ChipMOS reports growth in 1Q11 revenues

Apr 19, 16:52

IC packaging and testing firm ChipMOS Technologies (Bermuda) has reported NT$1.57 billion (US$53.3 million) in March 2011 revenues, up 15.7% sequentially and 20.9% on year. Revenues...

ChipMOS to sell idle, non-core assets for US$11.6 million

Feb 24, 16:32

Packaging and testing house ChipMOS Technologies (Bermuda) has announced that subsidiary ChipMOS Taiwan will receive approximately US$11.6 million in the sale of its idle, non-core...

ChipMOS posts profitable 3Q10

Nov 17, 01:30

IC packaging house ChipMOS Technologies has reported NT$4.717 billion (US$155.908 million) in revenues for the third quarter of 2010, up 4.9% sequentially on sales of Mask ROM and...

Taiwan-based LCD driver IC designers to adopt 12-inch processes soon

Nov 12, 01:25

LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...

ChipMOS to expand into 12-inch gold bumping

Oct 5, 14:14

Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...

ChipMOS to collect another US$68 million through selling Spansion debt

Oct 5, 01:55

ChipMOS Technologies has revealed it will receive a total of US$68 million in cash this week, through selling its unproductive accounts receivable from Spansion to Citigroup. The...

ChipMOS posts profits in two consecutive quarters

Aug 20, 14:12

ChipMOS Technologies has reported net profits of NT$207.5 million (US$6.5 million) for the second quarter of 2010, the second straight quarter in which the company gained profits...

ChipMOS swings to profits in 1Q10; expects on-quarter revenue growth in 2Q

May 19, 16:43

ChipMOS Technologies has reported consolidated net profits of NT$271.2 million (US$8.6 million) on a US GAAP basis for the first quarter of 2010, following net losses over the past...

ChipMOS reports 1Q10 revenues up on quarter, meets guidance

Apr 23, 16:00

Packaging and testing service provider ChipMOS Technologies has announced consolidated revenues for the first quarter of 2010 grew 2.3% sequentially to NT$3.67 billion (US$115.7 million),...

Prices for LCD driver IC backend services to rise in 2Q10

Apr 2, 15:56

LCD driver IC packaging and testing house Chipbond Technology is integrating the different quotes offered by it and International Semiconductor Technology (IST) before their merger,...

ChipMOS expects strong 1Q10

Mar 19, 16:19

ChipMOS Technologies expects its revenues for the first quarter of 2010 to stay flat or increase by a single-digit percentage from the fourth quarter of 2009 thanks to increasing...

TSMC, UMC wafer production in southern Taiwan affected by quake

Mar 5, 10:21

Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) have both disclosed the impact of a 6.4-magnitude earthquake that hit southern Taiwan...

SPIL to drop out from LCD driver IC, DRAM segments; sell related equipment to ChipMOS

Mar 1, 11:39

Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...

ChipMOS likely to turn profitable in 1Q10

Feb 23, 11:54

The sale of ChipMOS Technologies' accounts receivable from Spansion may allow the packaging and testing house to return to profits in the first quarter of 2010, according to industry...

ChipMOS to sell Spansion debts to Citigroup

Jan 15, 15:35

ChipMOS Technologies has announced it reached a definitive agreement with Citigroup, under which the memory packaging and testing company will sell the debts it holds in Spansion...

IC packaging and testing companies feeling relief after Tessera lost in lawsuit against DRAM makers

Dec 31, 15:58

Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...

ChipMOS loses DRAM packaging patent lawsuit against Walton

Dec 24, 10:20

Memory packaging and testing house Walton Advanced Engineering has prevailed in a lawsuit in Taiwan brought by rival ChipMOS Technologies pertaining to packaging technology used for...

ChipMOS expects 4Q09 revenues to stay flat or drop slightly on quarter

Nov 12, 12:17

Packaging and testing house ChipMOS Technologies has said revenues for the fourth quarter of 2009 may remain flat or drop by single-digits compared to the third quarter. Demand for...

