are said...

ProMOS to sell 12-inch equipment; phasing out 8-inch production

Dec 10, 01:20

ProMOS Technologies plans to sell part of the machinery equipment located at its 12-inch fabs. The company also announced plans to gradually phase out of commodity DRAM production...

ProMOS chairman ML Chen

Packaging and testing houses see weaker NOR flash sales in 4Q

Newswatch - Dec 8, 16:16

Memory packaging and testing houses ChipMOS Technologies and King Yuan Electronics Company (KYEC) have estimated that sales contributions from NOR flash will slide sequentially in...

Micron likely to increase orders for ChipMOS, SPIL and FATC

Nov 28, 15:30

ChipMOS Technologies, Siliconware Precision Industries (SPIL) and Formosa Advanced Technologies Company (FATC) are expected to benefit from Micron Technology after it completes the...

ChipMOS gross margins fall to zero in 3Q, will be negative in 4Q

Nov 12, 12:26

ChipMOS Technologies has reported third quarter revenues of NT$4.36 billion (US$135.3 million), a decrease of 9.5% from NT$4.82 billion (US$149.5 million) in the second quarter of...

Driver IC packaging and testing houses to see utilization drop to 55-66% in 4Q08

Nov 5, 01:00

Driver IC packaging and testing houses Chipbond Technology, International Semiconductor Technology (IST), and ChipMOS Technologies will see their utilization rates drop to 55-60%...

ChipMOS-Spansion relationship to remain unchanged, says paper

Newswatch - Oct 17, 16:05

ChipMOS Technologies has said that its relations with Spansion will remain unchanged despite the announced signing of an MOU between Advanced Semiconductor Engineering (ASE) and Spansion...

ChipMOS September sales down more than 13%

Oct 17, 12:39

ChipMOS Technologies has reported consolidated revenues of NT$1.3 billion (US$40.3 million) for the month of September, a decrease of 13.6% from August 2008 and a decrease of 36.3%...

Taiwan memory IC packaging and testing firms to benefit from Micron-Qimonda deal

Oct 14, 14:59

Taiwan-based memory IC packaging and testing companies are likely to benefit from the Micron-Qimonda deal, according...

ChipMOS cuts 3Q08 guidance due to sluggish DRAM and driver IC businesses

Sep 29, 12:01

Packaging and testing company ChipMOS Technologies has announced a downward adjustment in its third-quarter guidance to reflect the reduction in DRAM production and inventory adjustment...

Micron said to be upping its packaging orders to Taiwan

Aug 26, 01:30

With Micron Technology having reporting losses for five consecutive quarters, the memory maker is expected to outsources more NAND flash packaging orders. Currently, Micron still...

ChipMOS says DRAM visibility to remain hazy in 2H08

Aug 22, 16:45

Having already seen its second-quarter profit dropped due to lower utilization rate for DRAM final testing and price erosion in DRAM, ChipMOS Technologies said visibility for DRAM...

Weakening LCD panel industry spreads to backend

Aug 11, 12:14

As most upstream LCD panel and LCD driver IC vendors are guiding for a conservative second half of 2008, major LCD driver IC packaging and testing houses' expect to feel the effect...

90 items [3/3]
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