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News tagged capacity
  • Last update: Thursday 23 November 2017 [1788 news items]

Talks to sell Toshiba Memory continue; announces new products

Jun 30, 11:01

Toshiba has disclosed the company continues to negotiate the sale of its memory chip business, Toshiba Memory, with Innovation Network of Japan, Bain Capital Private Equity and Development...

MediaTek unveils NB-IoT SoC, partnership with China Mobile

Jun 29, 15:04

MediaTek has unveiled its first narrow band Internet of Things (NB-IoT) system-on-chip (SoC), the MT2625, and announced a collaboration with China Mobile to build what the companies...

Powerchip eyeing orders from Illumina

Jun 29, 14:57

Powerchip Technology is looking to become the second foundry partner of Illumina following Taiwan Semiconductor Manufacturing Company (TSMC), according to industry sources.

Powerchip opens JV fab in China

Jun 28, 22:11

Powerchip Technology has completed the construction of its 12-inch fab in Hefei, China and started to run the fab, according to the Taiwan-based foundry chipmaker. The fab...

ASE expects to outgrow global logic IC industry in 2017, says COO

Jun 28, 15:27

Advanced Semiconductor Engineering (ASE), the world’s largest outsourced semiconductor assembly and test (OSAT) company, will see its 2017 sales growth outperform the global...

ASE expects to post sequential revenue growth through 4Q17

Intel intros 64-layer, 3D NAND SSD

Jun 28, 14:24

Intel has announced the delivery of what the company claims is the world’s first commercially available 64-layer, TLC 3D NAND SSD.

Intel 64-layer, 3D NAND SSD

China Big Fund commits investment of CNY85 billion

Jun 27, 15:43

China's National Semiconductor Industry Investment Fund (known as the Big Fund) has committed to invest CNY85 billion (US$12.4 billion) into the local IC industry, mainly the manufacturing...

DRAM ASPs to rise 5% sequentially in 3Q17, says DRAMeXchange

Jun 27, 14:57

The ASP of DRAM chips is forecast to rise 5% sequentially in the third quarter of 2017, as supply remains tight, according to DRAMeXchange.

Episil planning to raise epi-wafer prices

Jun 26, 13:56

Taiwan-based Episil, which makes silicon epitaxial wafers as well as providing foundry services at its 5- and 6-inch wafer fabs, plans to revise upward its epi-wafer prices to reflect...

Solartech Energy to expand PERC solar cell capacity

Jun 23, 10:42

Crystalline silicon solar cell maker Solartech Energy will expand PERC cell production capacity through adding two production lines to total six beginning August 2017, with the additional...

Solartech chairman

NOR flash prices to rise 20% in 3Q17, says DRAMeXchange

Jun 22, 16:11

Increasing demand for AMOLED panels from brand-name smartphone vendors and the industry's rising output for TDDI (touch with display driver) solutions have propelled the NOR flash...

Global industrial semiconductor revenues rise 4% in 2016, says IHS

Jun 22, 15:53

Worldwide industrial semiconductor revenues grew 3.8% on year to US$43.5 billion in 2016, according to IHS Markit.

Thinking to expand business in car electronics market

Jun 21, 19:20

Circuit protection device specialist Thinking Electronic Industrial is looking to grow sales generated from the car electronics sector to 10% of company revenues in 2017, according...

GlobalWafers teaming up with Ferrotec to expand 8-inch wafer supply

Jun 20, 15:15

Taiwan-based GlobalWafers is teaming up with Ferrotec to ramp up new 8-inch wafer capacity, according to company chairperson Doris Hsu.

GlobalWafers chairperson Doris Hsu

Lite-On Semi seeing GPP diode orders ramp up

Jun 20, 14:13

Lite-On Semiconductor has seen orders of GPP (glass passivated package) bridge rectifiers surge 50-60% sequentially in the second quarter of 2017, according to company president David...

Lite-On Semi president

China January-May PV installation capacity estimated at 11.08GWp

Jun 20, 11:21

The total installation capacity for additional ground-mounted PV power stations and distributed PV systems completed and on grids around China during January-May 2017 is estimated...

SAS subsidiary in Germany sees full PV module capacity utilization

Jun 20, 11:17

Germany-based PV module maker Aleo Solar GmbH, a wholly-owned subsidiary of solar wafer maker Sino-American Silicon Products (SAS), has seen utilization of annual production capacity...

sas

Global Unichip rolls out HBM2 total solution

Jun 19, 19:38

Global Unichip has successful taped out a 16nm, second-generation high bandwidth memory (HBM) PHY and controller with verified interposer design and CoWoS package. The ultra-high...

China market: Camera module makers relentlessly ramping capacity

Jun 19, 13:40

China-based camera module makers have continued to ramp up their capacity to cope with increasing demand from local smartphone vendors, including Huawei, Oppo, Vivo, Xiaomi and Lenovo,...

NSP fully utilizing PERC monocrystalline solar cell capacity

Jun 16, 10:48

Neo Solar Power has fully utilized its annual capacity of 600MWp for PERC monocrystalline silicon solar cells due to strong demand for high-efficiency solar cells, according to company...