ChipMOS 3Q09 revenues meet guidance despite 23% drop on year

Oct 19, 14:21

Packaging and testing house ChipMOS Technologies saw consolidated revenues grow 14.1% sequentially to NT$3.35 billion (US$104.5 million) in the third quarter of 2009, and met the...

ChipMOS raises 3Q09 revenue estimates

Oct 5, 15:25

Packaging and testing house ChipMOS Technologies has announced it now expects revenues for the third quarter of 2009 to grow 13-15% sequentially, compared to its previous estimate...

PTI buys Spansion facility in China

Aug 24, 12:15

Memory packaging and testing service provider Powertech Technology (PTI) has announced it has acquired Spansion (Suzhou), the US-based NOR flash maker's packaging and testing facility...

ChipMOS sees improved 2Q09 on sales from LCD business

Aug 21, 15:19

ChipMOS Technologies has announced its net loss on a US GAAP basis narrowed to NT$1.21 billion (US$36.9 million) in the second quarter of 2009, compared to a loss of NT$1.98 billion...

China IC firms more eager to develop patent portfolios, says CSIA

Jul 22, 17:01

China-based Semiconductor Manufacturing International Corporation (SMIC) became the top recipient of wafer foundry patents approved by the China authorities in 2008, whereas Taiwan...

ChipMOS expects margins to turn positive by 4Q09

May 15, 15:28

Taiwan's ChipMOS Technologies, which saw its fourth straight quarterly loss in the first quarter of 2009, has said it expects gross margins to return to positive levels by the fourth...

ChipMOS shipping more Spansion products since March

Mar 26, 12:37

Memory packaging and testing house ChipMOS Technologies has seen a rebound in orders from the LCD, NOR flash and mask ROM sectors since March, and shipments to insolvent flash maker...

ChipMOS diversifying customer base to minimize impact from Spansion insolvency

Mar 20, 12:22

Taiwan's ChipMOS Technologies is looking to diversify its memory customer base, while having lowered its dependence on Spansion significantly, according to company sources. The IC...

Tessera terminates patent lawsuit against packaging and testing firms

Mar 18, 10:37

Tessera Technologies has withdrawn a patent infringement lawsuit against Taiwan- and Singapore-based IC packaging and testing service providers, with industry soruces saying that...

KYEC and PTI claim no affect from Spansion bankruptcy filing

Mar 3, 15:24

Taiwan's memory packaging and testing houses King Yuan Electronics Company (KYEC) and Powertech Technology Incorporated (PTI) have filed statements via the Taiwan Stock Exchange (TSE)...

ChipMOS terminates service agreement with Spansion

Feb 25, 10:35

ChipMOS Technologies (Bermuda) has announced that on February 19, 2009 its wholly-owned packaging and testing service supplier ChipMOS Taiwan terminated a service agreement with Spansion...

Driver IC backend utilization rate at 20-30%

Feb 20, 12:07

Driver IC packaging and testing companies Chipbond Technology, ChipMOS Technologies and King Yuan Electronics Company (KYEC) recently have been able to receive mostly rush or short-term...

ChipMOS gives Spansion 30 days to settle overdue payments

Jan 22, 01:05

ChipMOS has sent a notice to Spansion giving the NOR flash maker 30 days to pay off a recent order, or else it will take further action, according to ChipMOS.

ProMOS continues to sell assets

Jan 20, 16:46

Packaging and testing house Powertech Technology (PTI) has announced via a filing with the Taiwan Stock Exchange (TSE) that it has acquired wafer testing equipment worth approximately...

DRAM production cutbacks lead to lower utilization at packaging and testing firms in early 2009

Jan 7, 17:08

Memory IC packaging and testing houses ChipMOS Technologies, Formosa Advanced Technologies Company (FATC), Power ASE Technology and United Test and Assembly Center (UTAC) are said...

Packaging and testing houses see weaker NOR flash sales in 4Q

Newswatch - Dec 8, 16:16

Memory packaging and testing houses ChipMOS Technologies and King Yuan Electronics Company (KYEC) have estimated that sales contributions from NOR flash will slide sequentially in...