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News tagged ChipMOS
  • Last update: Tuesday 26 April 2016 [119 news items]

Transformation: Q&A with ChipMOS chairman and CEO SJ Cheng

Nov 20, 15:54

ChipMOS Technologies is among very few firms that have transformed themselves successfully and are no longer influenced by the volatile memory market. Once known as a packaging and...

ChipMOS chairman and CEO SJ Cheng

ChipMOS to enjoy mid-to-high single digit sales growth in 3Q13

Oct 1, 22:08

IC backend services company ChipMOS Technologies is expected to see its revenues grow by a mid-to-high single digit rate in the third quarter of 2013 buoyed by strong demand from...

ChipMOS and Thailin land backend orders for fingerprint sensors, says report

Newswatch - Sep 3, 12:16

Packaging and testing company ChipMOS Technologies and its subsidiary Thailin Semiconductor, which provides testing services for memory ICs, logic ICs and mixed-signal ICs, have teamed...

ChipMOS to expand capacity for LCD driver ICs, says chairman

Jun 24, 15:52

Packaging and testing firm ChipMOS Technologies plans to expand 12-inch wafer bumping and testing capacity for LCD driver ICs, according to company chairman and CEO SJ Cheng. Overall...

Demand for large-size driver ICs to boom in 2H13, say backend firms

May 21, 14:47

Packaging and testing firms Chipbond Technology and ChipMOS Technologies both expect orders for large-size LCD driver ICs to pull in during the second half of 2013 on booming demand...

ChipMOS capex for 2013 to reach NT$2.5-2.8 billion

May 20, 16:23

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, expects its capex for 2013 to total NT$2.5-2.8 billion (US$83.6-93.6 million)...

chipmos chairman SJ Cheng

ChipMOS subsidiary begins trading on Taiwan emerging stock board

Apr 22, 15:39

ChipMOS Taiwan, a subsidiary of semiconductor assembly and test services provider ChipMOS Technologies, on April 19 started trading on the Emerging Stock Board of the Taiwan Stock...

ChipMOS sees orders for NAND flash, driver ICs pick up

Apr 18, 21:18

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, has seen orders for NAND flash memory and small-size panel driver ICs pick...

ChipMOS subsidiary approved for listing on Taiwan stock market

Apr 16, 13:52

The Taiwan Stock Exchange (TSE) has approved the listing application of ChipMOS Taiwan, a subsidiary of semiconductor assembly and test services provider ChipMOS Technologies.

Himax reportedly lands LCoS solution orders for Google Glass

Mar 7, 14:39

Himax Technologies reportedly has landed orders for LCoS (liquid crystal on silicon) solutions from Google for its Google Glass devices, and shipments of LCoS solutions are expected...

Chipbond, ChipMOS 2013 capex to stay flat

Jan 22, 19:58

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies will have their capex for 2013 stay unchanged at the prior year's level.

ChipMOS to focus 2013 capex on LCD driver IC testing capacity

Dec 24, 09:49

Taiwan-based IC packaging/testing service provider ChipMOS Technologies plans to set aside NT$2.2-2.5 billion (US$75.5-85.8 million) for its 2013 capex budget and use 50% of the amount...

ChipMOS announces new share buyback program

Aug 21, 13:58

ChipMOS Technologies has announced plans to effect a new US$10 million share repurchase program in compliance with Rule 10b5-1 and Rule 10b-18 under the Securities Exchange Act of...

ChipMOS expects 4-8% growth in 3Q12 sales

Aug 20, 15:46

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs and memory chips, expects to post sales growth of 4-8% sequentially in the third quarter of...

Thailin 2Q12 sales up 18%

Jul 6, 01:45

Orders from Japan-based AKM Semiconductor have boosted sales at Thailin Semiconductor, which saw a 17.7% sequential increase in the second quarter of 2012.

Most backend firms give positive 3Q12 outlook

Jul 4, 01:25

With shipments from upstream chipmakers rising, most Taiwan-based packaging and testing houses are expected to post sequential growth in third-quarter sales.