Neo Solar Power chairman Sam Hong

Taiwan aims to increase wind power-generating capacity by 652MW during 2017-2020

Jun 14, 20:35

Taiwan's Ministry of Economic Affairs (MOEA) has come up with a 4-year (2017-2020) wind power generation plan aiming to increase cumulative wind power-generating capacity from 682MW...

wind power

Winbond to expand 12-inch fab capacity

Jun 14, 20:27

Winbond Electronics plans to expand its 12-inch fab capacity to 48,000 wafers per month by the end of 2017 from the current 44,000 units, according to the memory maker. The monthly...

winbond

Quanta Storage to expand production capacity

Jun 14, 13:50

Quanta Storage, which makes collaborative robots for sale under own brand Techman, will expand production capacity in June by moving to its new plants with larger space. At the same...

Ho Shih-chih, Quanta Storage president

TSEC expanding PERC solar cell capacity

Jun 14, 12:09

Solar cell maker TSEC is expanding production capacity for PERC models at its factory in northern Taiwan, with annual capacity to increase from 450MWp at present to 850MWp in August...

TSEC chairman Ellick Liao

Intel sees fierce competition in manufacturing process

Jun 13, 13:49

Intel is confident about chips made on its 14nm process, but is lagging behind competitors on the 10nm node. Its 10nm Cannonlake processors will not become available until the second...

Quanta, Wiwynn to expand server capacity as orders increase

Jun 12, 21:08

Quanta Computer and Wiwynn, a server affiliate of Wistron, are expected to see server shipments increase in the second half of 2017, thanks to rising demand for big data generated...

Packaging can extend physical limits of semiconductors, says TSMC chair

Jun 12, 15:41

Moore's Law will reach its physical limits in 8-10 years, but the development of advanced packaging technology will help extend innovations, according to Morris Chang, chairman of...

TSMC chairman Morris Chang

Samsung Display to supply up to 80 million AMOLED panels for new iPhone in 2H17

Jun 9, 12:34

Apple's upstream supply chain has begun mass producing components for the vendor's three next-generation iPhones: a 4.7-inch model and a 5.5-inch model both featuring reinforced glass...

More non-IC design houses to seek advanced capacity at foundry houses

Jun 8, 15:49

More patrons other than IC-design houses and IDMs are likely to flock to wafer foundry houses looking for advanced capacity for emerging applications such IoT, Big Data, self-driving...

Gigastorage running at full ingot growing capacity

Jun 8, 14:15

Solar-grade polycrystalline silicon wafer maker Gigastorage has fully utilized production capacity for polycrystalline silicon ingot growing and about 70% ingots are from export or...

Inductor makers Chilisin, Mag.Layers see May revenues increase

Jun 7, 14:48

Taiwan-based Chilisin Electronics and Mag.Layers Scientific-Industrial, which manufacture inductors and power chokes, have reported on-year revenue increases for May 2017 of 7% and...

NAND flash contract prices rise 20-25% in 1Q17, says DRAMeXchange

Jun 2, 15:13

The NAND Flash market remained tight in the first quarter of 2017 as it had been in the preceding quarter, according to DRAMeXchange. Despite seasonality, average contract prices...

Sony gives priority to Apple, China-based vendors for CIS capacity

Jun 1, 15:24

Sony has given priority to Apple, and China-based Huawei, Oppo and Vivo for CMOS image sensor (CIS) capacity, according to industry sources.

TSMC to start equipment move-in at Nanjing plant in September

May 30, 15:51

Taiwan Semiconductor Manufacturing Company's (TSMC) new 12-inch plant in Nanjing, China will be ready for equipment move-in in September 2017, according to the Taiwan-based foundry...

TSMC installed capacity for 2017 to rise 10%

Everlight expanding LED packaging capacity

May 25, 15:40

LED packaging service provider Everlight Electronics is expanding its packaging capacity from 4.5 billion LED chips to 5.5 billion units a month, with the additional capacity to be...

1788 items [5/52]
  • Micron+32GB+NVDIMM%2DN

    Micron 32GB NVDIMM-N

    Micron Technology's new 32GB NVDIMM-N offers twice the capacity of existing NVDIMMs, providing system designers with new flexibility to work with larger data sets in fast persistent...

    Photo: Company, Nov 14.

  • Samsung+PM1633a+SSD

    Samsung PM1633a SSD

    Samsung Electronics has announced the PM1633a, a 15.36 terabyte (TB) drive. First revealed at the 2015 Flash Memory Summit in August, the 15.36TB SSD is based on a 12Gb/s Serial...

    Photo: Company, Mar 14.

  • Samsung+PRO+Plus+128GB+microSD+cards

    Samsung PRO Plus 128GB microSD cards

    Samsung Electronics has unveiled its PRO Plus 128GB microSD card series, which is built with company's MLC NAND flash solution. With the introduction of its new 128GB microSD card,...

    Photo: Company, Dec 23.

  • Samsung+128GB+TSV+DDR4+RDIMM

    Samsung 128GB TSV DDR4 RDIMM

    Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules...

    Photo: Company, Dec 9.

  • Samsung+12Gb+LPDDR4+DRAM

    Samsung 12Gb LPDDR4 DRAM

    Samsung Electronics has announced that it is mass producing 12Gb LPDDR4 (low power, double data rate 4) mobile DRAM chips based on its 20nm process technology. The new LPDDR4 is...

    Photo: Company, Sep 18.

Global notebook shipment forecast, 2017 and beyond
Global AP demand forecast, 2017-2020

23-Nov-2017 markets closed

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Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.