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News tagged ChipMOS
  • Last update: Thursday 11 December 2014 [99 news items]

Rising demand for small-size driver ICs to boost revenues for Chipbond, ChipMOS

Apr 17, 14:55

LCD driver IC packaging and testing firms Chipbond Technology and ChipMOS Technologies are expected to see their second-quarter sales rise driven by growing demand for small-size...

ChipMOS expanding LCD driver IC packaging/testing capacity

Apr 16, 11:31

ChipMOS Technologies, A Taiwan-based provider of IC packaging and testing services, is expanding its 12-inch-wafer gold bumping capacity for packaging and testing LCD driver ICs,...

Chipbond, ChipMOS see sequential growth in March revenues

Apr 11, 01:25

LCD driver IC packaging and testing service providers Chipbond Technology reported March revenues of NT$1.172 billion (US$39.7 million), an increase of 7.8% on month. The firm reported...

SPIL

ChipMOS expects sales growth in 2012

Mar 19, 16:15

Packaging and testing firm ChipMOS Technologies has forecast consolidated revenues for 2012 will increase 10%. The company revealed that net revenues on a US GAAP basis for 2011 grew...

ChipMOS looks to higher capex in 2012

Jan 10, 15:32

ChipMOS Technology has set aside a capital expenditure budget of US$85 million for 2012, an increase of 10.4% from 2011.

Chipbond, ChipMOS develop alternative to gold bumping

Jan 3, 11:53

Chipbond Technology and ChipMOS Technologies have both adopted Cu/Ni/Au bumps for LCD driver IC packaging to significantly reduce gold use, according to the companies. The method...

ChipMOS aims at 10-15% revenue growth in 2012

Jan 2, 11:36

Packaging and testing firm ChipMOS Technologies expects its revenues to increase 10-15% to top US$690 million in 2012, thanks to a pick-up in orders for panel-use driver ICs and new...

Rohm reportedly places backend orders with Taiwan firms

Dec 29, 15:02

Rohm has released orders to ChipMOS Technologies and other Taiwan-based mid-scale packaging and testing firms over the last two months to avoid supply-chain disruptions caused by...

AKM to outsource more backend processing, says president

Nov 24, 15:52

Japan-based Asahi Kasei Microdevices (AKM), a supplier of mixed-signal ICs for consumer, automotive and communications applications, is looking to raise its backend orders to partners...

AKM president Hideki Kobori

ChipMOS to expand logic IC business

Nov 24, 01:05

Packaging and testing firm ChipMOS Technologies has revealed plans to place a greater emphasis on logic chips, expecting sales ratio for the segment to expand to 20-25% within the...

ChipMOS chairman and CEO SJ Cheng

Chipbond responds to reports of price reductions

Stockwatch - Oct 4, 13:58

Chipbond Technology, a major Taiwan-based LCD driver IC packaging and testing house, has issued a filing with the Taiwan Stock Exchange (TSE) declining to comment on media reports...

ChipMOS reiterates 3Q11 outlook

Sep 19, 15:16

ChipMOS Technologies, which specializes in assembly and test services for LCD driver ICs, has said that its sales guidance for the third quarter of 2011 should remain on track.

SEMICON Taiwan 2011: Companies announce job openings

Sep 8, 01:40

A number of Taiwan-based semiconductor companies including foundries Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC), memory chipmakers...

More firms reducing exposure in DRAM packaging and testing market

Aug 22, 12:00

The growing supply-demand imbalance in the PC DRAM market has discouraged packaging and testing firms from paying attention to the segment, with some looking to completely phase out...

ChipMOS expects weak 3Q11

Aug 19, 16:17

LCD driver IC packaging and testing house ChipMOS Technologies expects revenues to stay flat or decrease by single digits sequentially in the third quarter of 2011. Gross margin on...

Chipbond, ChipMOS expect flat revenues in 3Q11

Jul 26, 15:37

LCD driver IC packaging and testing houses Chipbond Technology and ChipMOS Technologies, in view of stagnant demand for LCD panels, expect their revenues for the third quarter of...

ChipMOS mulls phasing out DRAM backend business

Jul 15, 01:10

Packaging and testing house ChipMOS Technologies plans to gradually phase out its DRAM packaging and testing business, and concentrate on backend services for LCD driver ICs and flash...

ChipMOS secures NT$8.4 billion syndicated loan

Jul 14, 14:08

IC packaging and testing house ChipMOS Technologies has signed an NT$8.4 billion (US$291 million) syndicated loan agreement with a banking consortium mostly to repay part of its previous...