Spansion, ChipMOS extend partnership

Jun 26, 01:55

Packaging and testing firm ChipMOS Technologies (Bermuda) has announced that subsidiary ChipMOS Taiwan and Spansion have extended their ongoing agreement through April 2014.

Chipbond, ChipMOS 2Q12 sales to grow 10%

Jun 25, 15:45

Second-quarter sales at Chipbond Technology and ChipMOS Technologies, two major driver IC packaging and testing houses, are set to register 10% sequential growth driven by brisk demand...

ChipMOS expects sales growth in 2Q12

May 29, 01:30

LCD driver IC packaging and testing firm ChipMOS Technologies expect second-quarter sales to increase 7-12% sequentially with gross margin up about 0.8pp to 7%, thanks to a pick-up...

Chipbond, ChipMOS 2Q12 sales expected to grow

May 7, 15:41

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales register single-digit growth sequentially thanks...

Rising demand for small-size driver ICs to boost revenues for Chipbond, ChipMOS

Apr 17, 14:55

LCD driver IC packaging and testing firms Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales rise driven by growing demand for small-size...

ChipMOS expanding LCD driver IC packaging/testing capacity

Apr 16, 11:31

ChipMOS Technologies, A Taiwan-based provider of IC packaging and testing services, is expanding its 12-inch-wafer gold bumping capacity for packaging and testing LCD driver ICs,...

Chipbond, ChipMOS see sequential growth in March revenues

Apr 11, 01:25

LCD driver IC packaging and testing service providers Chipbond Technology reported March revenues of NT$1.172 billion (US$39.7 million), an increase of 7.8% on month. The firm reported...

SPIL

ChipMOS expects sales growth in 2012

Mar 19, 16:15

Packaging and testing firm ChipMOS Technologies has forecast consolidated revenues for 2012 will increase 10%. The company revealed that net revenues on a US GAAP basis for 2011 grew...

ChipMOS looks to higher capex in 2012

Jan 10, 15:32

ChipMOS Technology has set aside a capital expenditure budget of US$85 million for 2012, an increase of 10.4% from 2011.

Chipbond, ChipMOS develop alternative to gold bumping

Jan 3, 11:53

Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...

ChipMOS aims at 10-15% revenue growth in 2012

Jan 2, 11:36

Packaging and testing firm ChipMOS Technologies expects its revenues to increase 10-15% to top US$690 million in 2012, thanks to a pick-up in orders for panel-use driver ICs and new...

Rohm reportedly places backend orders with Taiwan firms

Dec 29, 15:02

Rohm has released orders to ChipMOS Technologies and other Taiwan-based mid-scale packaging and testing firms over the last two months to avoid supply-chain disruptions caused by...

AKM to outsource more backend processing, says president

Nov 24, 15:52

Japan-based Asahi Kasei Microdevices (AKM), a supplier of mixed-signal ICs for consumer, automotive and communications applications, is looking to raise its backend orders to partners...

AKM president Hideki Kobori

ChipMOS to expand logic IC business

Nov 24, 01:05

Packaging and testing firm ChipMOS Technologies has revealed plans to place a greater emphasis on logic chips, expecting sales ratio for the segment to expand to 20-25% within the...

ChipMOS chairman and CEO SJ Cheng

Chipbond responds to reports of price reductions

Stockwatch - Oct 4, 13:58

Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, has issued a filing with the Taiwan Stock Exchange (TSE) declining to comment on media reports...

ChipMOS reiterates 3Q11 outlook

Sep 19, 15:16

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs, has said that its sales guidance for the third quarter of 2011 should remain on track.

SEMICON Taiwan 2011: Companies announce job openings

Sep 8, 01:40

A number of Taiwan-based semiconductor companies including foundries Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC), memory chipmakers...

More firms reducing exposure in DRAM packaging and testing market

Aug 22, 12:00

The growing supply-demand imbalance in the PC DRAM market has discouraged packaging and testing firms from paying attention to the segment, with some looking to completely phase out...

ChipMOS expects weak 3Q11

Aug 19, 16:17

LCD driver IC packaging and testing house ChipMOS Technologies expects revenues to stay flat or decrease by single digits sequentially in the third quarter of 2011. Gross margin on...

119 items [2/4]
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