IC testing firm Thailin to control packaging house ChipMOS Shanghai

Apr 25, 15:58

IC testing house Thailin Semiconductor will spend US$39.95 million to take up the control of ChipMOS Technologies (Shanghai) through the purchase of Modern Mind Technology, which...

ChipMOS reports growth in 1Q11 revenues

Apr 19, 16:52

IC packaging and testing firm ChipMOS Technologies (Bermuda) has reported NT$1.57 billion (US$53.3 million) in March 2011 revenues, up 15.7% sequentially and 20.9% on year. Revenues...

ChipMOS to sell idle, non-core assets for US$11.6 million

Feb 24, 16:32

Packaging and testing house ChipMOS Technologies (Bermuda) has announced that subsidiary ChipMOS Taiwan will receive approximately US$11.6 million in the sale of its idle, non-core...

ChipMOS posts profitable 3Q10

Nov 17, 01:30

IC packaging house ChipMOS Technologies has reported NT$4.717 billion (US$155.908 million) in revenues for the third quarter of 2010, up 4.9% sequentially on sales of Mask ROM and...

Taiwan-based LCD driver IC designers to adopt 12-inch processes soon

Nov 12, 01:25

LCD driver IC design houses will transition into 12-inch processes at the end of 2010 to the first quarter of 2011. Chipbond Technology is currently the only backend chip packager...

ChipMOS to expand into 12-inch gold bumping

Oct 5, 14:14

Packaging and testing house ChipMOS Technologies (Bermuda) has revealed plans to add a new, 12-inch gold bumping production line in Taiwan with the installation set to complete by...

ChipMOS to collect another US$68 million through selling Spansion debt

Oct 5, 01:55

ChipMOS Technologies has revealed it will receive a total of US$68 million in cash this week, through selling its unproductive accounts receivable from Spansion to Citigroup. The...

ChipMOS posts profits in two consecutive quarters

Aug 20, 14:12

ChipMOS Technologies has reported net profits of NT$207.5 million (US$6.5 million) for the second quarter of 2010, the second straight quarter in which the company gained profits...

ChipMOS swings to profits in 1Q10; expects on-quarter revenue growth in 2Q

May 19, 16:43

ChipMOS Technologies has reported consolidated net profits of NT$271.2 million (US$8.6 million) on a US GAAP basis for the first quarter of 2010, following net losses over the past...

ChipMOS reports 1Q10 revenues up on quarter, meets guidance

Apr 23, 16:00

Packaging and testing service provider ChipMOS Technologies has announced consolidated revenues for the first quarter of 2010 grew 2.3% sequentially to NT$3.67 billion (US$115.7 million),...

Prices for LCD driver IC backend services to rise in 2Q10

Apr 2, 15:56

LCD driver IC packaging and testing house Chipbond Technology is integrating the different quotes offered by it and International Semiconductor Technology (IST) before their merger,...

ChipMOS expects strong 1Q10

Mar 19, 16:19

ChipMOS Technologies expects its revenues for the first quarter of 2010 to stay flat or increase by a single-digit percentage from the fourth quarter of 2009 thanks to increasing...

TSMC, UMC wafer production in southern Taiwan affected by quake

Mar 5, 10:21

Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) have both disclosed the impact of a 6.4-magnitude earthquake that hit southern Taiwan...

SPIL to drop out from LCD driver IC, DRAM segments; sell related equipment to ChipMOS

Mar 1, 11:39

Siliconware Precision Industries (SPIL) has announced that it will take a 15.8% stake in ChipMOS Technologies in exchange for all of its of LCD driver IC packaging and testing equipment...

ChipMOS likely to turn profitable in 1Q10

Feb 23, 11:54

The sale of ChipMOS Technologies' accounts receivable from Spansion may allow the packaging and testing house to return to profits in the first quarter of 2010, according to industry...

ChipMOS to sell Spansion debts to Citigroup

Jan 15, 15:35

ChipMOS Technologies has announced it reached a definitive agreement with Citigroup, under which the memory packaging and testing company will sell the debts it holds in Spansion...

IC packaging and testing companies feeling relief after Tessera lost in lawsuit against DRAM makers

Dec 31, 15:58

Taiwan-based IC packaging and testing companies, along with DRAM chip vendors, have felt a sense of relief after the US International Trade Commission (ITC) issued a final determination...

99 items [2/3]
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